JPS61203367A - Anti-electric packaging material and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] "Industrial Application Field" This invention is applicable to
The present invention relates to an illumination packaging material suitable for use as a packaging material for electronic parts and medical and sanitary materials where mold and fine teeth are a problem.

``Prior art 1'' Conventional electrically conductive packaging materials, such as packaging materials for electronic components, are made by depositing gold on a plastic film and extruding polyethylene for heat sealing onto the vapor-deposited layer side of the film. Films mainly made of plastic film are used, such as those made of plastic film.

"Problems to be Solved by the Invention" The conventional antistatic packaging materials mentioned above are mainly made of plastic film, so they are weak against piercing force.
It has the disadvantage of being easily torn. As mentioned above, the conductive material is completely sandwiched between the films, and there is no conductive portion on the surface, so it is difficult to obtain the desired antistatic performance. Furthermore, since the conductive layer is a vapor-deposited nickel layer that is close to the metal film and has high heat conductivity, when heat-sealing, heat conduction from the sealer to the packaging material is fast. It is difficult to do a clean sea A/ with heat sealing.
There is also the problem that heat sealing must be performed in two or three times at a somewhat lower temperature.

Furthermore, no matter how thin the deposited layer is, it has a mirror-like finish, resulting in poor transparency and difficulty in confirming the contents.

This invention has been made in view of the above circumstances, and provides an antistatic packaging material that does not easily tear due to piercing force, has high antistatic performance, is easy to heat seal, and is transparent, and a method for producing the same. The purpose is to

"Means for Solving Problems" The antistatic packaging material according to the present invention includes copper sulfate, 1M sulfide, paper-like material made of synthetic resin nonwoven fabric or natural fiber,
A conductive paper material impregnated with a copper compound such as cupric sulfide, or a conductive paper material to which the above-mentioned copper compound is fixed.
A thin paper-like material obtained from fibers.

A non-woven fabric (paper-like material) made of heat-meltable fat fibers is twisted together, and this laminated layer W is rolled with a heating roll'? : Through this, the above-mentioned thermofusible fat fibers are passed through, and the above-mentioned conductive paper-like fibers are passed through.
The film f is infiltrated and integrated into the cavity and surface of the snout.
iT- is in the form of a sheet.

[Effect]

As mentioned above, the electrically conductive packaging material of the present invention is a paper-like material made of synthetic resin or natural fiber. Since the base material is nonwoven fabric, it has durability against tearing blades, tensile forces, and outer blades such as stabbing knives.

Moreover, the heat-binding and fusible resin is in the form of fibers.

The molten resin easily penetrates into the processed surface of the conductive paper-like material and is integrated with the material, thereby ensuring airtightness in the packaging material.

Furthermore, for the same reason, conductive fibers are present both inside and on the surface, such as a single piece uniformly distributed in a heat-meltable fat layer in the form of a film or sheet. It has high conductivity, i.e., static electricity removal (
In addition, the steel components that provide electrical conductivity are uniformly distributed in the fibers in an impregnated or fixed state, and although they have high electrical conductivity, they also enhance heat transfer properties. Therefore, with this packaging material KX, it is easy to control the heat of heat sealing, and it is possible to seal neatly with one heat seal.

In addition, in paper-like materials for obtaining conductivity, evaluation [4 to 15 g/
(Thin is preferable.Therefore, there is a light space between each fiber, and the heat-molten resin that shines through this space is transparent, so it can be used as a packaging material to confirm the contents.) It is possible to obtain excellent optical transparency.

In addition, this packaging material has anti-freeze effect as mentioned above.
Due to the electrostatic charge, MIIJ attracts the dust that is the nest of mold, and like Shikamo Zhoupei, the copper alloy has antibacterial and antifungal properties, making it an excellent antibacterial and antifungal agent. It can exert its effect.

Furthermore, since this packaging material is made of fiber paper cut as a base material, it has a high degree of precipitation resistance. Water resistant.

In addition, in the antistatic packaging material of the present invention, since the paper-like material is made by a wet method (sheet-making), the length of the four-command fiber is preferably 7 to 30, and the aspect ratio is preferably 300 or more.
The compounding lid for the total weight of the packaging material of 1ζ conductive paper is 3~
15wt weight is desirable. That is, the aspect ratio is 30.
If the length is greater than or equal to 0 and less than or equal to 50, extremely fine and dense fibers will be required, resulting in an increase in cost.

This is because papermaking becomes difficult; on the other hand, if it is 30511 or higher, the dispersibility of fibers during papermaking becomes poor.

This is because it becomes difficult to JBfL a high-quality nonwoven fabric. 'I! 7: The reason why the aspect ratio is 2300 or more is because if the aspect ratio is 300 or less, *separation contact 'i! y degree decreases, and even if this nonwoven fabric is impregnated with a copper compound, the desired conductivity (Table 10)
Ω or less) cannot be obtained.

The reason why the amount of conductive paper is set at 3 to 15 wt is because if it is less than the awt ratio, the antistatic properties of the product will be less than the desired value.
This is because if it is more than t, the transparency of the product will decrease and it will become difficult to read the willow inside the package.

Examples of the present invention will be shown below.

"Example" iSx Resin Value First, acrylic fibers having lengths and aspect ratios shown in Table 1 were impregnated with CII steel. As the hot bath magnetic M fibers, a mixture of 50 low density polyethylene fibers and 50 polypropylene fibers was used. The above-mentioned dedicated 411 oily fibers and the above-mentioned thermofusible fibers are shown in Table 1. A conductive paper MJ and a heat-fusible paper were prepared by forming the paper to the following tsubo (g/m 2 ). These conductive paper-like materials and thermoplastic paper-like materials are combined together.

The heat-fusible fibers 121 are melted by heating rolls at 100 to 120'C, and then integrated with the conductive paper material.

Film-like packaging materials were obtained (Examples 1 to 6).

The weight of each packaging material obtained was g/met, paper thickness (IIll
The amount of conductive paper (wt), tensile strength ((K)
971.5 cm4), tear strength (g), folding resistance (teeth), surface specific electrical resistance (Ω), frictional charging voltage (v; relative humidity 4Q%) t, 1 (cotton cloth). Table 2.
As can be seen from Table 2.3, Examples 1 to 6 are good for Daifuku. It is possible to confirm the high performance of the uninvented antistatic packaging material as shown below:
.

In the above embodiment, the conductive paper material and the heat-fusible paper material were folded together and heated to integrate them one by one. However, depending on the application, one sheet of conductive paper 9J may be sandwiched between two sheets of heat-melting paper 7)+!-, and then integrated by heating, or may be made into a multi-layered structure.

"Young fruit of the invention" As explained above, the antistatic packaging material according to the invention is a thin paper-like material made of synthetic wood Bfl or natural fiber, plated with steel, etc. σ] A conductive paper-like material impregnated with a steel compound and a paper-like material made from heat-melted resin fibers are placed directly together, and this product m's is passed through a heating roll, whereby The heat-melting property 711 fiber is melted and integrated with the conductive paper material to form a film or sheet, so it does not easily tear with a stabbing knife, has high antistatic performance, and is easy to heat seal. Due to its transparency, it is ideal as a packaging material for steam appliances and parts where dust and static electricity are a problem, as well as medical and sanitary materials where mold and debris are a problem.

Claims (7)

[Claims] (1) A film or sheet-like heat-melt resin layer formed by melting a heat-melt resin fiber paper-like material, and a conductive fiber paper-like material layer mixed and integrated into this heat-melt resin layer. Antistatic packaging material consisting of. (2) The antistatic packaging material according to claim 1, wherein the conductive fibers have a length of 7 to 30 mm and an aspect ratio of 300 or more. (3) The antistatic packaging material according to claim 1 or 2, wherein the content of the conductive fiber is 3 to 15 wt%. (4) A paper-like material made of conductive fibers and a paper-like material made of hot-melt resin fibers are stacked together, and this laminate is passed between heated rolls at a temperature higher than the melting temperature of the heat-melt resin, and the A method for producing an antistatic packaging material, which comprises integrating a paper-like material made of conductive fibers and a hot-melt resin into a film or sheet. (5) The basis weight of the paper-like material made of conductive fibers is 4 to 15 g/
Claim 4 characterized in that m is used.
The method for producing the antistatic packaging material described in Section 1. (6) The method for producing an antistatic packaging material according to claim 4 or 5, wherein the conductive fibers have a length of 7 to 30 mm and an aspect ratio of 300 or more. (7) The method for producing an antistatic packaging material according to any one of claims 4 to 6, characterized in that the amount of conductive fibers is 3 to 15 wt%.