JPS61195006A - Plane antenna - Google Patents

Plane antenna

Info

Publication number
JPS61195006A
JPS61195006A JP3551085A JP3551085A JPS61195006A JP S61195006 A JPS61195006 A JP S61195006A JP 3551085 A JP3551085 A JP 3551085A JP 3551085 A JP3551085 A JP 3551085A JP S61195006 A JPS61195006 A JP S61195006A
Authority
JP
Japan
Prior art keywords
dielectric layer
ground conductor
antenna
circuit board
microstrip line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3551085A
Other languages
Japanese (ja)
Inventor
Masaharu Miyanari
宮成 正治
Shuji Taniguchi
谷口 修治
Kazuo Nakamura
和生 中村
Sadaaki Kondo
近藤 定昭
Takeyoshi Fujii
藤井 猛美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3551085A priority Critical patent/JPS61195006A/en
Publication of JPS61195006A publication Critical patent/JPS61195006A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate

Abstract

PURPOSE:To reduce the warp of a circuit board and to prevent the mismatching of the impedance of a plane antenna by providing protrusively a reinforcing rib in the outer periphery of a ground conductor formed on the back surface of the dielectric layer of an antenna circuit board. CONSTITUTION:The ground conductor 4 is coated on the back surface of the dielectric layer 3 of the antenna circuit board 1 comprising the plane antenna, and a microstrip line 5 made of a metallic foil is formed on the surface of the dielectric layer 3. The strip line 5 is coated with a protective film 6 to protect the strip line. The reinforcing rib 7 is protrusively provided in the outer periphery of the ground conductor 4. Then the warp of the circuit board 1 is reduced to prevent a drop in gains due to the mismatching of the impedance of the plane antenna, thereby improving gains of the plane antenna.

Description

【発明の詳細な説明】[Detailed description of the invention] 【技術分野】【Technical field】

本発明は、マイクロ波通信、衛生通信などに用いる平面
アンテナに関する。
The present invention relates to a planar antenna used for microwave communication, satellite communication, etc.

【背景技術】[Background technology]

従来にあっては、第5図に示すように、平板状の地導体
4の上に誘電体層3を重ね、その上にマフイルムロを重
ね、これら各層間に接着剤(図示せず)を介在させ、ホ
ットプレスにより接着して一体化し、平面アンテナを形
成していた。そしてこれらには次のような材料が用いら
れていた。 保1フィルム6・・・・・・例えばポリエチレンテレ7
タレー) (100μ働厚)のような可視性フィルム 誘電体層3・・・・・・低誘電率のテフロンやポリエチ
レン(1mai厚) 地導体4・・・・・・アルミニウム板(2+a−厚)マ
イクロストリップライン5・・・・・・アルミニウム箔
(20μ−厚)や銅箔(35μm厚)このような構成、
使用材料の平面アンテナにおいては、地導体4と誘電体
N3及び保護フィルム6の總膨張係数や縦弾性係数の違
いによる歪みが生じ、その結果反りが発生し、アンテナ
としての指向特性やインビーグンス整合が悪くなり、利
得低下を招(という問題点があった。 尚、ホットプレスにより地導体4、誘電体M3、町)々
hツL 11−、−4ノ11ζ’nttPl噛7ノ先り
らを接着する時に、溶融状態にある誘電体N3が地導体
4の上面から流出し、完成時の誘電体層3の厚さが不均
一になり、その結果インピーダンスの不整合を生じると
いう問題もあった。
Conventionally, as shown in Fig. 5, a dielectric layer 3 is layered on a flat ground conductor 4, a layer of maffil is layered on top of the dielectric layer 3, and an adhesive (not shown) is interposed between these layers. They were then glued together using hot pressing to form a planar antenna. The following materials were used for these: Protective film 6...For example, polyethylene tele7
Dielectric layer 3: Low dielectric constant Teflon or polyethylene (1 mai thickness) Ground conductor 4: Aluminum plate (2+a-thickness) Microstrip line 5... Aluminum foil (20 μm thick) or copper foil (35 μm thick) such a configuration,
In the planar antenna using materials, distortion occurs due to differences in the coefficient of expansion and modulus of longitudinal elasticity between the ground conductor 4, the dielectric N3, and the protective film 6, resulting in warping, which causes the antenna's directional characteristics and in-begence matching to deteriorate. (There was a problem that the ground conductor 4, dielectric material M3, and M3) were bonded together by hot pressing, leading to a decrease in gain. At this time, the dielectric N3 in a molten state flows out from the upper surface of the ground conductor 4, and the thickness of the completed dielectric layer 3 becomes non-uniform, resulting in impedance mismatch.

【発明の目的】[Purpose of the invention]

本発明は叙上のような技術的背景に鑑みて為されたもの
であり、その目的とするところは平面アンテナとしての
反りを少なくでき、この結果インピーダンスの不整合を
少なくできる平面7ンテナを提供するにある。
The present invention was made in view of the above-mentioned technical background, and its purpose is to provide a planar 7 antenna that can reduce warpage as a planar antenna and, as a result, reduce impedance mismatch. There is something to do.

【発明の開示】[Disclosure of the invention]

本発明の平面アンテナは、地導体4の面上に接着される
誘電体層3の上に金属箔からなるマイクロストリップラ
イン5を配設し、マイクロストリブライン5の上からマ
イクロストリップライン5を保護するための保護フィル
ム6を接着させてアンテナ用回路基板lを形成し、地導
体4の外周部に補強リブ7を突出させて成ることを特徴
とするものであり、これによって前記本発明の目的を達
成で終るものである。即ち、地導体4の外周部に設けら
れた補強リブ7により平面アンテナの強度が向上させら
れ、平面アンテナに反りが発生したりすることがなく、
平面アンテナの指向特性やインピーダンスの整合を確保
することができるようになったものである。尚、補強リ
ブ7を誘電体層3側へ向けて突出させれば、補強リブ7
が堰の役目をしてホットプレス時の誘電体層3の流出を
防止し、誘電体層3の厚みを均一にすることができるも
のである。 以下本発明の実施例を添付図に基いて詳述する地導体4
はアースのための接地導体基板であって金属材料によっ
て形成されており、マイクロス)−リップライン5を形
成する金属箔と平行平面な層を形成して受信マイクロ波
を精度よく反射、伝送させる役目を有している。この地
導体4の上面にはポリエチレン等の誘電体層3が形成さ
れている地導体4の外周端縁は誘電体層3側へ向けてL
字状に折曲され、これによって地導体4外周部には補強
リブ7が突出させられており、これによって地導体4の
強度が向上させられ、地導体4ひいては平面アンテナの
平面強度が向上させられ、平面アンテナの反りやねじれ
などの発生が防止されるようになっている。*た、誘電
体層3はホットプレス時には流動状態となるが、補強リ
ブ7が堰の役目をして誘電体層3が地導体4の外へ流出
するのを防止し、誘電体層−3を均一な厚みに成形する
ことを可能にしている。この補強リブ7を設ける位置は
、補強のためだけであれば地導体4の一辺だけでも可能
であるが、二辺以上に設けるのが好ましい。即ち、第2
図のイ辺及び0辺(2辺)、ハ辺及び二辺(2辺)、イ
辺及び二辺(2辺)、ハ辺及び口辺(2辺)、イ辺及び
口辺及びハ辺(3辺)、イ辺及び口辺及びハ辺及び二辺
(4辺)などに設けるのが好ましい。そして、誘電体層
3の上には金属箔からなる導体切片群によって一定のパ
ターンに形成されたマイクロストリップライン5が積層
され、マイクロストリップライン5の上にはマイクロス
トリップライン5を保護するための保護フィルム6が積
層され、各層間に接着シートを介在さ用回路基板1が構
成され、アンテナ用回路基板1とコンバータ(図示せず
)とで平面アンテナが構成される。 第3図に示すものは本発明の他側であり、地導体4の端
部を誘電体層3の方へ向けて断面U字状に突曲させ、誘
電体層3側へ突出する補強リブ7を形成したものである
。 第4図に示すものは本発明の更に他側であり、地導体4
の外周端部を誘電体層3とは反対方向へ断面り字状に屈
曲させて誘電体層3とは反対側へ補強リブ7を突出させ
たものである。
In the planar antenna of the present invention, a microstrip line 5 made of metal foil is arranged on a dielectric layer 3 bonded on the surface of a ground conductor 4, and the microstrip line 5 is protected from above the microstrip line 5. The antenna circuit board 1 is formed by adhering a protective film 6 for the antenna, and reinforcing ribs 7 are protruded from the outer periphery of the ground conductor 4, thereby achieving the object of the present invention. It ends with the achievement of. That is, the strength of the planar antenna is improved by the reinforcing ribs 7 provided on the outer periphery of the ground conductor 4, and the planar antenna does not warp.
This makes it possible to ensure matching of the directional characteristics and impedance of the planar antenna. Note that if the reinforcing ribs 7 are made to protrude toward the dielectric layer 3 side, the reinforcing ribs 7
serves as a dam to prevent the dielectric layer 3 from flowing out during hot pressing, and to make the thickness of the dielectric layer 3 uniform. A ground conductor 4 according to an embodiment of the present invention will be described below in detail based on the attached drawings.
is a grounding conductor substrate for grounding and is made of a metal material, forming a plane parallel to the metal foil forming the lip line 5 to accurately reflect and transmit received microwaves. It has a role. A dielectric layer 3 made of polyethylene or the like is formed on the upper surface of the ground conductor 4. The outer peripheral edge of the ground conductor 4 is oriented L toward the dielectric layer 3.
The reinforcing ribs 7 are made to protrude from the outer periphery of the ground conductor 4, thereby improving the strength of the ground conductor 4, and thus the planar strength of the ground conductor 4 and the planar antenna. This prevents the flat antenna from warping or twisting. *Although the dielectric layer 3 is in a fluid state during hot pressing, the reinforcing ribs 7 act as a dam to prevent the dielectric layer 3 from flowing out of the ground conductor 4, and the dielectric layer-3 This makes it possible to mold to a uniform thickness. The reinforcing ribs 7 can be provided on only one side of the ground conductor 4 for reinforcement purposes, but it is preferable to provide them on two or more sides. That is, the second
A side and 0 side (2 sides), C side and 2 sides (2 sides), A side and 2 sides (2 sides), C side and mouth side (2 sides), A side, mouth side, and C side of the diagram It is preferable to provide it on the (3 sides), the A side, the mouth side, the C side, and the second side (4 sides). Then, on the dielectric layer 3, a microstrip line 5 formed in a certain pattern by a group of conductor sections made of metal foil is laminated, and on top of the microstrip line 5, a layer for protecting the microstrip line 5 is laminated. The protective film 6 is laminated with an adhesive sheet interposed between each layer to form a circuit board 1, and the antenna circuit board 1 and a converter (not shown) form a planar antenna. What is shown in FIG. 3 is the other side of the present invention, in which the end of the ground conductor 4 is bent toward the dielectric layer 3 in a U-shaped cross section, and a reinforcing rib protrudes toward the dielectric layer 3. 7 was formed. What is shown in FIG. 4 is yet another aspect of the present invention, in which the ground conductor 4
The outer peripheral end portion of the reinforcing rib 7 is bent in the direction opposite to the dielectric layer 3 in a cross-sectional shape, so that the reinforcing rib 7 protrudes toward the side opposite to the dielectric layer 3.

【発明の効果】【Effect of the invention】

本発明は、叙述のごとく地導体の面上に接着される誘電
体層の上に金属箔からなるマイクロストリップラインを
配設し、マイクロストリップラインの上からマイクロス
トリップラインを保護するための保l[フィルムを接着
させてアンテナ用回路基板を形成し、地導体の外周部に
補強リブを突出させであるから、補強リブにより地導体
ひいてはW苓マ ・l 早キめ品lり醜廖シイ白 μへ
赫ム i   逗面7ンテナの反りが減少させられ、指
向特性がよく、インピーダンスの整合もよく、アンテナ
利得の高い平面アンテナを得ることができるという利点
がある。 尚、補強リプを誘電体層側へ向けて突出させれば、補強
リプが堰の役目をしてホットプレス時の誘電体層の流出
を防止し、誘電体層の厚みを均一にすることができるも
のである。
As described above, the present invention arranges a microstrip line made of metal foil on a dielectric layer bonded on the surface of a ground conductor, and provides protection for protecting the microstrip line from above the microstrip line. [The antenna circuit board is formed by adhering the film, and the reinforcing ribs are protruded from the outer periphery of the ground conductor. There are advantages in that the warpage of the antenna is reduced, the directivity is good, the impedance matching is good, and a planar antenna with high antenna gain can be obtained. In addition, if the reinforcing lip is made to protrude toward the dielectric layer side, the reinforcing lip will act as a dam to prevent the dielectric layer from flowing out during hot pressing and make the thickness of the dielectric layer uniform. It is possible.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す断面図、第2図は同上
の斜視図、第3図は本発明の他例を示す断面図、第4図
は本発明の更に他例を示す断面図第5図は従来例を示す
断面図であり、1はアンテナ用回路基板、3は誘電体層
、4は地導体、5はマイクロストリップライン、6は保
lフィルム、7は補強リプである。 代理人 弁理士 石 1)艮 七 第1図 第2図
FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a perspective view of the same as above, FIG. 3 is a sectional view showing another example of the invention, and FIG. Cross-sectional view Figure 5 is a cross-sectional view showing a conventional example, in which 1 is an antenna circuit board, 3 is a dielectric layer, 4 is a ground conductor, 5 is a microstrip line, 6 is an insulation film, and 7 is a reinforcing lip. be. Agent Patent Attorney Ishi 1) Ai 7 Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] (1)地導体の面上に接着される誘電体層の上に金属箔
からなるマイクロストリップラインを配設し、マイクロ
ストリップラインの上からマイクロストリップラインを
保護するための保護フィルムを接着させてアンテナ用回
路基板を形成し、地導体の外周部に補強リブを突出させ
て成ることを特徴とする平面アンテナ。
(1) A microstrip line made of metal foil is placed on the dielectric layer that is adhered to the surface of the ground conductor, and a protective film is adhered on top of the microstrip line to protect the microstrip line. A planar antenna characterized by forming an antenna circuit board and having reinforcing ribs protruding from the outer periphery of a ground conductor.
JP3551085A 1985-02-25 1985-02-25 Plane antenna Pending JPS61195006A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3551085A JPS61195006A (en) 1985-02-25 1985-02-25 Plane antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3551085A JPS61195006A (en) 1985-02-25 1985-02-25 Plane antenna

Publications (1)

Publication Number Publication Date
JPS61195006A true JPS61195006A (en) 1986-08-29

Family

ID=12443754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3551085A Pending JPS61195006A (en) 1985-02-25 1985-02-25 Plane antenna

Country Status (1)

Country Link
JP (1) JPS61195006A (en)

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