JPS61198741A - Ball bonding method and device thereof - Google Patents

Ball bonding method and device thereof

Info

Publication number
JPS61198741A
JPS61198741A JP60039632A JP3963285A JPS61198741A JP S61198741 A JPS61198741 A JP S61198741A JP 60039632 A JP60039632 A JP 60039632A JP 3963285 A JP3963285 A JP 3963285A JP S61198741 A JPS61198741 A JP S61198741A
Authority
JP
Japan
Prior art keywords
coil
wire
capillary
ball
pole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60039632A
Other languages
Japanese (ja)
Inventor
Keizo Sakurai
敬三 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60039632A priority Critical patent/JPS61198741A/en
Publication of JPS61198741A publication Critical patent/JPS61198741A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE:To obtain a ball having an excellent shape by forming the ball through spark discharge while heating a wire at the tip of a capillary in a noncontact manner by previously using high-frequency currents. CONSTITUTION:A positioning in a coil 4 of the tip of a wire 1 is detected, and a signal is outputted to a high-frequency current generating section 5 so that high-frequency currents are loaded to the coil 4 from a timing detecting control signal output section 6 on the basis of the detecting signal. Consequently, eddy currents are generated on the surface of the wire 1 by the electromagnetic induction of high-frequency currents flowing through the coil 4, and the wire 1 is heated and softened. The coil 4 is lifted to a capillary 3, a spark rod 8 is moved, and a ball 1a is shaped by a discharge phenomenon by utilizing high voltage from a spark discharge power supply section 7. Accordingly, the state in which the plastic fluidity of the wire 1 is facilitated is brought, and the ball is formed by employing a spark, thus acquiring the desired ball having a superior shape.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ＩＣ組立工程におけるワイヤボンデイング力
法及びその方法に関し、特にワイヤ先端にポールを形成
する方法とその装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding force method and method in an IC assembly process, and more particularly to a method and apparatus for forming a pole at the tip of a wire.

〔従来の技術〕[Conventional technology]

従来、この種のワイヤボンディングにおけるポール形成
装置は第６図に示すようにキャピラリ３の先端部より引
き出したＭ線やα線などのワイヤ１に対して不活性ガス
をノズル９よシ噴出し、スパーク放電電源部７を使って
スパーク放電によりワイヤｌの先端にポールｌｃＬを形
成し、そのポール１ａをＩＣチップの電極にボンディン
グした後、ワイヤ１をパッケージにボンディングしてい
た（特公昭５７−３９０５５号）。Conventionally, as shown in FIG. 6, a pole forming device for this type of wire bonding uses a nozzle 9 to eject an inert gas onto a wire 1 such as M-rays or α-rays drawn out from the tip of a capillary 3. A pole lcL was formed at the tip of the wire 1 by spark discharge using the spark discharge power supply section 7, and the pole 1a was bonded to the electrode of the IC chip, and then the wire 1 was bonded to the package (Japanese Patent Publication No. 57-39055). issue).

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のポールボンディング装置において、ワイヤ先端に
ポールを形成するには、スパーク放電によって流れる瞬
時の大電流により発生する熱の伝導でワイヤ先端部を溶
かし、ポールを形成していたが、ワイヤ材によりポール
表面が滑らかでなかったり、くぼみが残っていたシする
という欠点があった。これは線材の熱伝導性に差がある
為、スパーク放電時にワイヤが一様に溶融しない為と考
えられる。又、α線やＭ線などの場合、ワイヤ先端にで
きだポール表面は硬く、ＩＣチップの電極上ヘポンデイ
ングをすると、ポールが電極に衝突した際に電極の破壊
が発生するという欠点があった。In conventional pole bonding equipment, in order to form a pole at the tip of a wire, the wire tip is melted by conduction of heat generated by an instantaneous large current flowing through a spark discharge. The disadvantages were that the surface was not smooth and there were dents. This is thought to be because the wires do not melt uniformly during spark discharge due to differences in thermal conductivity of the wires. In addition, in the case of alpha rays, M rays, etc., the surface of the pole formed at the tip of the wire is hard, and when the pole is pounded onto the electrode of an IC chip, the electrode may be destroyed when the pole collides with the electrode.

本発明は前記問題点を解消したポールボンデイングカ法
及びその装置を提供するものである。The present invention provides a pole bonding method and apparatus that solve the above problems.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は金属の細線を用いたＩＣ組立工程でのポールボ
ンディングにおいて、キャピラリ先端のワイヤを前もっ
て高周波電流を用いて非接触に加熱しながら、スパーク
放電によりポール形成を行うことを特徴とするポールボ
ンデイングカ法と絶縁皮膜を表面に施した金属パイプを
コイル状に巻き、その内壁に複数個の噴出口を設はパイ
プ内に不活性ガスを流入した際その内側に不活性ガス雰
囲気を形成するコイルと、そのコイルに高周波電流を流
す手段と、そのコイルをキャピラリと相対運動させる機
構とを有することを特徴とするポールぎンデイング装置
である。The present invention relates to pole bonding in the IC assembly process using thin metal wires, which is characterized in that the wire at the tip of the capillary is heated in advance using high-frequency current in a non-contact manner, and the pole is formed by spark discharge. A metal pipe with an insulating coating applied to its surface is wound into a coil shape, and multiple spout ports are installed on the inner wall of the coil to form an inert gas atmosphere inside the pipe when inert gas flows into the pipe. This is a pole binding device characterized by having a means for passing a high-frequency current through the coil, and a mechanism for moving the coil relative to the capillary.

〔実施例〕〔Example〕

次に本発明の一実施例を図により説明する。 Next, one embodiment of the present invention will be described with reference to the drawings.

第１図において、ワイヤ１を開閉動作により保持スるク
ランプ２はアーム１５に取付けられ、キャピラリ３はア
ーム１６により保持されている。コイル４は金属パイプ
をコイル状に数回密巻きにして形成され、その内径はキ
ャピラリ３の外径より大きな寸法としてその内側には第
３図で示すように複数個のガス噴出口１７を設けである
。さらにコイル４はアーム１４により保持され、図示し
ない機構によりコイルの軸中心とキャピラリ３の軸中心
を一致させながらキャピラリ３の上下運動と相対的な動
きをする。そして、キャピラリ３とコイル４との相対的
な位置関係は、アーム１６に取り付けたセンサ９と位置
検出棒取付部品１０に取り付けられた検出棒１１．１２
．１３　　とにより検出する。クランプ２を保持するア
ーム１５とキャピラリ３を保持するアーム１６及びコイ
ル４を保持するアーム１４は互いに独立に図示しない機
構により動作させる。本装置は以上の他にコイル４に高
周波電流を負荷する高周波電流発生部５と、その高周波
電流発生部５に対しである値の周波数と電流値とをコイ
ル４に負荷するように信号を出力するタイミング検知制
御信号出力部６と、ワイヤｌ先端にスノ（−クロット８
を用いてポールを形成するスノζ−り放電電源部７とか
ら構成される。In FIG. 1, a clamp 2 that holds the wire 1 by opening and closing operations is attached to an arm 15, and a capillary 3 is held by an arm 16. The coil 4 is formed by tightly winding a metal pipe several times in a coil shape, and its inner diameter is larger than the outer diameter of the capillary 3, and a plurality of gas jet ports 17 are provided inside the coil 4 as shown in FIG. It is. Further, the coil 4 is held by an arm 14 and moves relative to the vertical movement of the capillary 3 while aligning the axial center of the coil with the axial center of the capillary 3 by a mechanism not shown. The relative positional relationship between the capillary 3 and the coil 4 is determined by the sensor 9 attached to the arm 16 and the detection rods 11 and 12 attached to the position detection rod attachment part 10.
．． 13 Detected by. The arm 15 holding the clamp 2, the arm 16 holding the capillary 3, and the arm 14 holding the coil 4 are operated independently from each other by a mechanism not shown. In addition to the above, this device also includes a high-frequency current generator 5 that loads a high-frequency current to the coil 4, and a signal to the high-frequency current generator 5 to load the coil 4 with a certain frequency and current value. The timing detection control signal output unit 6 and the snow (-clot 8) at the tip of the wire l
It is composed of a snow discharge power supply section 7 which forms a pole using a snow discharge power supply section 7.

リード２２へのポンディングを完了した後の様子を第２
図で示す。ワイヤ１をキャピラリ３先端から露出した状
態で、キャピラリ３先端がコイル４より出ていることを
検出棒１３とセンサ９で確認しながら、ワイヤ１をクラ
ンプ２で保持してキャピラリ３先端より露出させつつ、
クランプ２、キャピラリ３及びコイル４を互いに異なる
速さに設定して上昇させる。第３図で示すようにワイヤ
１先端がコイル４内部に位置したことを検出棒１１とセ
ンサ９により検出し、この信号に基づいてタイミング検
知制御信号出力部６よりある値の周波数と電流値をもつ
高周波電流をコイル４に負荷するように高周波電流発生
部５に信号を出力する。このとき、ワイヤ１の表面には
コイル４を流れる高周波電流の電磁誘導によシうず電流
が生じ、非接触でワイヤ１が加熱されて軟化し塑性流動
しやすい状態となる。この後、コイル４をキャピラリ３
に対し上昇させ、検出棒１２がセンサ９に入る高さで停
止させ、スパークロッド８をワイヤ１先端より０．２朋
程度下の位置に図示しない機構により移動させ、スパー
ク放電電源部７からの高電圧を利用し放電現象によって
ポール１ａを形成さす。検出棒１２の検出棒取付部品１
０への固定位置は、ポールが形成されたとき第４図で示
すようにポールＩＣＬがコイル４内に位置するように設
定する。そして、ポール形成後、再びタイミング検出制
御信号出力部６をもって、別に設定しておいた周波数と
電流値をもつ高周波電流を高周波電流発生部５よりコイ
ル４に負荷する信号を出し、ポールｌＣＬ表面を加熱し
、適度に軟化させ、ＩＣペレット１８の電極部ヘボンデ
イングする（第５図）。このとき、ワイヤ１のポール１
ｃＬは適度に軟化されているため、ＩＣペレット１８の
電極部への衝撃は小さく、したがつて、電極が破壊され
ることはない。又不活性ガスを、金属パイプで形成され
たコイル４の注入口１９より流入させてコイル内側の噴
出口１７より噴き出し、コイル両端２０　、２１より排
気し、ワイヤ１の周囲に不活性ガスの雰囲気を形成し、
大気中の酸素がコイル４の内側に混入するのを阻止し、
ワイヤ及びポールの表面が酸化されることを防止する。The second picture shows the situation after completing pounding to lead 22.
Illustrated in the diagram. With the wire 1 exposed from the tip of the capillary 3, while confirming with the detection rod 13 and sensor 9 that the tip of the capillary 3 is coming out from the coil 4, hold the wire 1 with the clamp 2 and expose it from the tip of the capillary 3. Tsutsu,
The clamp 2, capillary 3, and coil 4 are set at different speeds and raised. As shown in FIG. 3, the detection rod 11 and sensor 9 detect that the tip of the wire 1 is located inside the coil 4, and based on this signal, the timing detection control signal output section 6 outputs a certain frequency and current value. A signal is output to the high frequency current generator 5 so as to load the high frequency current to the coil 4. At this time, an eddy current is generated on the surface of the wire 1 due to electromagnetic induction of the high-frequency current flowing through the coil 4, and the wire 1 is heated without contact, softening, and becoming susceptible to plastic flow. After this, connect the coil 4 to the capillary 3
The spark rod 8 is moved to a position approximately 0.2 mm below the tip of the wire 1 by a mechanism (not shown), and the spark rod 8 is moved to a position approximately 0.2 mm below the tip of the wire 1. Pole 1a is formed by a discharge phenomenon using high voltage. Detection rod attachment part 1 of detection rod 12
The fixed position to 0 is set so that the pole ICL is located within the coil 4 as shown in FIG. 4 when the pole is formed. After the pole is formed, the timing detection control signal output section 6 again outputs a signal to load the coil 4 with a high frequency current having a frequency and current value set separately from the high frequency current generating section 5, and the surface of the pole lCL is The mixture is heated to soften it appropriately, and the electrode portion of the IC pellet 18 is bonded (FIG. 5). At this time, pole 1 of wire 1
Since cL is moderately softened, the impact on the electrode portion of the IC pellet 18 is small, and therefore the electrode is not destroyed. In addition, an inert gas is introduced into the inlet 19 of the coil 4 formed of a metal pipe, is ejected from the outlet 17 inside the coil, and is exhausted from both ends 20 and 21 of the coil to create an inert gas atmosphere around the wire 1. form,
Prevents atmospheric oxygen from entering the inside of the coil 4,
Prevents oxidation of wire and pole surfaces.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、ワイヤ先端にポールを形
成する前に非接触で高周波電流の周波数と電流値を制御
量としてワイヤ表面を最適な温度に加熱してワイヤ材の
塑性流動が容易な状態にし、その後スパーク放電を用い
てポールを形成するようにしたため、良好な形状のポー
ルを得ることができる。さらに、ＩＣペレットへワイヤ
をボンディングする直前まで高周波電流をコイルに負荷
し、ワイヤ先端のポール表面を加熱し、軟化することに
より、ＩＣペレット電極部への衝撃を小さくして電極部
の破損を防ぐことができる。また、金属パイプをコイル
状に巻いて形成したコイルを使用しているので、パイプ
内に不活性ガスを流入することによりコイル内側の噴出
口よりガスが噴き出し大気中の酸素が混入しない不活性
ガス雰囲気を容易に形成することができ、ワイヤ及びポ
ールを加熱しても表面に酸化膜の形成を防ぐことができ
、さらに不活性ガスとしてＭガスを用いると、Ｍガスの
もつ特性によりスパーク放電を確実に容易に生じさせる
効果がある。As explained above, the present invention heats the wire surface to an optimal temperature by controlling the frequency and current value of a high-frequency current in a non-contact manner before forming a pole at the tip of the wire, thereby facilitating plastic flow of the wire material. Since the poles are formed using the spark discharge, it is possible to obtain poles with good shapes. Furthermore, a high-frequency current is applied to the coil until just before bonding the wire to the IC pellet, which heats and softens the pole surface at the tip of the wire, reducing the impact on the IC pellet electrode and preventing damage to the electrode. be able to. In addition, since a coil formed by winding a metal pipe into a coil shape is used, inert gas flows into the pipe and gas is ejected from the spout inside the coil, preventing oxygen from the atmosphere from getting mixed in. It is possible to easily create an atmosphere, prevent the formation of an oxide film on the surface even if the wire and pole are heated, and furthermore, when M gas is used as an inert gas, the characteristics of M gas prevent spark discharge. There is an effect that can be easily produced with certainty.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す斜視図、第２゜３．４
．５図は各構成要素の動作を示す構成図、第６図は従来
の装置の構成図である。 ■・・・ワイヤ、２・・・クランプ、３・・・キャピラ
リ、４・・・コイル、５・・・高周波電流発生部、６・
・・タイミング検出制御信号出力部、７・・・スパーク
放電電源部、８・・・スパークロッド、９・・・センサ
、１０・・・検出棒取付部品、１１〜１３・・・検出棒
、１４・・・コイル取付アーム、１５・・・クランプ取
付アーム、１６・・・キャピラリ取付アーム、１７・・
・噴出口、１８・・・ＩＣペレット、１９・・・不活性
ガス注入口、２０．２１・・・コイル端面、２２・・・
リード第１図 第４図Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2.3.4
．． FIG. 5 is a block diagram showing the operation of each component, and FIG. 6 is a block diagram of a conventional device. ■... Wire, 2... Clamp, 3... Capillary, 4... Coil, 5... High frequency current generator, 6...
... Timing detection control signal output part, 7... Spark discharge power supply part, 8... Spark rod, 9... Sensor, 10... Detection rod attachment parts, 11-13... Detection rod, 14 ...Coil mounting arm, 15...Clamp mounting arm, 16...Capillary mounting arm, 17...
・Ejection port, 18... IC pellet, 19... Inert gas inlet, 20.21... Coil end face, 22...
Lead Figure 1 Figure 4

Claims (2)

【特許請求の範囲】[Claims] （１）金属の細線を用いたＩＣ組立工程でのポールボン
ディングにおいて、キャピラリ先端のワイヤを前もつて
高周波電流を用いて非接触に加熱しながら、スパーク放
電によりポール形成を行うことを特徴とするポールボン
ディング方法。(1) In pole bonding in the IC assembly process using thin metal wires, the pole is formed by spark discharge while the wire at the tip of the capillary is heated in a non-contact manner using high-frequency current. Pole bonding method. （２）絶縁皮膜を表面に施した金属パイプをコイル状に
巻き、その内壁に複数個の噴出口を設け、パイプ内に不
活性ガスを流入した際その内側に不活性ガス雰囲気を形
成するコイルと、そのコイルに高周波電流を流す手段と
、そのコイルをキャピラリと相対運動させる機構とを有
することを特徴とするポールボンディング装置。(2) A coil made by winding a metal pipe with an insulating film on its surface and providing multiple jets on its inner wall to form an inert gas atmosphere inside the pipe when inert gas flows into the pipe. 1. A pole bonding device comprising: a means for passing a high-frequency current through the coil; and a mechanism for moving the coil relative to a capillary.
JP60039632A 1985-02-28 1985-02-28 Ball bonding method and device thereof Pending JPS61198741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60039632A JPS61198741A (en) 1985-02-28 1985-02-28 Ball bonding method and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60039632A JPS61198741A (en) 1985-02-28 1985-02-28 Ball bonding method and device thereof

Publications (1)

Publication Number Publication Date
JPS61198741A true JPS61198741A (en) 1986-09-03

Family

ID=12558465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60039632A Pending JPS61198741A (en) 1985-02-28 1985-02-28 Ball bonding method and device thereof

Country Status (1)

Country Link
JP (1) JPS61198741A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277561A (en) * 2007-04-27 2008-11-13 Toshiba Lighting & Technology Corp Luminaire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277561A (en) * 2007-04-27 2008-11-13 Toshiba Lighting & Technology Corp Luminaire

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