JPS61199042U - - Google Patents
Info
- Publication number
- JPS61199042U JPS61199042U JP1985082080U JP8208085U JPS61199042U JP S61199042 U JPS61199042 U JP S61199042U JP 1985082080 U JP1985082080 U JP 1985082080U JP 8208085 U JP8208085 U JP 8208085U JP S61199042 U JPS61199042 U JP S61199042U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pellet
- electrode
- face electrode
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082080U JPS61199042U (pt-PT) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082080U JPS61199042U (pt-PT) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61199042U true JPS61199042U (pt-PT) | 1986-12-12 |
Family
ID=30629474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082080U Pending JPS61199042U (pt-PT) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199042U (pt-PT) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013235948A (ja) * | 2012-05-09 | 2013-11-21 | Meidensha Corp | 半導体デバイス |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS559559B2 (pt-PT) * | 1974-06-21 | 1980-03-11 |
-
1985
- 1985-05-30 JP JP1985082080U patent/JPS61199042U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS559559B2 (pt-PT) * | 1974-06-21 | 1980-03-11 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013235948A (ja) * | 2012-05-09 | 2013-11-21 | Meidensha Corp | 半導体デバイス |