JPS61179750U - - Google Patents
Info
- Publication number
- JPS61179750U JPS61179750U JP6431485U JP6431485U JPS61179750U JP S61179750 U JPS61179750 U JP S61179750U JP 6431485 U JP6431485 U JP 6431485U JP 6431485 U JP6431485 U JP 6431485U JP S61179750 U JPS61179750 U JP S61179750U
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- semiconductor wafer
- adhesive
- breaking
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000005192 partition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431485U JPS61179750U (ko) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431485U JPS61179750U (ko) | 1985-04-30 | 1985-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61179750U true JPS61179750U (ko) | 1986-11-10 |
Family
ID=30595282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6431485U Pending JPS61179750U (ko) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179750U (ko) |
-
1985
- 1985-04-30 JP JP6431485U patent/JPS61179750U/ja active Pending