JPS61197656A - Forming material based on polyamide having reduced properties - Google Patents
Forming material based on polyamide having reduced propertiesInfo
- Publication number
- JPS61197656A JPS61197656A JP60278108A JP27810885A JPS61197656A JP S61197656 A JPS61197656 A JP S61197656A JP 60278108 A JP60278108 A JP 60278108A JP 27810885 A JP27810885 A JP 27810885A JP S61197656 A JPS61197656 A JP S61197656A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- granules
- weight
- silicone compound
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002647 polyamide Polymers 0.000 title claims description 18
- 239000004952 Polyamide Substances 0.000 title claims description 15
- 239000000463 material Substances 0.000 title description 2
- 239000008187 granular material Substances 0.000 claims description 20
- 229920001296 polysiloxane Polymers 0.000 claims description 20
- 239000012778 molding material Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 15
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 description 11
- 238000005054 agglomeration Methods 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 230000024121 nodulation Effects 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OCKGFTQIICXDQW-ZEQRLZLVSA-N 5-[(1r)-1-hydroxy-2-[4-[(2r)-2-hydroxy-2-(4-methyl-1-oxo-3h-2-benzofuran-5-yl)ethyl]piperazin-1-yl]ethyl]-4-methyl-3h-2-benzofuran-1-one Chemical compound C1=C2C(=O)OCC2=C(C)C([C@@H](O)CN2CCN(CC2)C[C@H](O)C2=CC=C3C(=O)OCC3=C2C)=C1 OCKGFTQIICXDQW-ZEQRLZLVSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006017 homo-polyamide Polymers 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- -1 polypropyleneoxy Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Polyamides (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、減少した性質を有し、従ってその製造および
加工の際の処理に関し重要な利点を有するポリアミドを
主体とする成形材料に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to molding compositions based on polyamides which have reduced properties and therefore have important advantages with respect to their handling during production and processing.
従来の技術
重合体がガラス転移点より上!、性質にある程度顕著な
傾向を有することは公知″r!ある。これは、成形材料
の粒子の性質、殊に顆粒または粉末が互いに付着する性
質を表わす。この性質は、温度の上昇につれて増加し、
適当な手段によって阻止されない場合には団塊が形成す
るまで進む。Conventional technology polymers are above the glass transition point! It is known that "r!" has a rather pronounced tendency in the properties. It describes the properties of the particles of the molding material, in particular the tendency of the granules or powders to stick to each other. This property increases with increasing temperature. ,
If not stopped by suitable measures, it will proceed until nodules are formed.
この性質は、重合体の軟化特性と直接に関連している。This property is directly related to the softening properties of the polymer.
重合体が軟化すると、これから粘着が生じる、つt#)
付着力が温度の上昇につれて増加する。従って、ガラス
転移温度とそのつどの製造温度との間の相違が大きけれ
ば大きいはど、この性質、従ってたとえば顆粒または粉
末の団塊形成傾向がますます顕著となる。As the polymer softens, it will become sticky (t#)
Adhesion increases with increasing temperature. Therefore, the greater the difference between the glass transition temperature and the respective production temperature, the more pronounced this property and thus, for example, the tendency to agglomerate the granules or powder.
さらに、この性質の程度は、重合体の結晶化度に著しく
影響される。無定形状態の重合体では既にガラス転移点
よシ上の温度です1に粘着性が確認しうるが、相応する
温度は結晶性重合体ではこれよシも明らかに高い。非常
に高い結晶化度を有する重合体フは、溶融範囲の開始時
にはじめて該性質が観察される。Furthermore, the extent of this property is significantly influenced by the crystallinity of the polymer. In an amorphous polymer, tackiness can be observed at a temperature already above the glass transition point (1), but the corresponding temperature is clearly higher than this in a crystalline polymer. Polymers with a very high degree of crystallinity are only observed at the beginning of the melting range.
重合体成形材料の製造および加工の際には、該成形材料
をそのガラス転移温度よシ上の温度f処理するのがしば
しば有利″T!あり、ときにはむしろ不可避である。こ
の性質による成形材料の粒子の集結ないしは団塊形成は
処理に不利な作用を及ぼす。それ〒、たとえば重合体の
乾燥は、経済的に許容しうる乾燥時間1必要な湿分を達
成するために、しばしばガラス転移点よシ上の温度で実
施される。そのガラス転移温度が室温またはそれよシ下
の範囲内にある成形材料では、既に貯蔵の際に、なかん
ずく暑い気候を有する諸国(ここ)は40℃以上の温度
1の貯蔵が普通フある)において好ましくない団塊形成
が生じうる。During the production and processing of polymeric molding materials, it is often advantageous, and sometimes even unavoidable, to treat the molding materials to temperatures above their glass transition temperature. Particle agglomeration or agglomeration has an adverse effect on processing; for example, the drying of polymers often takes steps below the glass transition temperature to achieve an economically acceptable drying time and the required moisture content. For molding materials whose glass transition temperature is in the range of room temperature or below, countries with particularly hot climates (here) may be exposed to temperatures above 40 °C. Undesirable agglomeration can occur during storage (as is normally the case).
この性質、それとともに団塊形成の傾向およびこれから
生じる、成形材料の処理の際の難点を減少させるために
、種々の手段が公知′″e!ある。In order to reduce this property, and with it the tendency towards nodule formation and the resulting difficulties in processing the molding materials, various measures are known.
それ1、結晶可能の成形材料ではたとえば既述した事実
、即ち該性質が結晶化度の増加につれて減少するという
事実が利用される。成形材料の結晶化度は熱処理によっ
て増加し、この場合特定の温度プログラムに従って操作
され、従って温度は時間に依存して、増加する結晶化度
によって減少する性質を許容するような程度に上昇させ
る。共重合体1は、この熱処理は非常に時間がかかる。First, in the case of crystallizable molding materials, for example, the already mentioned fact is utilized, namely that the properties decrease as the degree of crystallinity increases. The crystallinity of the molding material is increased by heat treatment, in which case it is operated according to a specific temperature program, so that the temperature is increased in a time-dependent manner to such an extent that it allows the properties to decrease with increasing crystallinity. For Copolymer 1, this heat treatment takes a very long time.
それというのも共重合体は相応するホモ重合体よシも明
らかに低い結晶化速度ならびに低い達成可能な最大結晶
化度を有し、熱処理の間の温度は団塊形成なしには非常
に緩慢にしか上昇1きないからfある。This is because the copolymers have a distinctly lower crystallization rate than the corresponding homopolymers as well as a lower maximum achievable crystallinity, and the temperature during the heat treatment can be adjusted very slowly without agglomeration. There is only an increase of 1, so there is f.
該性質を減少させるもう1つの手段は、成形材料に分離
剤として作用する物質を加えることである。このために
は、顆粒、粉末等の形f存在する成形材料に、別個の作
業工程1表面的に分離剤を散布する。しかし、この分離
剤は、成形材料を溶融し、それとともに分離剤が成形材
料中へ混入されると、その作用を失なうという欠点を有
する。分離剤が重合体成形材料と均質に混合可能でない
場合、成形材料は好ましくない方法で影響を受けること
がある。Another means of reducing this property is to add substances to the molding compound that act as separating agents. For this purpose, the molding material present in the form of granules, powder, etc. is superficially sprinkled with a separating agent in a separate working step. However, this separating agent has the disadvantage that it loses its effect when the molding material is melted and the separating agent is mixed into the molding material. If the separating agent is not homogeneously miscible with the polymeric molding material, the molding material may be affected in an undesirable manner.
ここ!一般に重合体成形材料につき記載した性質および
関連事項は完全に、とくにポリアミドを主体とする成形
材料についても言える。here! The properties and related matters described for polymeric molding compositions in general also apply in particular to polyamide-based molding compositions.
本発明の目的は、適当な手段によって、ポリアミドを主
体とする成形材料の性質を上述した欠点なしに減少する
ことtあった。The object of the invention was to reduce, by suitable measures, the properties of polyamide-based molding compositions without the disadvantages mentioned above.
本発明によるポリアミドを主体とする、その性質が著し
く減少されている成形材料は、重合体に対して0.00
5〜5重量%の親水性シリコーン化合物が添加されてい
ることを特徴とする。The molding composition based on polyamide according to the invention, the properties of which are significantly reduced, has a
It is characterized in that 5 to 5% by weight of a hydrophilic silicone compound is added.
本発明によるポリアミドとしては、公知方法tアミノカ
ルゼン酸ないしは、可能である限シ、相応するラクタム
および/″またはジアミ/とジカルゼン酸ないしはその
塩から製造することの1きるようなすべてのホモポリア
ミドおよびコポリアミドが挙げられる。本発明による成
形材料は、安定剤、可塑剤、顔料、けい光増白剤、補強
剤および填料のような添加剤を含有していてもよい。Polyamides according to the invention include all homopolyamides and copolymers which can be prepared by known methods from aminocarzenic acids or, to the extent possible, the corresponding lactams and/or diaminocarzenic acids or their salts. Polyamides may be mentioned.The molding materials according to the invention may contain additives such as stabilizers, plasticizers, pigments, fluorescent brighteners, reinforcing agents and fillers.
本発明による親水性シリコーン化合物としては、とくに
シリコーン系界面活性剤が使用される。これは主として
シリコーンポリアルキレンオキシド共重合体であシ、こ
の場合には原則として加水分解可能のシリコーン界面活
性剤(式1による)と加水分解不能のシリコーン界面活
性剤(式2による)とが区別される:
但し、RはHまだはアルキル基を表わし R/はアルキ
ル基を表わす。ポリアルキレンオキシド基−(CnH2
nO)z−は、ポリエチレンオキシドまたは、ポリエチ
レンオキシドブロックとポリプロピレンオキシPブロッ
クからなるブロック重合体からなっていてもよい。As hydrophilic silicone compounds according to the invention, in particular silicone surfactants are used. This is primarily a silicone polyalkylene oxide copolymer, in which case a distinction is made in principle between hydrolyzable silicone surfactants (according to formula 1) and non-hydrolyzable silicone surfactants (according to formula 2). However, R represents an alkyl group, and R/ represents an alkyl group. Polyalkylene oxide group -(CnH2
nO)z- may be composed of polyethylene oxide or a block polymer composed of a polyethylene oxide block and a polypropyleneoxy P block.
この種の生成物は市場で得られ、代表例はなかんずくダ
ンノζリイ在ユニオン・カーノ々イP社のシA/つxツ
) (Silwet ) L −720オ!びL−75
00、レーフエルクーゼン在ノ々イニルAG社tD ノ
” イシo :y (Baysl Ion ) 0F1
0H−OR603ならびにミュンヘン在ワツカー・ヒエ
ミーGmbH社のシリコーン油LO50マある。Products of this type are available on the market, and representative examples include, among others, Silwet L-720O! Bi L-75
00, Baysl Ion 0F1
0H-OR603 as well as silicone oil LO50 from Watzker Hiemi GmbH, Munich.
ポリアミドに対する親水性シリコーン化合物の添加は、
その製造の間または製造後に行なうことができる。従っ
て、該シリコーン化合物は、重合前、重合の間または重
合後、溶融液状態のポリアミドに混和することも1きる
し、あるいは固形で、とくに顆粒または粉末状!存在す
るポリアミドに、表面的に散布することもできる。The addition of hydrophilic silicone compounds to polyamides
This can be done during or after its manufacture. The silicone compound can therefore be mixed with the polyamide in the melt state before, during or after the polymerization, or else in solid form, especially in the form of granules or powder! It is also possible to spray the existing polyamide superficially.
親水性シリコーン化合物は、重合体に対して0、 OO
5〜5重量%の間、とくに0.05〜2重量%の間の量
で添加される。この場合最適量は、添加の形式による。The hydrophilic silicone compound is 0, OO with respect to the polymer.
It is added in an amount between 5 and 5% by weight, in particular between 0.05 and 2% by weight. The optimum amount in this case depends on the type of addition.
親水性シリコーン化合物を溶融液状態のポリアミドに混
和する場合には0゜5〜2重量%のt″′1%′1%最
良得られ、固形のポリアミドに表面的に散布する場合に
は0.05〜0.5重量%の簡の量が有利である。When the hydrophilic silicone compound is mixed into the polyamide in a molten state, a t'''1%'1% of 0.5 to 2% by weight is best obtained, and when it is superficially sprinkled onto the solid polyamide, a t''. Amounts of 0.05 to 0.5% by weight are advantageous.
次に実施例につき本発明を詳述するが本発明はこれに限
定されるもの1はない。Next, the present invention will be described in detail with reference to Examples, but the present invention is not limited thereto.
実施例
例1
攪拌オートクレーブ中に、ラウリンラクタム40重量部
、カプロラクタム60重量部、水2閉じて5時間290
℃に加熱する。圧力は、起シうる放圧により最高20パ
ールに保つ。その後、1時間以内に圧力をオートクレー
ブの放圧によって大気圧に低下させ、同時に反応混合物
の温度を260℃に低下させる。シリコーン界面活性剤
ユニオンカーノ々イP社のシルウェットL−75000
.8重量部を添加し、窒素の導通によって重合を続行さ
せる。8時間後、1.83の溶液粘度(20℃でm−ク
レゾール中の0.5チ溶液として測定)に相当する所望
の重合度゛が得られた。Example 1 In a stirring autoclave, 40 parts by weight of laurin lactam, 60 parts by weight of caprolactam, 2 parts of water, and 290°C for 5 hours after closing.
Heat to ℃. The pressure is kept at a maximum of 20 par with possible relief. Thereafter, within one hour, the pressure is reduced to atmospheric pressure by venting the autoclave, and at the same time the temperature of the reaction mixture is reduced to 260.degree. Silicone surfactant Silwet L-75000 from Union Carnoy P Co., Ltd.
.. 8 parts by weight are added and the polymerization is continued by passing in nitrogen. After 8 hours, the desired degree of polymerization was obtained, corresponding to a solution viscosity of 1.83 (measured as a 0.5% solution in m-cresol at 20 DEG C.).
重合体をオートクレーブからストランド形フ取出し、水
浴に通すことによシ固化させ、顆粒にする。顆粒をサイ
ロ中へ送入し、ここで24時間貯蔵する。顆粒の温度は
、貯蔵の間はじめの35℃から30℃に低下する。その
後顆粒を、その加熱媒体が室温に冷却されていた揺動乾
燥器中に送入する。その際顆粒の団塊化による困難は生
じない。20)ルの真空をかけた後、揺動乾燥器を加熱
する。約1時間後に加熱媒体は90℃の温度に達し、約
2時間後に生成物の温得られた。乾燥の終了後に揺動乾
燥器から顆粒を搬出する際に、顆粒の集結または乾燥器
の壁面に付着している顆粒は確認できない。The polymer is removed from the autoclave in strand form, solidified by passing through a water bath, and granulated. The granules are fed into a silo where they are stored for 24 hours. The temperature of the granules is reduced from an initial 35°C to 30°C during storage. The granules are then introduced into a rocking dryer whose heating medium has been cooled to room temperature. No difficulties arise in this case due to agglomeration of the granules. 20) After applying a vacuum, heat the rocking dryer. After about 1 hour the heating medium reached a temperature of 90° C. and after about 2 hours the product was warm. When the granules are removed from the oscillating dryer after drying, no granule agglomeration or adhesion to the wall of the dryer can be observed.
例LA(比較例)
例1によるポリアミド顆粒を、シリコーン化合物を添加
せずに製造する。該顆粒を例1におけるようにサイロ中
に送入するが、との場合団塊化をさけるために、約15
℃の空気を通して冷却しなければならない。24時間の
貯蔵後、顆粒を例1と同様、揺動乾燥器中に送入し、乾
燥する。顆粒相互間または乾燥器周壁への粘着をさける
ために、加熱媒体の温度を段階的に、つまシ差当シ+5
℃、1時間後65℃、さらに1時間後に85℃に上昇さ
せる。H2O0,02%の必要な顆粒の湿分含量を得る
ためには、付加的に8時間の乾燥時間が必要″1%ある
。Example LA (Comparative Example) Polyamide granules according to Example 1 are prepared without addition of silicone compounds. The granules are fed into a silo as in Example 1, but in order to avoid agglomeration, approximately 15
Must be cooled through air at ℃. After storage for 24 hours, the granules are placed in a rocking dryer and dried as in Example 1. In order to avoid sticking between granules or to the peripheral wall of the dryer, the temperature of the heating medium is adjusted in stages to
℃, 65°C after 1 hour, and 85°C after another hour. In order to obtain the required moisture content of the granules of 0.02% H2O, an additional drying time of 8 hours is required.
例1と例IAにおける記載の比較は、本発明によるシリ
コーン化合物の添加によりかつこれから生じるポリアミ
ドの減少した性質のため、殊にまだ熱処理されてなく、
それとともに結晶化せる顆粒の問題のない貯蔵ならびに
これら顆粒を乾燥する際の迅速かつ合理的な作業方法が
可能であることを明瞭に示す。A comparison of the descriptions in Example 1 and Example IA shows that due to the addition of the silicone compound according to the invention and due to the reduced nature of the resulting polyamide, in particular, it has not yet been heat treated.
It also clearly shows that a problem-free storage of crystallized granules as well as a fast and efficient method of operation in drying these granules is possible.
例2
攪拌オートクレーブ中に、カプロラクタム40重量部、
AH塩20重量部、ヘキサメチレンジアミン16重量部
、アゼライン酸14重量部、ドデカンジ酸15重量部お
よび水3重量部を入量
れ、空気を凰換した後1時間260℃に加熱する。この
場合、オートクレーブ内の圧力は大気圧に低下し、重合
を窒素を導通することにより、1.55の溶液粘度に相
応する重合度になるまで続ける。重合体を、例1に記載
したように、オートクレーブから取出し、顆粒にし、乾
燥する。Example 2 In a stirred autoclave, 40 parts by weight of caprolactam,
20 parts by weight of AH salt, 16 parts by weight of hexamethylene diamine, 14 parts by weight of azelaic acid, 15 parts by weight of dodecanedioic acid and 3 parts by weight of water were added, and after exchanging air, the mixture was heated to 260° C. for 1 hour. In this case, the pressure in the autoclave is reduced to atmospheric pressure and the polymerization is continued by passing in nitrogen until a degree of polymerization corresponding to a solution viscosity of 1.55 is reached. The polymer is removed from the autoclave, granulated and dried as described in Example 1.
こうして得られた顆粒100重量部に、ワラカー・ヒエ
ミー社のシリコーン油LO500,1重量部を混合し、
引続きピンミル中1同時に液体窒素で冷却下に粉砕する
。粗砕物から、80〜200μmの粒径を有する画分を
ふるい分け、ステアリン酸マグネシウム0.1!−Jt
%と混合する。こうして得られた粉末の試料を40′c
−r!3日貯蔵し、引続き団塊形成を判定する。結果は
表1に記載されている。100 parts by weight of the granules thus obtained were mixed with 1 part by weight of silicone oil LO500 from Warakah Hiemi,
This is then simultaneously ground in a pin mill while cooling with liquid nitrogen. From the crushed material, a fraction having a particle size of 80 to 200 μm was sieved, and 0.1% of magnesium stearate was extracted. -Jt
Mix with %. A sample of the powder thus obtained was
-r! Store for 3 days and subsequently determine nodule formation. The results are listed in Table 1.
例2A(比較例)
例2におけるように実施するが、粉砕前の顆粒に親水性
シリコーン化合物は加えない。Example 2A (Comparative Example) It is carried out as in Example 2, but no hydrophilic silicone compound is added to the granules before milling.
表1
1団塊形成の判定
0=団塊形成なし
1=軽度の団塊形成、団塊は手1容易に圧砕される2=
中程度の団塊形成、団塊は手で強く圧した場合にのみ圧
砕されるTable 1 1 Judgment of nodule formation 0 = No nodule formation 1 = Mild nodule formation, nodule is easily crushed by hand 2 =
Moderate nodule formation, nodules are crushed only with strong hand pressure
Claims (1)
る、著しく減少した性質を有するポリアミドを主体とす
る成形材料。 2 親水性シリコーン化合物がポリアミドに対して0.
005〜5重量%の量で添加された、特許請求の範囲第
1項記載の成形材料。 3、親水性シリコーン化合物がポリアミドに、重合の前
、重合の間または重合後に添加することにより混合され
た、特許請求の範囲第1項記載の成形材料。 4、親水性シリコーン化合物が、顆粒状または粉末状で
存在するポリアミドに散布された、特許請求の範囲第1
項記載の成形材料。 5、親水性シリコーン化合物としてシリコーン系界面活
性剤が使用された、特許請求の範囲第1項記載の成形材
料。[Claims] 1. A polyamide-based molding material with significantly reduced properties, characterized in that it contains a hydrophilic silicone compound. 2 The hydrophilic silicone compound is 0.0% relative to the polyamide.
Molding material according to claim 1, added in an amount of 0.005 to 5% by weight. 3. The molding material according to claim 1, wherein the hydrophilic silicone compound is mixed with the polyamide by adding it before, during or after polymerization. 4. Claim 1, wherein the hydrophilic silicone compound is dispersed on the polyamide present in the form of granules or powder.
Molding materials listed in section. 5. The molding material according to claim 1, wherein a silicone surfactant is used as the hydrophilic silicone compound.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA000524940A CA1266474A (en) | 1985-12-11 | 1986-12-10 | N-benzoyl urea compounds, antitumorous compositions containing them, and process for their preparation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH5901/84A CH661737A5 (en) | 1984-12-12 | 1984-12-12 | MOLDING MATERIALS BASED ON HOMO OR MIXED POLYAMIDES WITH REDUCED PROPERTY. |
CH5901/84-8 | 1984-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61197656A true JPS61197656A (en) | 1986-09-01 |
Family
ID=4301246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60278108A Pending JPS61197656A (en) | 1984-12-12 | 1985-12-12 | Forming material based on polyamide having reduced properties |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS61197656A (en) |
CH (1) | CH661737A5 (en) |
DE (1) | DE3543754A1 (en) |
FR (1) | FR2574420B1 (en) |
GB (1) | GB2169907B (en) |
IT (1) | IT1182085B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3302729B2 (en) * | 1992-07-30 | 2002-07-15 | 東レ・ダウコーニング・シリコーン株式会社 | Polyamide resin composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4842052A (en) * | 1971-09-27 | 1973-06-19 | ||
JPS5141920A (en) * | 1974-10-07 | 1976-04-08 | Hitachi Ltd | HYOJIPANERU |
JPS60222221A (en) * | 1984-04-18 | 1985-11-06 | Mitsuboshi Belting Ltd | Method for extrusion molding of synthetic resin molded body |
JPS61126169A (en) * | 1984-11-21 | 1986-06-13 | Toray Ind Inc | Polyamide resin composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1197567A (en) * | 1966-09-20 | 1970-07-08 | Ici Ltd | Polyamides |
FR1549985A (en) * | 1967-01-05 | 1968-12-13 | ||
DE1694235A1 (en) * | 1967-12-28 | 1972-02-10 | Bayer Ag | Anti-static molded structures made of high polymers |
AU475708B2 (en) * | 1971-06-17 | 1976-09-02 | Nmi California Inc | Method and composition for treating multi-metal surfaces |
US4703082A (en) * | 1981-08-27 | 1987-10-27 | Union Carbide Corporation | Integral additives and methods for making filled thermoplastics |
JPS59232124A (en) * | 1983-06-15 | 1984-12-26 | Mitsubishi Chem Ind Ltd | Production of fine spherical particles of thermoplastic resin |
-
1984
- 1984-12-12 CH CH5901/84A patent/CH661737A5/en not_active IP Right Cessation
-
1985
- 1985-12-11 DE DE19853543754 patent/DE3543754A1/en not_active Withdrawn
- 1985-12-11 FR FR858518354A patent/FR2574420B1/en not_active Expired
- 1985-12-11 IT IT48911/85A patent/IT1182085B/en active
- 1985-12-12 GB GB08530604A patent/GB2169907B/en not_active Expired
- 1985-12-12 JP JP60278108A patent/JPS61197656A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4842052A (en) * | 1971-09-27 | 1973-06-19 | ||
JPS5141920A (en) * | 1974-10-07 | 1976-04-08 | Hitachi Ltd | HYOJIPANERU |
JPS60222221A (en) * | 1984-04-18 | 1985-11-06 | Mitsuboshi Belting Ltd | Method for extrusion molding of synthetic resin molded body |
JPS61126169A (en) * | 1984-11-21 | 1986-06-13 | Toray Ind Inc | Polyamide resin composition |
Also Published As
Publication number | Publication date |
---|---|
IT1182085B (en) | 1987-09-30 |
IT8548911A0 (en) | 1985-12-11 |
DE3543754A1 (en) | 1986-06-26 |
FR2574420A1 (en) | 1986-06-13 |
FR2574420B1 (en) | 1989-09-08 |
GB8530604D0 (en) | 1986-01-22 |
GB2169907A (en) | 1986-07-23 |
CH661737A5 (en) | 1987-08-14 |
GB2169907B (en) | 1988-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7317044B2 (en) | Polymer powder with phosphonate-based flame retardant, process for its production, and moldings produced from this polymer powder | |
KR20060051768A (en) | Powder with improved recycling properties, process for its production, and use of the powder in a process for producing three-dimensional objects | |
JP2022084875A (en) | Process for preparing polymer composition, and polymer composition obtainable by the process | |
JPH07507803A (en) | Water dispersible granular agricultural composition | |
TWI363068B (en) | Process for preparing a melt-processable polyamide composition | |
US6077542A (en) | Solid substances comprising valproic acid and sodium valproate | |
JPS61197656A (en) | Forming material based on polyamide having reduced properties | |
JPS61221273A (en) | Production of powdery coating agent based on polyamide having at least 10 aliphatic bonded carbon atoms per one carbonamide group | |
EP2448998B1 (en) | Modified polyamide, preparation method thereof and article obtained from said polyamide | |
TW546350B (en) | Nucleation of polyamides in the presence of hypophosphite | |
JPS6013816A (en) | Preparation of fine particles of thermoplastic resin | |
KR960000417B1 (en) | Molding material including polyamide | |
JPH02212532A (en) | Polypropylene composite material reinforced with granulated fibrous magnesium oxysulfate | |
JP3714787B2 (en) | Method for producing polyamide resin composition having excellent molding characteristics | |
JPS61197630A (en) | Forming material comprising mainly thermoplastic saturated polyester having reduced characteristics | |
JPH11226946A (en) | Polyamide resin composition pellet for molding | |
JPH04338107A (en) | Production of spherical activated carbon | |
CN86102185A (en) | The moulding material that contains polymeric amide | |
JPS5810422B2 (en) | How to use the technology | |
JP2001089745A (en) | Method of producing melamine resin abrasive material | |
JPS62235284A (en) | Prevention of urea solidification | |
ITMI950414A1 (en) | PVOH-based thermoplastic compositions and method to obtain them. | |
JP2000219747A (en) | Method for molding polymeric compound | |
JPH0330629B2 (en) | ||
JPS64973B2 (en) |