JPS61201218U - - Google Patents

Info

Publication number
JPS61201218U
JPS61201218U JP8539685U JP8539685U JPS61201218U JP S61201218 U JPS61201218 U JP S61201218U JP 8539685 U JP8539685 U JP 8539685U JP 8539685 U JP8539685 U JP 8539685U JP S61201218 U JPS61201218 U JP S61201218U
Authority
JP
Japan
Prior art keywords
thick film
board
sliding
wiring board
sliding switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8539685U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8539685U priority Critical patent/JPS61201218U/ja
Publication of JPS61201218U publication Critical patent/JPS61201218U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Slide Switches (AREA)
  • Contacts (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例になる摺動スイツチ用
厚膜配線板の断面図、第2図は摺動接触子の摺動
回数と累積シヨート比率との関係を示すグラフ、
第3図のaは本考案を説明するための従来の摺動
スイツチ用厚膜配線板の使用状態を示す平面図お
よびbはそのA―A′線断面図である。 符号の説明、1…セラミツク基板、2…厚膜導
体、3…電極、4…外部接続端子部、5…摺動接
触子、6…突起。
FIG. 1 is a cross-sectional view of a thick film wiring board for a sliding switch according to an embodiment of the present invention, and FIG. 2 is a graph showing the relationship between the number of sliding contacts and the cumulative shoot ratio.
FIG. 3A is a plan view showing a state in which a conventional thick film wiring board for a sliding switch is used to explain the present invention, and FIG. 3B is a cross-sectional view taken along the line A--A'. Explanation of symbols: 1... Ceramic substrate, 2... Thick film conductor, 3... Electrode, 4... External connection terminal portion, 5... Sliding contact, 6... Projection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の表面に厚膜導体を形成した摺動スイツチ
用厚膜配線基板において、基板に突起を形成し、
この突起上に摺動接触子が摺動する厚膜導体を形
成してなる摺動スイツチ用厚膜配線板。
In a thick film wiring board for a sliding switch in which a thick film conductor is formed on the surface of the board, protrusions are formed on the board,
A thick film wiring board for a sliding switch is formed by forming a thick film conductor on which a sliding contactor slides.
JP8539685U 1985-06-06 1985-06-06 Pending JPS61201218U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8539685U JPS61201218U (en) 1985-06-06 1985-06-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8539685U JPS61201218U (en) 1985-06-06 1985-06-06

Publications (1)

Publication Number Publication Date
JPS61201218U true JPS61201218U (en) 1986-12-17

Family

ID=30635755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8539685U Pending JPS61201218U (en) 1985-06-06 1985-06-06

Country Status (1)

Country Link
JP (1) JPS61201218U (en)

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