JPS61205198U - - Google Patents

Info

Publication number
JPS61205198U
JPS61205198U JP1986073097U JP7309786U JPS61205198U JP S61205198 U JPS61205198 U JP S61205198U JP 1986073097 U JP1986073097 U JP 1986073097U JP 7309786 U JP7309786 U JP 7309786U JP S61205198 U JPS61205198 U JP S61205198U
Authority
JP
Japan
Prior art keywords
heat generating
elements
generating elements
connections
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986073097U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986073097U priority Critical patent/JPS61205198U/ja
Publication of JPS61205198U publication Critical patent/JPS61205198U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1986073097U 1986-05-15 1986-05-15 Pending JPS61205198U (tr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986073097U JPS61205198U (tr) 1986-05-15 1986-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986073097U JPS61205198U (tr) 1986-05-15 1986-05-15

Publications (1)

Publication Number Publication Date
JPS61205198U true JPS61205198U (tr) 1986-12-24

Family

ID=30612139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986073097U Pending JPS61205198U (tr) 1986-05-15 1986-05-15

Country Status (1)

Country Link
JP (1) JPS61205198U (tr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827649U (tr) * 1971-08-04 1973-04-03
JPS5123468B1 (tr) * 1970-04-03 1976-07-16

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123468B1 (tr) * 1970-04-03 1976-07-16
JPS4827649U (tr) * 1971-08-04 1973-04-03

Similar Documents

Publication Publication Date Title
JPH0183331U (tr)
JPS61205198U (tr)
JPH0187547U (tr)
JPS6013737U (ja) 半導体集積回路装置
JPS61205145U (tr)
JPH0268452U (tr)
JPS60119752U (ja) 集積回路パツケ−ジ
JPS58107844U (ja) サ−マルヘツド
JPH0265349U (tr)
JPH02129734U (tr)
JPS6349260U (tr)
JPH01176946U (tr)
JPS63164239U (tr)
JPH0270459U (tr)
JPS6273551U (tr)
JPS63149546U (tr)
JPS6413144U (tr)
JPS6230341U (tr)
JPH0211333U (tr)
JPS6130252U (ja) 半導体装置
JPS62204327U (tr)
JPS6138947U (ja) 半導体の回路基板構造
JPS61102039U (tr)
JPS5842940U (ja) 混成集積回路装置
JPS61102050U (tr)