JPS61193688U - - Google Patents
Info
- Publication number
- JPS61193688U JPS61193688U JP7784285U JP7784285U JPS61193688U JP S61193688 U JPS61193688 U JP S61193688U JP 7784285 U JP7784285 U JP 7784285U JP 7784285 U JP7784285 U JP 7784285U JP S61193688 U JPS61193688 U JP S61193688U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- semiconductor device
- contact pin
- view
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
第1図および第2図はこの考案の一実施例を示
す半導体素子載置用ソケツトを分離した平面図と
断面図、第3図〜第5図は組立状態の平面図と側
面図および断面図、第6図〜第8図は半導体素子
の実装時の平面図と側面図および断面図、第9図
および第10図は従来の半導体素子載置用ソケツ
トの平面図と断面図、第11図および第12図は
同じく半導体素子の実装状態の平面図と断面図で
ある。
1……コンタクトピン、2……半導体素子、3
……リード、6……ケーブル、7……半田、8…
…プレート、9……プレート本体、10……端板
、9a,10a……割型孔、11……固定部材。
なお、図中、同一符号は同一又は相当部分を示す
。
FIGS. 1 and 2 are an separated plan view and a sectional view of a socket for mounting a semiconductor element showing an embodiment of this invention, and FIGS. 3 to 5 are a plan view, a side view, and a sectional view of the assembled state. , FIGS. 6 to 8 are a plan view, a side view, and a sectional view when a semiconductor element is mounted, FIGS. 9 and 10 are a plan view and a sectional view of a conventional socket for mounting a semiconductor element, and FIG. 12 are a plan view and a sectional view of the semiconductor element in a mounted state. 1...Contact pin, 2...Semiconductor element, 3
...Lead, 6...Cable, 7...Solder, 8...
... Plate, 9 ... Plate main body, 10 ... End plate, 9a, 10a ... Split hole, 11 ... Fixing member.
In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ピン、このピンを固定するプレートと、コンタク
トピンに電気的に接続されたケーブルとからなる
半導体素子載置用ソケツトにおいて、プレートは
コンタクトピンを挾持する割型とし、このプレー
トを固定部材で接合固定することを特徴とする半
導体素子載置用ソケツト。 In a socket for mounting a semiconductor device, which consists of a contact pin for inserting and connecting the lead of a semiconductor device, a plate for fixing this pin, and a cable electrically connected to the contact pin, the plate is a split type that holds the contact pin. A socket for mounting a semiconductor device, characterized in that the plate is bonded and fixed by a fixing member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7784285U JPS61193688U (en) | 1985-05-25 | 1985-05-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7784285U JPS61193688U (en) | 1985-05-25 | 1985-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61193688U true JPS61193688U (en) | 1986-12-02 |
Family
ID=30621276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7784285U Pending JPS61193688U (en) | 1985-05-25 | 1985-05-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61193688U (en) |
-
1985
- 1985-05-25 JP JP7784285U patent/JPS61193688U/ja active Pending
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