JPS61190145U - - Google Patents
Info
- Publication number
- JPS61190145U JPS61190145U JP7429885U JP7429885U JPS61190145U JP S61190145 U JPS61190145 U JP S61190145U JP 7429885 U JP7429885 U JP 7429885U JP 7429885 U JP7429885 U JP 7429885U JP S61190145 U JPS61190145 U JP S61190145U
- Authority
- JP
- Japan
- Prior art keywords
- mold part
- terminal
- package type
- flat package
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7429885U JPS61190145U (sl) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7429885U JPS61190145U (sl) | 1985-05-20 | 1985-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190145U true JPS61190145U (sl) | 1986-11-27 |
Family
ID=30614465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7429885U Pending JPS61190145U (sl) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190145U (sl) |
-
1985
- 1985-05-20 JP JP7429885U patent/JPS61190145U/ja active Pending