JPS61190996A - Plasma smear remover - Google Patents
Plasma smear removerInfo
- Publication number
- JPS61190996A JPS61190996A JP3030485A JP3030485A JPS61190996A JP S61190996 A JPS61190996 A JP S61190996A JP 3030485 A JP3030485 A JP 3030485A JP 3030485 A JP3030485 A JP 3030485A JP S61190996 A JPS61190996 A JP S61190996A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- smear
- printed circuit
- circuit board
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
未発明はプリント基板のスルーホールスミア除去ｒこ係
り、特に従来の濃硫酸による湿式では除去不可能な微細
なスルーホールに好適な、ガスプラズマ１こよるスミア
除去装置に関する。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to through-hole smear removal of printed circuit boards, and gas plasma 1 is particularly suitable for fine through-holes that cannot be removed by the conventional wet method using concentrated sulfuric acid. This invention relates to a smear removal device.
従来のプラズマスミア除去装置は、例えば、米国特許第
４，３２８，０８１号明細書ｔこ記載のように多数のプ
リント基板を一つの真空容器内ｔごて処理する構造であ
りプリント基板の加熱１こりぃては配慮さルていなかっ
た。この種の装置として関連するものｔこは米国特許４
，２８９．５９８号明細書に記載のものが挙げられる。A conventional plasma smear removal apparatus has a structure in which a large number of printed circuit boards are processed using a trowel in one vacuum container, as described in, for example, US Pat. No. 4,328,081. Coryte was not given any consideration. A related device of this type is U.S. Pat.
, 289.598.
未発明の目的はプラズマ処理前あるいは処理中にプリン
ト基板を加熱することによりガスプラズマ中の酸素原子
と高分子材料であるスミアとの反応速度を高め短時間に
てスミアを除去することができ処理能力を向上できるプ
ラズマスミア除去装置を提供することにある。The purpose of this invention is to heat the printed circuit board before or during plasma processing to increase the reaction rate between oxygen atoms in gas plasma and smear, which is a polymeric material, and to remove smear in a short time. An object of the present invention is to provide a plasma smear removal device that can improve performance.
プリント基板のスルーホールスミアを酸素Ｏ曾と四沸化
炭素ＣＦ、との混含ガスプラズマにて除去する際の反応
はガスプラズマ中の酸素原子と高分子材料であるスミア
の化学反応によるものである。The reaction when removing through-hole smears from printed circuit boards with a gas plasma containing oxygen O and carbon tetrafluoride is a chemical reaction between the oxygen atoms in the gas plasma and the smear, which is a polymeric material. be.
従ってこの化学反応を促進させるには反応物質の加熱が
有効である。その−例として被エツチング材のエツチン
グ買置にて比較すると基板温度２５℃で１０分間処理し
た場合のエツチング歎は８．５” ｇ ｓ一方９０’Ｃ
Ｃ加熱したものは１１ｍｇであり明らかｔこ加熱により
エツチング量が増加している。Therefore, heating the reactants is effective in promoting this chemical reaction. As an example, when comparing the etching process of the material to be etched, the etching temperature when processed for 10 minutes at a substrate temperature of 25°C is 8.5" g s, whereas it is 90'C.
The amount of the sample heated with C was 11 mg, and it was clear that the amount of etching increased due to the heating.
以下１本発明の一実施例を第】図により説明する。第１
図で、１は真空容器でありその下面に１０の排気口が設
けらｒ、］１の真空ポンプにより排気を行なう。また真
空容器内には絶縁材３を介して上電極２が固定さｒ、高
周波電源】２Ｐ：より高周波電圧が印加される。また上
電極４ｃは反応ガス導入口６が設けらｎ反応ガスを真空
容器内に導入する。さらに上電ｉｈ４には、加熱手段、
例えば、リング状のランプヒータ７が設けらｒ、また、
こ灸
のランプヒータ７は石メカバー５によりプラズマから保
護されている。この装置によれば真空容器】内を真空排
気後反応ガスを導入し同時ｔこランプヒータ７ｔこより
上下電極間ｃｌかｒたプリント基板９を加熱しながら高
周波を印加しプラズマｔこよりスミアを除去できるので
プリント基板９文び反応ガスの加熱効果により化学的反
応が促進され短時間でのスミア除去ができる。尚、ラン
プヒータフの制御は外部に設けられたヒータコントロー
ラ８１こより任意となり、プリント基板９の温匿モニタ
ーとともに装置の自動化も可能となる。An embodiment of the present invention will be explained below with reference to the drawings. 1st
In the figure, reference numeral 1 denotes a vacuum container, and 10 exhaust ports are provided on the lower surface of the container, and evacuation is performed by a vacuum pump 1. Further, an upper electrode 2 is fixed in the vacuum container via an insulating material 3, and a high frequency voltage is applied to the high frequency power source 2P. The upper electrode 4c is also provided with a reactive gas inlet 6 for introducing reactive gas into the vacuum vessel. Furthermore, the upper electric ih4 has a heating means,
For example, a ring-shaped lamp heater 7 is provided, and
The moxibustion lamp heater 7 is protected from plasma by a stone cover 5. According to this device, after evacuating the inside of the vacuum container, a reaction gas is introduced, and at the same time, high frequency is applied while heating the printed circuit board 9 between the upper and lower electrodes using the lamp heater 7t, and smear can be removed from the plasma t. Therefore, the chemical reaction is promoted by the heating effect of the printed circuit board 9 and the reaction gas, and the smear can be removed in a short time. Incidentally, the lamp heater tube can be controlled arbitrarily by the heater controller 81 provided externally, and the temperature monitoring of the printed circuit board 9 and the automation of the apparatus are also possible.
第２図は、本発明の他の実施例を示すもので、真空容器
１にゲートバルブ１３を介して池の真空容器５を設はロ
ードロック室として使用しこの容器５内に加熱手段とし
てパネルヒータ７′を設は真空容器１１ごてプラズマ処
理中に次のプリント基板１６を加熱しプリント基板９の
処理完了とともをこプリント基板】６を真空容器】に移
せば基板加熱とプラズマ処理が個別にかつ連続して行な
える。FIG. 2 shows another embodiment of the present invention, in which a pond vacuum container 5 is installed in the vacuum container 1 through a gate valve 13, and is used as a load lock chamber, and a panel is installed in the container 5 as a heating means. The heater 7' is installed in the vacuum chamber 11 to heat the next printed circuit board 16 during plasma processing, and when the processing of the printed circuit board 9 is completed, the printed circuit board 6 is transferred to the vacuum chamber to complete the substrate heating and plasma processing. Can be done individually and consecutively.
尚、第２図で、その他第１図と同一装置１部品等は同一
符号で示し説明を省略する。また加熱手段として、この
池に加熱した不活性ガスあるいは反応ガスを熱媒体とす
る加熱手段を用いても同様の効果を得ることかでまる。In FIG. 2, other parts of the device that are the same as those in FIG. 1 are designated by the same reference numerals and their explanations will be omitted. Furthermore, the same effect can be obtained by using, as a heating means, a heating means using an inert gas heated in this pond or a reaction gas as a heating medium.
未発明は、以上説明したよう？こ、プラズマ処理訂ある
いは処理中にプリント基板を効果的に加熱することがで
ｔ、この加熱によりスミア除去速度が大ぎくなり装置の
処理能力を向上できるという効果がある。Is uninvented as explained above? By effectively heating the printed circuit board during plasma processing or processing, this heating increases the smear removal rate and has the effect of improving the throughput of the apparatus.
第１図は、大発明によるプラズマスミア除去装置の一実
施例を示す装置断面図、第２図、大発明によるプラズマ
スミア除去装置の池の実施例を示す装置断面図である。
７・・・・・・ランプヒータ、８・・−・・ヒータコン
トローラ、９・・・・・・プリント基板、７′・・曲パ
ネルヒータ。
８′・・・・・・ヒータコントローラ、】６・・・・・
・プリント基厨FIG. 1 is a cross-sectional view of an embodiment of the plasma smear removal apparatus according to the invention, and FIG. 2 is a cross-sectional view of the plasma smear removal apparatus according to the invention. 7... Lamp heater, 8... Heater controller, 9... Printed circuit board, 7'... Curved panel heater. 8'... Heater controller, ]6...
・Print kitchen
Claims (1)
ミアを除去する装置に於いて、前記プリント基板を加熱
する加熱手段を設けたことを特徴とするプラズマスミア
除去装置。1. A plasma smear removal apparatus for removing through-hole smear on a printed circuit board using gas plasma, characterized in that the apparatus is provided with a heating means for heating the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030485A JPS61190996A (en) | 1985-02-20 | 1985-02-20 | Plasma smear remover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030485A JPS61190996A (en) | 1985-02-20 | 1985-02-20 | Plasma smear remover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190996A true JPS61190996A (en) | 1986-08-25 |
Family
ID=12300012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3030485A Pending JPS61190996A (en) | 1985-02-20 | 1985-02-20 | Plasma smear remover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190996A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232120A (en) * | 2001-01-31 | 2002-08-16 | Hamamatsu Photonics Kk | Surface treating apparatus for board |
-
1985
- 1985-02-20 JP JP3030485A patent/JPS61190996A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232120A (en) * | 2001-01-31 | 2002-08-16 | Hamamatsu Photonics Kk | Surface treating apparatus for board |
| JP4509404B2 (en) * | 2001-01-31 | 2010-07-21 | 浜松ホトニクス株式会社 | Substrate surface treatment equipment |
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