JPS61183542U - - Google Patents

Info

Publication number
JPS61183542U
JPS61183542U JP1985067465U JP6746585U JPS61183542U JP S61183542 U JPS61183542 U JP S61183542U JP 1985067465 U JP1985067465 U JP 1985067465U JP 6746585 U JP6746585 U JP 6746585U JP S61183542 U JPS61183542 U JP S61183542U
Authority
JP
Japan
Prior art keywords
substrate
sealing frame
sealing
gap
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985067465U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985067465U priority Critical patent/JPS61183542U/ja
Publication of JPS61183542U publication Critical patent/JPS61183542U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の素子封止体の実施例でありａ
は斜視図、ｂはＡ―Ａ′における切断面図、ｃは
封止枠体の斜視図である。第２図は従来の素子封
止体の第１例であり、ａは斜視図、ｂはＢ―Ｂ′
における切断面図である。第３図は従来の素子封
止体の第２例であり、ａは斜視図、ｂはＣ―Ｃ′
における切断面図である。 １……封止枠体、２……基板、３……固着部、
４……接着剤、５……封止剤、６……凹部、７…
…素子。 Figure 1 shows an embodiment of the device sealing body of the present invention.
is a perspective view, b is a cross-sectional view taken along line AA', and c is a perspective view of the sealing frame. FIG. 2 shows a first example of a conventional device sealing body, in which a is a perspective view and b is a BB'
FIG. FIG. 3 shows a second example of a conventional element sealing body, in which a is a perspective view and b is a C-C'
FIG. 1...Sealing frame body, 2...Substrate, 3...Adhering part,
4...adhesive, 5...sealing agent, 6...recess, 7...
…element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板と、該基板に搭載された素子と、該素子を
囲う封止枠体と、上記素子と上記封止枠体との間
隙に注入された封止剤とを有する素子封止体に於
いて、上記封止枠体が該封止枠体と上記基板との
間に間隙を設けるための凹部を有する事を特徴と
する素子封止体。 In an element sealing body having a substrate, an element mounted on the substrate, a sealing frame surrounding the element, and a sealant injected into a gap between the element and the sealing frame. . An element sealing body, wherein the sealing frame has a recess for providing a gap between the sealing frame and the substrate.
JP1985067465U 1985-05-09 1985-05-09 Pending JPS61183542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985067465U JPS61183542U (en) 1985-05-09 1985-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985067465U JPS61183542U (en) 1985-05-09 1985-05-09

Publications (1)

Publication Number Publication Date
JPS61183542U true JPS61183542U (en) 1986-11-15

Family

ID=30601316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985067465U Pending JPS61183542U (en) 1985-05-09 1985-05-09

Country Status (1)

Country Link
JP (1) JPS61183542U (en)

Similar Documents

Publication Publication Date Title
JPS61183542U (en)
JPS6299794U (en)
JPS62129830U (en)
JPS61188361U (en)
JPS61144078U (en)
JPS61198720U (en)
JPS6240193U (en)
JPS6213837U (en)
JPS6243162U (en)
JPS61176381U (en)
JPS6195514U (en)
JPS59102680U (en) Groove cover for U-shaped groove
JPS61188073U (en)
JPS6186446U (en)
JPS6294682U (en)
JPH0221755U (en)
JPS61179177U (en)
JPS61137641U (en)
JPS6190836U (en)
JPS61174601U (en)
JPS6235328U (en)
JPS59132450U (en) End cap attachment structure for resin molding
JPH0465158U (en)
JPH0266006U (en)
JPS6157929U (en)