JPS61188361U - - Google Patents
Info
- Publication number
- JPS61188361U JPS61188361U JP1985070507U JP7050785U JPS61188361U JP S61188361 U JPS61188361 U JP S61188361U JP 1985070507 U JP1985070507 U JP 1985070507U JP 7050785 U JP7050785 U JP 7050785U JP S61188361 U JPS61188361 U JP S61188361U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealing frame
- adhesive
- sealing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985070507U JPS61188361U (enExample) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985070507U JPS61188361U (enExample) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61188361U true JPS61188361U (enExample) | 1986-11-25 |
Family
ID=30607141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985070507U Pending JPS61188361U (enExample) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188361U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106257652A (zh) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | 封装模块 |
-
1985
- 1985-05-15 JP JP1985070507U patent/JPS61188361U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106257652A (zh) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | 封装模块 |
| US10123428B2 (en) | 2015-06-16 | 2018-11-06 | Delta Electronics (Shanghai) Co., Ltd. | Package module |
| US10314178B2 (en) | 2015-06-16 | 2019-06-04 | Delta Electronics (Shanghai) Co., Ltd. | Package module |