JPS61203644A - Manufacture of electronic component parts - Google Patents

Abstract

PURPOSE:To improve working efficiency and prevent adverse effect on electronics elements due to generated heat by filling a case with an epoxy resin substance of cationic polymer type which is hardened when irradiated with ultraviolet ray and irradiating with said ultraviolet ray and by inserting electronic part into the case under the condition that said epoxy resin substance which is hardened when irradiated with ultraviolet ray in order to harden such resin substance. CONSTITUTION:A case 1 is filled with an epoxy resin substance 2 which is hardened when irradiated with the ultraviolet ray and such resin substance 2 is irradiated with the ultraviolet ray 3. When an electronics element 4 is inserted into the resin substance 2 when it is not yet hardened, the resin substance 2 is perfectly hardened including the shadowed part of electronics element 4. Thereby, the electronic element 4 is fixed and sealed within the case 1. The epoxy resin substance 2 which is hardened when irradiated with ultraviolet ray has the composition that various organic silicon compounds are mixed in the predetermined amounts to 100pts.wt. of epoxy resin consisting of 60pts.wt. of epitaxial coats 828 and 40pts.wt. of bakelite ERL-4206. Moreover, the cationic polymer catalyst of 0.4pts.wt. is added and all materials are mixed and adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing electronic components such as ICs, LSIs, and tantalum capacitors.

[Conventional technology and its problems]

The above-mentioned electronic components have their electronic elements enclosed in a case, but if an adhesive or the like is used for this encapsulation, it takes time to harden and the workability is poor, and if thermoplastic or thermosetting resin is used. The heat applied during curing, the heat generated during the curing reaction, etc. have an adverse effect on electronic devices, which is undesirable. On the other hand, ultraviolet curable resin compositions do not have the above-mentioned drawbacks and have good workability, but conventional ultraviolet curable resin compositions require continuous irradiation with ultraviolet rays until curing is completed.
Therefore, the parts that will be in the shadow of the electronic elements cannot be continuously irradiated with ultraviolet rays, so they cannot be cured.
I didn't like it. For example, acrylic ultraviolet curable resins and one-component epoxy resins have been conventionally used. With ultraviolet curing systems, parts that are in the shadow of electronic elements and cannot be irradiated with ultraviolet rays will not be cured, so heat curing is also used. For example, TB30
Taking 13C (Note 1) as an example, if it is filled into a case with a depth of 101 mm, it will need to be irradiated with ultraviolet light (Note 2) for 30 seconds and then heat cured at 120℃ for 5 minutes or at 80℃ for 15 minutes. shall be.

On the other hand, I WIL epoxy resin 1 such as LGX-910
-1 (Note 3): 15 minutes at 120℃ or 30 minutes at 90℃
Requires heat curing for several minutes.

Further, anaerobic UV-curable resins have a slow curing speed and have the disadvantage that incompletely cured portions may remain.

Further, the moisture-curable ultraviolet curable resin does not cure under moisture in a sealed state, and even if it cures, it takes a long time.

The present invention solves this problem by using a cationically polymerizable ultraviolet curable epoxy resin.

[Means for solving problems]

In the present invention, once the inside of the case of an electronic component is irradiated with ultraviolet rays, it is filled with an ultraviolet curable epoxy resin composition that automatically undergoes reaction through cationic polymerization and hardens naturally even without irradiation with ultraviolet rays. This resin composition is irradiated with ultraviolet rays, and then an electronic device is inserted into the case to allow the resin composition to harden naturally.

In the examples, the ultraviolet rays are applied after the resin composition is filled into the case, but the ultraviolet rays may be applied before or during the filling of the case.

[Function] Due to the propagation reactivity of the cationic polymerization system of the ultraviolet curable epoxy resin composition, once it is irradiated with ultraviolet rays, the reaction automatically proceeds through cationic polymerization even without irradiation with ultraviolet rays. It hardens naturally, and the shadowed parts of the electronic elements do not need to be continuously irradiated with ultraviolet rays (although they harden, allowing the electronic elements to be completely fixed and sealed within the case).

〔Example〕

A case 1 as shown in the first figure is filled with an ultraviolet curable epoxy resin composition 2 as shown in the second figure, and the resin composition 2 is irradiated with ultraviolet rays 3 as shown in the third figure. As shown in FIG. 4, when the electronic device 4 is inserted into the case 1 with the resin composition 2 in an uncured state, the resin composition 2
The electronic element 4 is completely cured, including the part that is in the shadow of the electronic element 4, and the electronic element 4 is firmly sealed inside the case l. Note that even after the electronic element 4 is inserted, curing can be accelerated by irradiating it with ultraviolet rays 3 as shown by the dotted line in Figure 4.

Due to the propagation reactivity of its cationic polymerization system, the UV-curable epoxy resin composition 2 automatically undergoes a reaction and is cured naturally even without UV irradiation once it is irradiated with UV rays. The specific composition is as follows.

Epicoat 828 (Oilized shell epoxy ■ Bisphenol A type epoxy resin) 60 parts by weight Bakelite ERL-4206 (Union carbide, cycloaliphatic epoxy resin)
・・・・・・・・・・・・・・・・・・Predetermined amounts of various organosilicon compounds shown in Table 1 are added and mixed to 100 parts by weight of an epoxy resin consisting of 40 parts by weight, and each of these 0.4 parts by weight of UVE-1014 (manufactured by General Electric Co., 50% solution of triarylsulfonium salt in propylene carbonate) as a cationic polymerization catalyst was added and mixed to each of the mixtures, and sample 1. 2. 3. This is an adjusted version of 4.

Table 1 More specifically, the epoxy resin used in the epoxy resin composition of the present invention includes conventionally known aromatic epoxy resins, alicyclic epoxy resins, and aliphatic epoxy resins.

Particularly preferred aromatic epoxy resins are:
Polyglycidyl ethers of polyhydric phenols having at least one aromatic nucleus or their alkylene oxide adducts, such as glycidyl ethers produced by the reaction of bisphenol A or its alkylene oxide adducts with epichlorohydrin, epoxy novolanc Examples include resin. Particularly preferable alicyclic epoxy resins include polyglycidyl ethers of polyhydric alcohols having at least one alicyclic ring, or compounds containing cyclohexene or cyclopentene rings, which are epoxidized with a suitable oxidizing agent such as hydrogen peroxide or acetic acid. There are cyclohexene oxide- or cyclopentene oxide-containing compounds obtained by this method. Typical examples of polyglycidyl ethers include glycidyl ethers produced by reacting hydrogenated bisphenol A or alkylene oxide adducts with epichlorohydrin. Furthermore, representative examples of cyclohexene oxide or cyclopentene oxide-containing compounds include those represented by the following formula.

Particularly preferable aliphatic epoxy resins include aliphatic polyhydric alcohols or polyglycidyl ethers of alkylene oxide adducts thereof; typical examples include diglycidyl ether of 1,4-butanediol and 1,6-hexane. diglycidyl ether of diol,
One or more aliphatic polyhydric alcohols such as triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, ethylene glycol, propylene glycol, and glycerin. Examples include polyglycidyl ethers of polyether polyols obtained by adding alkylene oxides (ethylene oxide, propylene oxide). These aromatic epoxy resins.

Among the alicyclic epoxy resins and aliphatic epoxy resins, some resins can be used alone in the present invention, but it is desirable to blend them appropriately depending on the desired properties.

The energy ray-sensitive sensitizer used in the present invention, which decomposes under energy ray irradiation and releases a catalyst having the effect of causing polymerization or crosslinking of the cationic polymerizable resin, is not particularly limited, but particularly preferred is irradiation. It is a group of double salts, which are onium salts that release Lewis acids capable of initiating polymerization. Such compounds basically have the general formula %
Formula %) [In the formula, the cation is onium, and Z is NUN.

S, Se, Te, P, As, Sb, Bi
, ,0. A rogens (e.g. I, Br, Cj
i, R1, R2, )+3. R4 is an organic group which may be the same or different. a, b, c.

d is an integer from O to 3, and a+b+C+d is Z
is equal to the valence of M is a metal or metalloid that is the central atom of the halide complex, and B
, P, As, Sb+ Fe+ Sn, Bi,
AIr Cat In.

Tt, Zn, So+v, Cr+Mn+Co
etc. X is a halogen, m is the net charge of the halide complex ion, and n is the number of halogen atoms in the halide complex ion. ].

Such catalyst precursors are known per se; for example, compounds in which Z is N2N are described in US Pat. Nos. 3,708,296, 3,949,143, and 3,794,576. Other onium catalyst precursors are described in Belgian Patent No. 828841, Belgian Patent No. 828669, French Patent No. 2270269, etc.

The diazonium compound described above is disclosed in the above-mentioned U.S. Pat.
It can be obtained by the method described in No. 96, No. 3949143, etc. Compounds where Z is S, Se, Te are J, A, C, S, of Knapozyk et al.
9yo, 145° (1969), A, L, Meyc
ook et al. J, Organic Chamistry
, 35, N18. 2532 (1970), Goeth
Bul, Soc, Chim, Be1g of als et al.
73. 546 (1964), H,M.

Leicoetar et al., J.A.C.S., 51
, 3587 (1929), etc. 2 is P, N.

Representative onium salts that are As, Sb, and Bi are J
, Goardefer's Methoden der
Organishen Chamie, 11/12゜5
91-640 (1958), 5asse 12
/1.79-112 (1963). Typical onium salts in which Z is halogen are O, A, Dokl, Ada of Pti tsyna et al.
d, Nauk, 5SSR, 163, 383 (1965
), M., Draxler et al., J.A.C.S.
75. 2705 (1953) and the like.

(Example 1) An electric element 4 of a tantalum capacitor was enclosed in an aluminum case 1 of 4.1φ×5 mm.

■Composition of the UV-curable epoxy resin 2 used: 100 parts by weight of Epikote 828 (N-plasticized shell epoxy ■Bisphenol A type epoxy tree B)・
KBM 202 2 parts by weight (Shin-Etsu Chemical Co., Ltd., diphenyldimethoxysilane)/UV E -
10140.2 parts by weight (General Electric Company,
50% solution of triarylsulnenium salt in bripyrene carbonate) / 50 parts by weight of quartz powder ■ Manufacturing process 1) Resin casting into aluminum case 2) Ultraviolet irradiation approximately 40"/cIaX 10 seconds (Lamp output 4 - high pressure) Mercury lamp. Energy amount measured by Ichioak Seisakusho's UV illuminance meter M-01 machine υv-25 sensor) 3) After inserting the capacitor, leave it at room temperature.

■Results When the case was canted after 60 minutes had passed, the resin had hardened uniformly, and a complete capacitor encapsulation part had been manufactured.

In addition, when considering mass production, after inserting the element, 10 to 30
It was found that this can be achieved by ultraviolet irradiation for seconds.

(Example 2) The same as Example 1 except that the case material is PBT.

■Composition of the UV-curable epoxy resin 2 used (Ebiko) 828 100 heavy-duty part (N-clarified shell epoxy ■Bisphenol A type epoxy jMMF
s＞・KBM 202 2 parts by weight (48
m Kagaku Kogyo, diphenyldimethoxysilane)・U
VE-10140, 1 part by weight (General Electric Co., triarylsurnenium salt pyrene carbonate 50%?8 liquid) ■Production process is the same as Example 1■Results After 5 minutes, a good sealed part was found. was gotten.

■Effects According to this method, epoxy resin cast electronic components can be obtained efficiently and without the need for a heating process (e.g., energy saving).

〔effect〕

As described above, according to the present invention, an electronic device can be firmly sealed in a case by using an ultraviolet curable resin composition and irradiating it once with ultraviolet rays, resulting in good workability and protection against damage to the electronic device due to heat. It is possible to prevent adverse effects.

[Brief explanation of drawings]

1 to 4 are explanatory diagrams sequentially showing the method of the present invention. 1...Case, 2...Ultraviolet curable resin composition, note 1 copy 2 area answer, 9th note Jun 92 Procedural amendment (voluntary) June 180, Showa ω 1. Incident Showa ω year Patent Application No. 045319 3, Person making the amendment Patent applicant address 1456 Hazama-cho, Hachioji-shi, Tokyo Name Three Bond Co., Ltd. 6 Contents of the amendment ” is inserted. [2] Delete "automatically" from line 4 on page 4 and line 4 on page 5.

Claims (1)

[Claims] A cationically polymerizable ultraviolet curable epoxy resin composition is filled into the case of an electronic component, and this resin composition is irradiated with ultraviolet rays, and then the ultraviolet curable epoxy resin composition is placed inside the case in an uncured state. A method of manufacturing an electronic component, which comprises inserting an electronic element and curing the resin composition.