JPS61183564U - - Google Patents
Info
- Publication number
- JPS61183564U JPS61183564U JP6775985U JP6775985U JPS61183564U JP S61183564 U JPS61183564 U JP S61183564U JP 6775985 U JP6775985 U JP 6775985U JP 6775985 U JP6775985 U JP 6775985U JP S61183564 U JPS61183564 U JP S61183564U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- tip
- flexible
- board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6775985U JPS61183564U (bs) | 1985-05-08 | 1985-05-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6775985U JPS61183564U (bs) | 1985-05-08 | 1985-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61183564U true JPS61183564U (bs) | 1986-11-15 |
Family
ID=30601876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6775985U Pending JPS61183564U (bs) | 1985-05-08 | 1985-05-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61183564U (bs) |
-
1985
- 1985-05-08 JP JP6775985U patent/JPS61183564U/ja active Pending