JPS61207037U - - Google Patents
Info
- Publication number
- JPS61207037U JPS61207037U JP9325285U JP9325285U JPS61207037U JP S61207037 U JPS61207037 U JP S61207037U JP 9325285 U JP9325285 U JP 9325285U JP 9325285 U JP9325285 U JP 9325285U JP S61207037 U JPS61207037 U JP S61207037U
- Authority
- JP
- Japan
- Prior art keywords
- fin portion
- heat dissipating
- dissipating fin
- primary
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9325285U JPS61207037U (no) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9325285U JPS61207037U (no) | 1985-06-18 | 1985-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207037U true JPS61207037U (no) | 1986-12-27 |
Family
ID=30650764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9325285U Pending JPS61207037U (no) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207037U (no) |
-
1985
- 1985-06-18 JP JP9325285U patent/JPS61207037U/ja active Pending