JPS61203523U - - Google Patents
Info
- Publication number
- JPS61203523U JPS61203523U JP8853385U JP8853385U JPS61203523U JP S61203523 U JPS61203523 U JP S61203523U JP 8853385 U JP8853385 U JP 8853385U JP 8853385 U JP8853385 U JP 8853385U JP S61203523 U JPS61203523 U JP S61203523U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- casing
- housing
- metal plate
- cooling pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims 1
- 230000035515 penetration Effects 0.000 description 1
Landscapes
- Transformer Cooling (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8853385U JPS61203523U (sl) | 1985-06-12 | 1985-06-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8853385U JPS61203523U (sl) | 1985-06-12 | 1985-06-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61203523U true JPS61203523U (sl) | 1986-12-22 |
Family
ID=30641764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8853385U Pending JPS61203523U (sl) | 1985-06-12 | 1985-06-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61203523U (sl) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS593548U (ja) * | 1982-06-30 | 1984-01-11 | 富士通株式会社 | 半導体装置用パツケ−ジ |
-
1985
- 1985-06-12 JP JP8853385U patent/JPS61203523U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS593548U (ja) * | 1982-06-30 | 1984-01-11 | 富士通株式会社 | 半導体装置用パツケ−ジ |
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