JPS61187318A - Manufacture of laminate film capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a multilayer film capacitor in which the means for forming a protective film layer is improved.

[Technical background of the invention and its problems 1 Generally, the manufacturing method of multilayer film capacitors involves winding a raw film around a large-diameter winding core to form an inner protective film layer, and winding a pair of metallized films on the inner protective film layer. Then, a raw film is wound on the old film layer as a capacitive layer to form an outer protective film layer, metallicon electrodes are formed on both end faces to form an ffl element, and the mother element is removed from the large-diameter winding core. A lead wire is attached to a metallic electrode of a unit element which can be cut in the radial direction using a rotating saw blade. Therefore, in order to form a capacitive layer on the inner protective film layer, a metallized film as a capacitive layer is inserted into the winding end of the raw film constituting the inner protective film layer and then wound. When inserting the metallized film, it is difficult to align it accurately with the end surface of the inner protective film layer, and several patterns of the inserted part protrude from the end surface of the inner protective film layer or are pulled inward, resulting in uneven end surfaces. There was a risk that this would occur. Therefore, when a metallicon electrode was subsequently formed, the protruding metallized film was folded or the metalized film drawn inward was in the shadow of the adjacent film, making it impossible to obtain a sufficient connection with the metallicon electrode. This has caused problems such as deterioration of tan δ characteristics and insufficient current strength. This problem also occurred when forming the outer protective film layer.

In addition, we do not want to cause any danger as mentioned above.ff1
The end face of the entire layer cannot be accurately aligned with the end faces of the inner protective film layer and the outer protective film layer, and the occurrence of a step at the boundary between the capacitor layer and both protective film layers cannot be avoided. This caused peeling due to mechanical stress in subsequent steps.

[Object of the Invention] The present invention has been made in view of the above points, and improves efficiency by eliminating the step difference between the end faces of the capacitive layer and the protective film layer.
In addition to the fact that there is no peeling between the layer and the protective film layer, the ta
It is an object of the present invention to provide a manufacturing method capable of obtaining a multilayer film capacitor with good nδ characteristics and high current intensity.

[Summary of the Invention] The method for manufacturing a laminated film capacitor of the present invention is such that when a pair of metallized films are wound around a large-diameter winding core to form a motherboard, the metal film at the beginning and end of the winding of the metallized film is burnout by electrical means immediately before winding,
The film is then heat-sealed to form an inner protective film layer and an outer protective film layer.

[Embodiments of the Invention] The present invention will be described in detail below. That is, FIG. 1 is a schematic diagram showing a manufacturing method according to an embodiment of the present invention, in which film feed rollers (1) and (2) are connected to film support rollers ( 3) When winding a pair of single-sided metallized films (5) and (6) separately fed out through (4) in a laminated manner on a large-diameter winding core (7), first the single-sided metalized films (5) ) (6) A roller electrode (
8) and a negatively applied aluminum foil electrode (9) and apply a voltage to burn out the metal film while winding it around the large-diameter winding core (1) to correspond to the winding core (7). The inner protective film layer (11) is formed by thermal Wi bonding using a heat sealing roller (10), and then the aluminum foil electrode (9) is attached to the metal of the single-sided metallized film (5) and (6). The aluminum foil electrode (9) is brought into contact with the metal surface of the single-sided metallized film (5) and (6) again, and a voltage is applied to form the metal film. While burning out the material, it is wound onto the above-mentioned container ff1JI (12) and integrated by heat sealing roller (10) to form an outer protective film layer (13), and then a large-diameter winding core (7) is rolled from a winding machine. After applying metallicon to both end faces and heat-treating it, the mother wood (15) is removed from the large-diameter winding core (7) as shown in Figures 2 and 3. ).

Next, the motherboard (15) is cut in the radial direction to obtain unit elements (16) as shown in FIG.

According to the manufacturing method of the multilayer film capacitor configured as described above, the inner protective film layer (11), the outer protective film layer (12) and the outer protective film layer (13) constituting the motherboard (15) are continuous. Since it is made of film, there is no need for the troublesome work of inserting a film during winding, the end faces are aligned correctly, the electrical connection with the metallicon electrode (14) is uniform, and there is no difference in level between each layer. Furthermore, as a result of the inner protective film layer (11) and outer protective film II (13) being integrated by heat sealing, the protective film layer (1
1) and the outer protective film layer (13), there is no peeling, so it has good workability and is strong against various stresses after it is formed into a unit element (16).
It has good δ characteristics and has a strong effect on current intensity.

Next, a comparison of characteristics between the present invention and a conventional reference example will be described. That is, using a single-sided metalized polyester film with a width of 5 μm x 87111 mm, a voltage of 20 V was applied between the roller electrode and the aluminum foil electrode to form an inner protective film layer and an outer protective film layer with a thickness of 0.5111 IlI, and two layers were used as the capacitive layer. The present invention (A) has a rating of 250V-0.1 μF, which is obtained by cutting a thick motherboard into a width of 7 m in the radial direction with a rotary saw blade, and a polyester raw film is used separately from the single-sided metalized polyester film that becomes the capacitive layer. Reference example (B) having the same size and same rating as the present invention (A) obtained by a conventional method in which a protective film layer and an outer protective film layer were formed.
tan δ characteristics and pulse width 10μ under IKIIZ with
As a result of examining the capacitance change rate with respect to the pulse current under conditions where the pulse current of s was stepped up 1000 times, the results were as shown in FIGS. 5 and 6. The number of samples (A) and (B) was 30 each.

As is clear from FIGS. 5 and 6, the present invention (8)
Compared to the conventional example (B), the absolute value and variation of tan δ are small and stable.Furthermore, in the present invention (A), no capacity decrease is observed up to a pulse current of 80A, whereas in the conventional example (B), the capacity decrease is not observed up to 80A. The capacitance decreased from 1 to 2, demonstrating the remarkable characteristic improvement effect of the present invention (A).

In the above embodiments, polynisal film was used as an example of the single-sided metallized film, but it goes without saying that other films can also be used.

[Effects of the Invention] According to the present invention, it is possible to obtain a method for manufacturing a multilayer film capacitor that facilitates the work of forming a mother element and causes less deterioration of characteristics.

[Brief explanation of drawings]

1 and 4 relate to the present invention; FIG. 1 is a schematic diagram showing a method for manufacturing a multilayer film capacitor according to an embodiment of the present invention, FIG. 2 is a perspective view showing a mother element, and FIG. Figure 2 is an enlarged sectional view, Figure 4 is a perspective view showing the unit element,
FIG. 5 is a tan δ characteristic comparison diagram, and FIG. 6 is a pulse current-capacitance change rate characteristic curve diagram. (5)(6)・・・Single-sided metallized film (7)・
...Large diameter winding core (11) ...Inner protective film layer (12) ...Capacity layer (13)
...Outer protective film layer (14) ...Metallicon electrode (15) ...Mother element patent
Applicant Marcon Electronics Co., Ltd. Figure 1 Figure 5 Figure 6

Claims (1)

[Claims] A pair of single-sided metallized films are laminated and wound around a large-diameter core.
In the manufacturing method of a multilayer film capacitor, which comprises forming a mother element by applying metallicon electrodes on both end faces and cutting it in the radial direction, an inner protective film layer and an outer protective film forming the winding start and end parts of the mother element are provided. A method for manufacturing a multilayer film capacitor, characterized in that the layer is made of a film obtained by electrically burning out the metal film of the pair of metallized films, and the films are further integrated by heat sealing.