JPS61183577U - - Google Patents
Info
- Publication number
- JPS61183577U JPS61183577U JP6684285U JP6684285U JPS61183577U JP S61183577 U JPS61183577 U JP S61183577U JP 6684285 U JP6684285 U JP 6684285U JP 6684285 U JP6684285 U JP 6684285U JP S61183577 U JPS61183577 U JP S61183577U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- circuit board
- printed circuit
- conductive pattern
- electrode piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6684285U JPS61183577U (ru) | 1985-05-08 | 1985-05-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6684285U JPS61183577U (ru) | 1985-05-08 | 1985-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61183577U true JPS61183577U (ru) | 1986-11-15 |
Family
ID=30600114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6684285U Pending JPS61183577U (ru) | 1985-05-08 | 1985-05-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61183577U (ru) |
-
1985
- 1985-05-08 JP JP6684285U patent/JPS61183577U/ja active Pending