JPS61182037U - - Google Patents
Info
- Publication number
- JPS61182037U JPS61182037U JP1985066557U JP6655785U JPS61182037U JP S61182037 U JPS61182037 U JP S61182037U JP 1985066557 U JP1985066557 U JP 1985066557U JP 6655785 U JP6655785 U JP 6655785U JP S61182037 U JPS61182037 U JP S61182037U
- Authority
- JP
- Japan
- Prior art keywords
- potting agent
- chip
- molding ring
- molding
- protection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066557U JPH0322918Y2 (pt-PT) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066557U JPH0322918Y2 (pt-PT) | 1985-05-07 | 1985-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182037U true JPS61182037U (pt-PT) | 1986-11-13 |
| JPH0322918Y2 JPH0322918Y2 (pt-PT) | 1991-05-20 |
Family
ID=30599579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985066557U Expired JPH0322918Y2 (pt-PT) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322918Y2 (pt-PT) |
-
1985
- 1985-05-07 JP JP1985066557U patent/JPH0322918Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322918Y2 (pt-PT) | 1991-05-20 |