JPS61188361U - - Google Patents
Info
- Publication number
- JPS61188361U JPS61188361U JP1985070507U JP7050785U JPS61188361U JP S61188361 U JPS61188361 U JP S61188361U JP 1985070507 U JP1985070507 U JP 1985070507U JP 7050785 U JP7050785 U JP 7050785U JP S61188361 U JPS61188361 U JP S61188361U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealing frame
- adhesive
- sealing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の素子封止体の実施例であり、
ａは斜視図、ｂはＡ―Ａ′における切断面図、ｃ
は接着剤を塗布した基板の平面図である。第２図
は従来の素子封止体の第１例であり、ａは斜視図
、ｂはＢ―Ｂ′における切断面図である。第３図
は従来の素子封止体の第２例であり、ａは斜視図
、ｂはＣ―Ｃ′における切断面図である。 １……封止枠体、２……基板、３……接着剤、
３ａ，３ｂ，３ｃ，３ｄ……接着剤塗布部、４…
…封止剤、５……素子。
ａは斜視図、ｂはＡ―Ａ′における切断面図、ｃ
は接着剤を塗布した基板の平面図である。第２図
は従来の素子封止体の第１例であり、ａは斜視図
、ｂはＢ―Ｂ′における切断面図である。第３図
は従来の素子封止体の第２例であり、ａは斜視図
、ｂはＣ―Ｃ′における切断面図である。 １……封止枠体、２……基板、３……接着剤、
３ａ，３ｂ，３ｃ，３ｄ……接着剤塗布部、４…
…封止剤、５……素子。
Claims (1)
- 基板と、該基板に搭載された素子と、上記基板
上に離散的に接着剤を塗布する事により上記素子
を囲う様に上記基板と接着した封止枠体と、上記
素子と上記封止枠体との間隙に注入された封止剤
とを有する素子封止体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985070507U JPS61188361U (ja) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985070507U JPS61188361U (ja) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61188361U true JPS61188361U (ja) | 1986-11-25 |
Family
ID=30607141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985070507U Pending JPS61188361U (ja) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188361U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106257652A (zh) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | 封装模块 |
-
1985
- 1985-05-15 JP JP1985070507U patent/JPS61188361U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106257652A (zh) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | 封装模块 |
| US10123428B2 (en) | 2015-06-16 | 2018-11-06 | Delta Electronics (Shanghai) Co., Ltd. | Package module |
| US10314178B2 (en) | 2015-06-16 | 2019-06-04 | Delta Electronics (Shanghai) Co., Ltd. | Package module |