JPS61185566U - - Google Patents

Info

Publication number
JPS61185566U
JPS61185566U JP1985066863U JP6686385U JPS61185566U JP S61185566 U JPS61185566 U JP S61185566U JP 1985066863 U JP1985066863 U JP 1985066863U JP 6686385 U JP6686385 U JP 6686385U JP S61185566 U JPS61185566 U JP S61185566U
Authority
JP
Japan
Prior art keywords
heat source
pipe
side plate
heat
reflective side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985066863U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0227970Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985066863U priority Critical patent/JPH0227970Y2/ja
Priority to KR1019860003541A priority patent/KR900001971B1/ko
Priority to EP86303465A priority patent/EP0201325B1/en
Priority to US06/860,789 priority patent/US4812620A/en
Publication of JPS61185566U publication Critical patent/JPS61185566U/ja
Application granted granted Critical
Publication of JPH0227970Y2 publication Critical patent/JPH0227970Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Control Of Resistance Heating (AREA)
JP1985066863U 1985-05-08 1985-05-08 Expired JPH0227970Y2 (enExample)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1985066863U JPH0227970Y2 (enExample) 1985-05-08 1985-05-08
KR1019860003541A KR900001971B1 (ko) 1985-05-08 1986-05-07 가공장치용 열원유니트
EP86303465A EP0201325B1 (en) 1985-05-08 1986-05-07 Heat source unit for processing apparatus
US06/860,789 US4812620A (en) 1985-05-08 1986-05-08 Concentrated radiant energy heat source unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985066863U JPH0227970Y2 (enExample) 1985-05-08 1985-05-08

Publications (2)

Publication Number Publication Date
JPS61185566U true JPS61185566U (enExample) 1986-11-19
JPH0227970Y2 JPH0227970Y2 (enExample) 1990-07-27

Family

ID=13328118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985066863U Expired JPH0227970Y2 (enExample) 1985-05-08 1985-05-08

Country Status (4)

Country Link
US (1) US4812620A (enExample)
EP (1) EP0201325B1 (enExample)
JP (1) JPH0227970Y2 (enExample)
KR (1) KR900001971B1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3737457A1 (de) * 1987-11-04 1989-05-18 Peter Gammelin Loetvorrichtung
DE3842641A1 (de) * 1988-12-18 1990-06-21 Thermal Quarz Schmelze Gmbh Steckbarer quarz-infrarotstrahler
US5128506A (en) * 1990-10-30 1992-07-07 Westinghouse Electric Corp. Method and apparatus for selective infrared soldering using shielding fixtures
US5444814A (en) * 1993-11-01 1995-08-22 Hofius, Sr.; David V. Method of infrared welding on thermoplastic parts utilizing contoured energy reflecting shields
FR2716302B1 (fr) * 1994-02-17 1996-04-05 Commissariat Energie Atomique Dispositif de chauffage pour la réalisation de connexions par un matériau fusible.
WO1999058283A1 (en) * 1998-05-14 1999-11-18 Plato Products, Inc. Polished soldering tip and method of manufacturing
US6041164A (en) * 1998-11-04 2000-03-21 Hofius, Sr.; David V. Expansion and mounting apparatus for infrared radiant energy source
US20030221783A1 (en) * 2000-05-10 2003-12-04 Swagelok Company Ir welding of fluoropolymers
US6426486B1 (en) * 2000-06-16 2002-07-30 Judco Manufacturing, Incorporated Optical apparatus and method for shrinking heat shrink tubing, fusing wires and solder and unsolder packaged electronic components
RU2192715C1 (ru) * 2001-07-13 2002-11-10 Институт физики им. Л.В.Киренского СО РАН Способ лазерной металлизации диэлектрической подложки
US7498538B1 (en) 2007-07-20 2009-03-03 Judco Manufacturing, Inc. Sliding contact switch
US7880107B1 (en) 2007-10-12 2011-02-01 Judco Manufacturing, Inc. Momentary push button switch
CN101308981A (zh) * 2008-07-11 2008-11-19 永泰电子（东莞）有限公司 一种运用红外线加热的焊接工艺及焊接装置
GB2468702A (en) * 2009-03-19 2010-09-22 Gew Ink curing apparatus with integrally formed reflector and cooling means
CN108040373B (zh) * 2017-12-11 2021-03-09 东莞市庆丰电工机械有限公司 光波辐射加热箱
US20250187093A1 (en) * 2023-12-08 2025-06-12 Hanon Systems Brazed components and improved method of manufacturing them

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439581A (en) * 1977-09-02 1979-03-27 Fujitsu Ltd Semiconductor memory device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2951928A (en) * 1959-05-13 1960-09-06 Quartz Products Corp Infrared heater
US3247383A (en) * 1960-04-05 1966-04-19 Minnesota Mining & Mfg Infra-red reflector assembly for thermographic copying machine
US3240915A (en) * 1962-09-19 1966-03-15 Fostoria Corp Infra-red heater
US3472721A (en) * 1966-01-24 1969-10-14 Research Inc Apparatus for lap joinder of plastic sheets
SE340257B (enExample) * 1968-11-13 1971-11-15 Infraroedteknik Ab
US3588425A (en) * 1969-07-03 1971-06-28 Control Data Corp Dual source radiation bonding of plural joints
US3674975A (en) * 1969-11-06 1972-07-04 Time Research Lab Inc Apparatus for assembling stacks
FR2098535A5 (en) * 1970-07-20 1972-03-10 Bull General Electric Soldering/unsoldering appts for used with printed circuit - assemblies eg memory matrices
US3794522A (en) * 1972-01-24 1974-02-26 Burroughs Corp Stripping insulated wire
US3862397A (en) * 1972-03-24 1975-01-21 Applied Materials Tech Cool wall radiantly heated reactor
US3879164A (en) * 1973-05-30 1975-04-22 Western Electric Co Method of isothermally heating articles with radiation
US3966308A (en) * 1974-05-01 1976-06-29 Infrarodteknik Ab Device for reflecting radiant energy
US4101759A (en) * 1976-10-26 1978-07-18 General Electric Company Semiconductor body heater
US4251305A (en) * 1978-11-01 1981-02-17 Baxter Travenol Laboratories, Inc. Method of radiant heat sealing of a balloon onto a catheter employing tinted shrink tubing
JPS61140368A (ja) * 1984-12-14 1986-06-27 Japan Ranpu Kk 非接触型のハンダ付け加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439581A (en) * 1977-09-02 1979-03-27 Fujitsu Ltd Semiconductor memory device

Also Published As

Publication number Publication date
JPH0227970Y2 (enExample) 1990-07-27
EP0201325A2 (en) 1986-11-12
KR900001971B1 (ko) 1990-03-27
EP0201325A3 (en) 1987-12-09
EP0201325B1 (en) 1992-04-01
KR860009606A (ko) 1986-12-23
US4812620A (en) 1989-03-14

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