JPS61188363U - - Google Patents

Info

Publication number
JPS61188363U
JPS61188363U JP1985071960U JP7196085U JPS61188363U JP S61188363 U JPS61188363 U JP S61188363U JP 1985071960 U JP1985071960 U JP 1985071960U JP 7196085 U JP7196085 U JP 7196085U JP S61188363 U JPS61188363 U JP S61188363U
Authority
JP
Japan
Prior art keywords
bent
semiconductor element
heat sink
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985071960U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985071960U priority Critical patent/JPS61188363U/ja
Publication of JPS61188363U publication Critical patent/JPS61188363U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1985071960U 1985-05-15 1985-05-15 Pending JPS61188363U (no)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985071960U JPS61188363U (no) 1985-05-15 1985-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985071960U JPS61188363U (no) 1985-05-15 1985-05-15

Publications (1)

Publication Number Publication Date
JPS61188363U true JPS61188363U (no) 1986-11-25

Family

ID=30609925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985071960U Pending JPS61188363U (no) 1985-05-15 1985-05-15

Country Status (1)

Country Link
JP (1) JPS61188363U (no)

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