JPS61195315A - Cooling type infrared detector - Google Patents
Cooling type infrared detectorInfo
- Publication number
- JPS61195315A JPS61195315A JP60038050A JP3805085A JPS61195315A JP S61195315 A JPS61195315 A JP S61195315A JP 60038050 A JP60038050 A JP 60038050A JP 3805085 A JP3805085 A JP 3805085A JP S61195315 A JPS61195315 A JP S61195315A
- Authority
- JP
- Japan
- Prior art keywords
- radiant heat
- cooling
- infrared
- enclosure
- shield structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 239000010409 thin film Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 230000005679 Peltier effect Effects 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
外囲器により密封してなる赤外線検知器内の、赤外線検
知素子及び冷却手段と外囲器との間に、外部輻射熱遮蔽
用の金属薄膜ベロー形状からなるシールド構造体を設け
た構造とし、外部からの不要な輻射熱、伝導熱の浸入を
阻止して、当該検知器の冷却効果を向上させる。[Detailed Description of the Invention] [Summary] In an infrared detector sealed by an envelope, a bellow-shaped metal thin film for shielding external radiant heat is provided between the infrared detecting element and the cooling means and the envelope. The structure includes a shield structure that prevents unnecessary radiant heat and conductive heat from entering from the outside, thereby improving the cooling effect of the detector.
本発明は火災監視システム、加熱炉、化学プラントの温
度制御システム、或いは鋼材の欠陥検出等に用いられる
冷却型赤外線検知器に係り、特に外部からの不要な輻射
熱の浸入を遮断する遮蔽手段を、検知器内に設けて冷却
効率の向上を図った冷却型赤外線検知器に関するもので
ある。The present invention relates to a cooled infrared detector used for fire monitoring systems, heating furnaces, temperature control systems for chemical plants, defect detection of steel materials, etc., and particularly includes a shielding means for blocking unnecessary radiant heat from entering from the outside. This invention relates to a cooled infrared detector that is installed inside the detector to improve cooling efficiency.
熱源、又は物体の温度を非接触で検知、計測する赤外線
検知器としては、一般に熱形と量子形に大別され、熱形
は感度が低く、応答が遅いが感度の波長依存性が少なく
、常温動作が可能である。Infrared detectors that detect and measure the temperature of a heat source or object without contact are generally divided into thermal type and quantum type.Thermal type has low sensitivity and slow response, but its sensitivity is less dependent on wavelength. Can operate at room temperature.
一方量子形はこれに対して感度が高く、応答も早いが、
感度の波長依存性が強く、背景雑音を抑えるために電子
冷却、或いは液体窒素冷却等による冷却手段を必要とし
ている。On the other hand, the quantum form is highly sensitive to this and responds quickly, but
Sensitivity is strongly dependent on wavelength, and a cooling means such as electronic cooling or liquid nitrogen cooling is required to suppress background noise.
このような冷却手段を備えた赤外線検知器は、用いられ
る環境温度による熱負荷によって、赤外線検知素子を必
要とする常用冷却温度にまで冷却維持することが難しく
、又冷却手段として液体窒素等の冷媒を用いた場合には
、該冷媒の消費が早められるなどの問題があり、これら
冷却効率の向上が要望されている。Infrared detectors equipped with such cooling means have difficulty keeping the infrared sensing element cooled down to the normal cooling temperature required due to the heat load caused by the environmental temperature in which it is used, and it is difficult to maintain cooling of the infrared sensing element to the required regular cooling temperature. When using these, there are problems such as the consumption of the refrigerant being accelerated, and there is a desire to improve the cooling efficiency.
第５図は従来の電子冷却型赤外線検知器を示す概略縦断
面図であり、２は外囲器１の一部を構成する基板（ステ
ム）である。該基板２上にはペルチェ効果を利用した電
子冷却素子３を介して、例えば水銀・カドミウム・テル
ル（Ｈｇ＋−ＸＣｄｘ Ｔｅ）からなる赤外線検知素子
４が配置され、これら電子冷却素子３及び赤外線検知素
子４は、赤外線透過窓６を備えた外囲体５により図示の
ように密封されている。FIG. 5 is a schematic vertical cross-sectional view showing a conventional thermoelectrically cooled infrared detector, and 2 is a substrate (stem) constituting a part of the envelope 1. As shown in FIG. An infrared sensing element 4 made of, for example, mercury, cadmium, tellurium (Hg+-XCdx Te) is arranged on the substrate 2 via an electronic cooling element 3 that utilizes the Peltier effect. 4 is sealed by an envelope 5 provided with an infrared transparent window 6 as shown.
このように基板２上に密封された外囲体５からなる外囲
器１内は、排気を行って高真空状態にしている。The interior of the envelope 1 consisting of the envelope 5 sealed above the substrate 2 is evacuated to a high vacuum state.
又、前記電子冷却素子３は、赤外線検知素子４を略２０
０°Ｋ （−７０℃）に冷却可能に構成されている。Further, the electronic cooling element 3 has an infrared detecting element 4 of about 20
It is configured to be able to be cooled to 0°K (-70°C).
ところで、上記のような従来の電子冷却型赤外線検知器
において、検知素子４に対する冷却効果を高めるための
構成としては、単に外囲器１内を高真空状態にしている
以外に何等、外部からの輻射熱に対する断熱構造的な処
置が施されていないことから、該検知器の動作環境温度
によっては、内蔵した電子冷却素子３本来の最大冷却能
力温度に検知素子４を冷却することが難しく、また所要
低温に安定に維持することが困難なる欠点があった。By the way, in the conventional electronically cooled infrared detector as described above, in order to enhance the cooling effect on the detection element 4, in addition to simply keeping the inside of the envelope 1 in a high vacuum state, there is no need for any external interference. Since no thermal insulation structure measures are taken against radiant heat, depending on the operating environment temperature of the detector, it may be difficult to cool the sensing element 4 to the original maximum cooling capacity temperature of the built-in electronic cooling element 3. The drawback was that it was difficult to maintain it stably at low temperatures.
本発明はこのような実情に鑑み、器内構成を複雑にする
ことなく、外部からの輻射熱を簡易に遮蔽する構成によ
り冷却効果を高めることを可能にした冷却型赤外線検知
器を提供することを目的としている。In view of these circumstances, it is an object of the present invention to provide a cooled infrared detector that makes it possible to enhance the cooling effect by simply shielding radiant heat from the outside without complicating the internal configuration. The purpose is
本発明は、上記問題点を解決するため、外囲器により密
封された検知器内の赤外線検知素子及び冷却手段と外囲
器との間に、外部輻射熱遮蔽用の金属薄膜ベロー形状か
らなるシールド構造体を設けて、外部からの輻射熱、伝
導熱の浸入を阻止するように構成されている。In order to solve the above-mentioned problems, the present invention provides a shield consisting of a bellows-shaped metal thin film for shielding external radiant heat between the infrared sensing element and cooling means in the detector sealed by the envelope and the envelope. A structure is provided to prevent radiant heat and conductive heat from entering from the outside.
このように構成された冷却型赤外線検知器においては、
外部からの輻射熱が前記金属薄膜ベロー形状からなるシ
ールド構造体の外周面により反射遮断されると共に、熱
伝導による浸入に対しても金属薄膜ベロー形状により熱
容量及び熱伝導性が小さいことから、熱浸入が大きく抑
止されるため、冷却効果が向上する。In a cooled infrared detector configured in this way,
Radiant heat from the outside is reflected and blocked by the outer peripheral surface of the shield structure made of the metal thin film bellows shape, and the metal thin film bellows shape has small heat capacity and thermal conductivity to prevent heat infiltration. is largely suppressed, improving the cooling effect.
以下図面を用いて本発明の実施例について詳細に説明す
る。Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明に係る冷却型赤外線検知器の一実施例を
電子冷却型赤外線検知器に通用した場合の例で示す概略
縦断面図である。FIG. 1 is a schematic vertical cross-sectional view showing an example of a cooling type infrared detector according to the present invention when it is applied to an electronically cooling type infrared detector.
図において、１は外囲器、２は外囲器１の一部を構成す
る基板（ステム）、３は略２００°Ｋ （−７０℃）に
冷却可能とした３段構造のペルチェ効果を利用した電子
冷却素子であり、該電子冷却素子３上に例えば水銀・カ
ドミウム・テルル（Ｈｇ、−ＸＣｄｘＴｅ）からなる赤
外線検知素子４が配置されている。In the figure, 1 is an envelope, 2 is a substrate (stem) that constitutes a part of the envelope 1, and 3 is a three-stage Peltier effect that can be cooled to approximately 200°K (-70°C). An infrared detecting element 4 made of, for example, mercury, cadmium, and tellurium (Hg, -XCdxTe) is disposed on the electronic cooling element 3.
又、このように配置された電子冷却素子３及び赤外線検
知素子４は、例えば約１００μｍ程度の厚さのニッケル
薄膜のベロー形状で、かつ検知素子４と対応する部分に
該検知素子４の視野角を規定するアパーチャを備えた外
部輻射熱遮蔽用シールド構造体２１が各要所で溶接固定
されて内設した赤外線透過窓６を有する外囲体５により
、図示のように密封されている。Furthermore, the electronic cooling element 3 and the infrared sensing element 4 arranged in this manner are made of a bellows-shaped nickel thin film with a thickness of about 100 μm, for example, and have a viewing angle of the sensing element 4 in a portion corresponding to the sensing element 4. A shield structure 21 for shielding external radiant heat, which is provided with an aperture that defines the radiant heat, is welded and fixed at each key point and sealed by an envelope 5 having an infrared transmitting window 6 therein, as shown in the figure.
更に基板２上に密封された外囲体５からなる外囲器１内
は、従来と同様に冷却効率を高めるために排気を行って
高真空状態とした構成とする。Furthermore, the inside of the envelope 1, which is made up of an envelope 5 sealed on the substrate 2, is evacuated to a high vacuum state in order to increase the cooling efficiency, as in the conventional case.
このようにアパーチャを備えた外部輻射熱遮蔽用シール
ド構造体２１を内設した構成とすることにより、外部か
らの輻射熱は該シールド構造体２１の外周面で反射遮断
されると共に、熱伝導による輻射熱の浸入に対しても、
金属薄膜ベロー形状により熱容量が小さく、熱伝導性も
小さいことから熱浸入が著しく低減され、冷却効果を向
上することが可能となる。By configuring the shield structure 21 for shielding external radiant heat provided with an aperture as described above, radiant heat from the outside is reflected and blocked by the outer peripheral surface of the shield structure 21, and radiant heat due to heat conduction is Also against infiltration,
The metal thin film bellows shape has a small heat capacity and low thermal conductivity, so heat penetration is significantly reduced, making it possible to improve the cooling effect.
尚、上記外部輻射熱遮蔽用の金属薄膜ベロー形状からな
るシールド構造体２１を形成する方法としては、先ず第
２図に示すように外形をベロー形状とした例えばアクリ
ル樹脂等からなる成形体３１を用意し、第３図に示すよ
うに該樹脂成形体３１の外周面に無電解メッキ法、或い
は電解メッキ法等により、例えば略１００μｍ程度の厚
さにニッケルメッキ膜３２を鍍着形成する。Incidentally, as a method for forming the shield structure 21 made of a metal thin film bellow shape for shielding external radiant heat, first, as shown in FIG. Then, as shown in FIG. 3, a nickel plating film 32 is formed on the outer peripheral surface of the resin molded body 31 to a thickness of about 100 μm, for example, by electroless plating or electrolytic plating.
その後、前記樹脂成形体３１のみを適当な溶剤により溶
かし、除去することによって第４図に示すように金属薄
膜のベロー形状からなるシールド構造体２１を容易に形
成することができる。Thereafter, by dissolving only the resin molded body 31 with a suitable solvent and removing it, it is possible to easily form a shield structure 21 made of a bellows-shaped metal thin film as shown in FIG.
以上の説明から明らかなように、本発明に係る冷却型赤
外線検知器の構成によれば、該検知器内の赤外線検知素
子及び冷却手段と外囲器との間に、外部輻射熱遮蔽用の
金属薄膜ベロー形状からなるシールド構造体を設けた簡
単な構成により、外部からの不要な輻射熱の浸入を大幅
に排除することが可能となる。As is clear from the above description, according to the configuration of the cooled infrared detector according to the present invention, a metal for shielding external radiant heat is provided between the infrared detecting element and the cooling means in the detector, and the envelope. With a simple configuration including a thin film bellows-shaped shield structure, it is possible to largely eliminate the intrusion of unnecessary radiant heat from the outside.
従って、内蔵する電子冷却素子の冷却性能が充分に発揮
され、検知素子を規定の低温状態に安定に冷却保持する
ことが出来、当該赤外線検知器の性能が向上する。Therefore, the cooling performance of the built-in electronic cooling element is fully exhibited, the detection element can be stably cooled and maintained at a prescribed low temperature, and the performance of the infrared detector is improved.
更に、本発明の外部輻射熱遮蔽用のシールド構造体は、
電子冷却型赤外線検知器に限らず、金属製のデユワ構造
体を主体とする液状冷媒による冷却型赤外線検知器に通
用することも可能であり、優れた効果を奏する。Furthermore, the shield structure for external radiant heat shielding of the present invention includes:
The present invention can be applied not only to electronically cooled infrared detectors but also to cooled infrared detectors using a liquid refrigerant mainly having a metal dewar structure, and provides excellent effects.
第１図は本発明に係る冷却型赤外線検知器の一実施例を
示す概略断面図、
第２図乃至第４図は本発明の冷却型赤外線検知器に用い
られる外部輻射熱遮蔽用シー
ルド構造体の形成方法を説明するため
の概略断面図、
第５図は従来の冷却型赤外線検知器の１例を示す概略断
面図である。
第１図乃至第４図において、
１は外囲器、２は基板（ステム）、３は電子冷却素子、
４は赤外線検知素子、５は外囲体、２１は外部輻射熱遮
蔽用シールド構造体、３１は樹脂成形体、３２はメ・ツ
キ第５図FIG. 1 is a schematic cross-sectional view showing an embodiment of a cooled infrared detector according to the present invention, and FIGS. 2 to 4 show a shield structure for shielding external radiant heat used in the cooled infrared detector of the present invention. A schematic sectional view for explaining the formation method. FIG. 5 is a schematic sectional view showing an example of a conventional cooled infrared detector. In FIGS. 1 to 4, 1 is an envelope, 2 is a substrate (stem), 3 is an electronic cooling element,
4 is an infrared detection element, 5 is an outer envelope, 21 is a shield structure for shielding external radiant heat, 31 is a resin molded body, and 32 is a metal fitting.
Claims (1)
囲器により密封してなる検知器の構成において、上記赤
外線検知素子及び冷却手段と外囲器との間に、外部輻射
熱遮蔽用のシールド構造体を設けたことを特徴とする冷
却型赤外線検知器。In the configuration of a detector in which an infrared detecting element and a means for cooling the detecting element are sealed in an envelope, a shield for shielding external radiant heat is provided between the infrared detecting element and the cooling means and the envelope. A cooled infrared detector characterized by having a structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60038050A JPS61195315A (en) | 1985-02-26 | 1985-02-26 | Cooling type infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60038050A JPS61195315A (en) | 1985-02-26 | 1985-02-26 | Cooling type infrared detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195315A true JPS61195315A (en) | 1986-08-29 |
Family
ID=12514690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60038050A Pending JPS61195315A (en) | 1985-02-26 | 1985-02-26 | Cooling type infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195315A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763885A (en) * | 1995-12-19 | 1998-06-09 | Loral Infrared & Imaging Systems, Inc. | Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays |
| JP2000183372A (en) * | 1998-12-10 | 2000-06-30 | Osaka Gas Co Ltd | Flame sensor |
-
1985
- 1985-02-26 JP JP60038050A patent/JPS61195315A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763885A (en) * | 1995-12-19 | 1998-06-09 | Loral Infrared & Imaging Systems, Inc. | Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays |
| JP2000183372A (en) * | 1998-12-10 | 2000-06-30 | Osaka Gas Co Ltd | Flame sensor |
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