JPS61190135U - - Google Patents
Info
- Publication number
- JPS61190135U JPS61190135U JP7426585U JP7426585U JPS61190135U JP S61190135 U JPS61190135 U JP S61190135U JP 7426585 U JP7426585 U JP 7426585U JP 7426585 U JP7426585 U JP 7426585U JP S61190135 U JPS61190135 U JP S61190135U
- Authority
- JP
- Japan
- Prior art keywords
- winding
- wire
- bonding wire
- layers
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Description
第１図は本考案のパツケージを示す図である。
第２図は従来のパツケージを示す図である。
FIG. 1 is a diagram showing a package of the present invention.
FIG. 2 is a diagram showing a conventional package.
Claims (1)
きに多層に巻き付けて構成されたボンデイングワ
イヤー供給用パツケージにおいて、該ワイヤーの
巻き付け幅が１０〜１００層毎に巻き付け幅の両
端部でそれぞれワイヤー直径の１〜２０倍宛広く
されてなるボンデイングワイヤー供給用パツケー
ジ。 In a bonding wire supply package configured by winding bonding wire in multiple layers on a winding member in a cross-wound manner, the winding width of the wire is 1 to 20 times the wire diameter at both ends of the winding width for every 10 to 100 layers. A package for supplying bonding wire that is widely used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7426585U JPS61190135U (en) | 1985-05-21 | 1985-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7426585U JPS61190135U (en) | 1985-05-21 | 1985-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190135U true JPS61190135U (en) | 1986-11-27 |
Family
ID=30614401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7426585U Pending JPS61190135U (en) | 1985-05-21 | 1985-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190135U (en) |
-
1985
- 1985-05-21 JP JP7426585U patent/JPS61190135U/ja active Pending
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