JPS6120169Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a building insulation board that is filled inside the walls, ceilings, and floors of buildings, particularly ordinary houses.

BACKGROUND ART In recent years, buildings have been insulated by filling the walls, ceilings, and floors of buildings with insulation materials.

Conventional insulation construction of this type has been carried out by using glass wool, polystyrene foam board, or hard urethane in the recess formed by the pillars or studs 5, 5' and the board edge 6, as shown in the example of wall construction in Figure 4, for example. It is constructed by filling the heat insulating material 9, which is pre-formed to a certain size, such as a foam board, and fixing it to the board edge 6 with nails 8, etc., or by clamping it with the inner wall board 11. Ta.

However, in this type of conventional construction method, the size of the insulation material 9 is a standard product and is constant, but the spacing between the studs 5 and 5' where it is to be filled and installed is not standardized. Moreover, the spacing between the respective studs 5, 5' is often different due to construction work that is not accurate. Therefore, in the past, as shown in FIG. 4, the width of the heat insulating material 9 and the spacing between the studs 5 and 5' rarely matched.
A gap 10 is created, which not only reduces the insulation effect but also causes dew condensation. In conventional insulation construction, in order to prevent this, the gap can be eliminated by filling the gap 10 with insulation material cut to size from another standard insulation material. However, it took a lot of time and effort to cut the standard insulation material, and the insulation material was lost.

The purpose of the present invention is to eliminate these drawbacks of conventional heat insulating materials, to provide a heat insulating board that completely fills the gaps between the studs and requires no effort in construction.

That is, the architectural heat insulating board of the present invention is a heat insulating board in which the front material 1 and the back material 3 are attached to the front and back surfaces of a hard heat insulating material 2, and both ends 7 in the width direction are formed in an inclined shape, A notch 4 having a depth that does not reach the back material is formed approximately at the center in the width direction.

The hard insulation material 2 is made of a hard synthetic resin foam such as hard urethane foam, polystyrene foam, epoxy foam, or phenol foam, high-density glass wool mat, or rock wool mat, which has enough hardness to maintain its plate shape by itself. be.

The surface material 1 and the back material 3 can be made of kraft paper, synthetic resin film such as polyethylene film, metal foil such as aluminum foil or iron foil, nonwoven fabric, etc., and are attached to the front and back surfaces of the heat insulating material 2. It serves the functions of reinforcing the insulation material 2, protecting its surface, and waterproofing it.

Both ends 7 in the width direction of the heat insulating plate to which the front surface material 1 and the back surface material 3 are attached are tapered.
As shown in FIG. 1, this inclined taper has a one-sided taper shape in which both end portions are inclined from the back side to the front side, but it is not necessarily limited to this example. It may have a tapered shape with both sides facing in opposite directions, or it may have a triangular shape a, a V-groove shape b, or a step-like shape c as shown in FIG. 5, which have substantially the same effect as an inclined taper. be. A cut 4 which does not reach the back material 3 through the surface material 1 and the heat insulating material 2 is formed approximately at the center in the width direction of the heat insulating board. The notch 4 is formed linearly in the longitudinal direction substantially at the center of the heat insulating plate, but is formed in the form of a slit-like groove or a V-shaped groove. The width of the insulation board is set to be slightly wider than the spacing between the studs to be filled.

In order to install the heat insulating board of the present invention in a building, to exemplify the installation on a wall, as shown in FIG. , 5' is inserted between the studs 5 and 5' by folding it back from the notch 4 part, and inserting it between the studs 5 and 5', and then folding the center part of the surface near the notch 4 downwards as shown in Figure 2b. When pressed, both ends 7 of the heat insulating board are pressed against the studs and compressed, and the heat insulating board is tightly packed between the studs 5 and 5'. However, in this case, due to the repulsive force of the heat insulating board, if left as is, the notch 4 would lift up, so it is fixed to the board edge 6 with a fixing device such as a nail 8. If the cut 4 is a V-shaped groove, insert the insulation board between the studs and press it downward as shown in Figure 3, and it will be fixed in the shape of the ship's bottom without returning to the top, due to the repulsive force of the insulation board. Therefore, since it is fixed as is, there is no need for fixing devices such as nails.

The architectural heat insulating board of the present invention has a notch in the center in the width direction, and the backing material is integrally connected, so it can be easily bent using the backing material in the notch as a fulcrum. It can be easily inserted between studs with a width slightly narrower than the width of the insulation board, and when the bent part is pressed down, the insulation board becomes a flat plate, and both ends of the insulation board are formed in an inclined shape. Since it is thin-walled, it is compressed by the studs and the ends of both ends are crushed, allowing it to be filled tightly between the studs.

As described above, the heat insulating board of the present invention can be filled between the studs without any gaps with a very simple operation, so the heat insulating performance is effectively utilized and no condensation occurs. Further, there is no waste of materials such as half-sample materials in the heat insulating board.

The architectural insulation board of the present invention can be applied not only inside walls as explained in the above embodiments, but also in the case of floors, between the joists, and in the case of ceilings, in the same way between the roof joists. It is extremely useful and convenient.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view in the width direction of the heat insulating board of the present invention, Fig. 2 is an explanatory drawing for installation, Fig. 3 is an explanatory drawing for another example, Fig. 4 is an explanatory drawing for installing a conventional heat insulating material, and Fig. 5 FIG. 2 is a diagram illustrating the shape of the end portion of the heat insulating plate. 1... Surface material, 2... Hard insulation material, 3... Back material, 4... Notch, 5... Stud, 6... Board edge.

Claims (1)

[Scope of utility model registration request] This is a heat insulating board in which a front material and a backing material are attached to the front and back surfaces of a hard insulating material, and both ends in the width direction are formed in an inclined shape, and there is a deep part in the center in the width direction that does not reach the backing material. A thermal insulation board for construction with grooves formed.