JPS61179587A - Light source device - Google Patents

Light source device

Info

Publication number
JPS61179587A
JPS61179587A JP59201675A JP20167584A JPS61179587A JP S61179587 A JPS61179587 A JP S61179587A JP 59201675 A JP59201675 A JP 59201675A JP 20167584 A JP20167584 A JP 20167584A JP S61179587 A JPS61179587 A JP S61179587A
Authority
JP
Japan
Prior art keywords
thermal expansion
coupling
semiconductor laser
light source
fixing frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59201675A
Other languages
Japanese (ja)
Inventor
Masateru Watanabe
渡辺 正輝
Shiyuu Kawakami
川上 ▲★▼
Noriya Kaneda
金田 徳也
Akira Kuribayashi
栗林 朗
Tsutomu Kuze
久世 務
Sadao Takahashi
高橋 貞夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59201675A priority Critical patent/JPS61179587A/en
Publication of JPS61179587A publication Critical patent/JPS61179587A/en
Pending legal-status Critical Current

Links

Landscapes

  • Optical Head (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To prevent positional displacement due to thermal expansion by forming a section elastically deformed in the direction rectangular to the optical axis of a coupling lens to a member shaping a fixing frame. CONSTITUTION:Slits 41, 42 are cut to a member 4 fastening a semiconductor laser 1 and a coupling lens 2 by a fixing frame consisting of the combination of a member 3 and the member 4, and structure in which thermal expansion is absorbed is shaped. The difference of thermal expansion is generated by a temperature change, and force is generated on a coupling surface, but displacing force on the coupling surface is reduced largely by the slit 42, and the laser 1, the lens 2 and the fixing frame can be clamped sufficiently without generating slips by coupling by screws. The stiffness of the member 4 can be changed arbitrarily by altering the slotted depth and space of the slits 41, 42, thus giving elasticity sufficient for absorbing the difference of thermal expansion.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は半導体レーザを光源とする光源装置に係シ、特
に高精度の平行度及び出射方向精度を要求する光学系で
便用温度範囲の大きい装置の光W装置に関する。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a light source device using a semiconductor laser as a light source, and in particular, to an optical system that requires highly accurate parallelism and emitting direction accuracy, and which has a wide temperature range. The present invention relates to an optical W device.

〔発明の背景〕[Background of the invention]

半導体レーザの発光点がカップリングレンズの焦点位[
Kあればカップリングレンズからの出力光は平行光とな
る。第1図にこの関係?示す。この関係がずれるとカッ
プリングレンズからの出力光は平行でなくなる。
The light emitting point of the semiconductor laser is at the focal position of the coupling lens [
If K, the output light from the coupling lens becomes parallel light. Is this relationship in Figure 1? show. If this relationship deviates, the output light from the coupling lens will no longer be parallel.

一般に温度の変化があると熱膨張により半導体レーザと
カップリングレンズの位置関係が動いてしまう。これを
防ぐ為半導体レーザとカップリングレンズとを熱膨張係
数の異なる複数の部材からなる固定枠で固定することに
より温度変化に伴うカップリングレンズと半導体レーザ
の距S変化を午ヤンセルしている(特開昭58−168
024号)。この1例を第2図に示している。
Generally, when there is a change in temperature, the positional relationship between the semiconductor laser and the coupling lens changes due to thermal expansion. To prevent this, by fixing the semiconductor laser and the coupling lens with a fixed frame made of multiple members with different coefficients of thermal expansion, changes in the distance S between the coupling lens and the semiconductor laser due to temperature changes are suppressed ( Japanese Patent Publication No. 58-168
No. 024). An example of this is shown in FIG.

半導体レーザー1、カップリングレンズ2を熱膨張係数
の異なる部材3.4からなる固定枠にてとりつけており
、温度変化に伴う半導体レーザとカップリングレンズの
距111#f化をキャンセルしている。
The semiconductor laser 1 and the coupling lens 2 are attached to a fixed frame made of members 3 and 4 having different coefficients of thermal expansion, thereby canceling the change in distance 111#f between the semiconductor laser and the coupling lens due to temperature changes.

ところが、部材3.4を結合しているねじ6゜7の間隔
を1とし、部材6.4の熱膨張係数をam 、α4とす
ると20の温度変化により1XJ−×(α5−(14)
の熱膨張差が生ずる。部材3.4の髪形に対する剛性係
数をkS、に4とすると締結部において 七゛・k“・
2・1・(as−aa)の大きさkA  +  kA の力がすべりを生じさせる方向に生ずる。通常この力は
大きく結合面5においてずれを生じてしまう。この為、
前記発光点11が、光軸21からずれてしまい第1図に
示すごとく光源より出射する光の方向がかわってしまう
という問題がある。
However, if the distance between the screws 6°7 that connects the member 3.4 is 1, and the coefficient of thermal expansion of the member 6.4 is am and α4, then due to a temperature change of 20, 1XJ-×(α5-(14)
A difference in thermal expansion occurs. If the stiffness coefficient for the hairstyle of member 3.4 is kS, and 4, then at the fastening part, 7゛・k“・
A force of magnitude kA + kA of 2.1.(as-aa) is generated in the direction that causes the slip. Normally, this force is large enough to cause a shift in the bonding surface 5. For this reason,
There is a problem in that the light emitting point 11 is deviated from the optical axis 21 and the direction of the light emitted from the light source changes as shown in FIG.

〔発明の目的〕[Purpose of the invention]

本発明は温度変化の影響の少い高精度の出力光の得られ
る光学系の光源装置を提供することにるる。
An object of the present invention is to provide a light source device of an optical system that can obtain highly accurate output light that is less affected by temperature changes.

〔発明の概要〕[Summary of the invention]

前述の如く熱膨張差のあるものを締結した場合温度変化
かりると、結合合部には部材が伸縮しようとして大きな
力が加わる。ネジ締め等による結合方式ではこの力にう
ちかつて固定を保つことができず、締結面ですべりを生
じてしまう。
As mentioned above, when parts with a difference in thermal expansion are fastened together, a large force is applied to the joined part as the parts try to expand or contract when the temperature changes. Connection methods such as screw tightening are unable to maintain fixation against this force, and slipping occurs on the fastening surfaces.

本発明では部材に弾性変形する部分を設ける事によ)部
材の伸縮を吸収し締結面のすべりをなくそうとするもの
である。
The present invention attempts to absorb the expansion and contraction of the member (by providing the member with an elastically deformable portion) and eliminate slippage of the fastening surface.

〔発明の実施例〕[Embodiments of the invention]

第3図に本発明の実施例を示す。基本的構成は第2図と
同じでめ)半導体レーザ1と、カップリングレンズ2と
を部材61部材4の組合せから成る固定枠によシ固定し
ている。前記部材4にはスリン) 41 、42が切ら
れており、熱膨張を吸収する構造となっている。温度の
変化によシ図1Vr−示す場合と同様、txJ)((α
S−α4)の熱#張麦が生じ、−セ二2に5z≦A二=
ゴヒ−’O7gJ@kA+に4 台面に生ずるか、スリット42Vcよシ&4が大巾に小
ぢいので、結合面ですべらせようとする力が大巾に低減
されねじによる結合にて十分すべりを生ずることなく締
結することができる。尚スリット41 、42の切込む
深さ及び間隔をかえることによシ部材4の剛性&4を低
& [75&えることができ、熱膨張差を吸収するに十
分な弾性を与えることができる。
FIG. 3 shows an embodiment of the present invention. The basic structure is the same as that shown in FIG. 2.) The semiconductor laser 1 and the coupling lens 2 are fixed to a fixed frame consisting of a combination of members 61 and 4. The member 4 has sulins (41, 42) cut out to have a structure that absorbs thermal expansion. As shown in Figure 1, Vr-txJ)((α
Heat of S-α4) occurs, and 5z≦A2=
Since the slit 42Vc and 4 are very small in width, the force that tries to make it slide on the joint surface is greatly reduced, and the screw connection can be used for sufficient sliding. It is possible to conclude the contract without causing any problems. By changing the cutting depth and spacing of the slits 41 and 42, the rigidity of the member 4 can be reduced to a low value, and elasticity sufficient to absorb the difference in thermal expansion can be provided.

第4図に本発明の他の実施例を示す。基本的構成は第6
図の場合と同様であり、部材4に突起45が設けである
。温度の変化により部材3゜41C熱膨張の差が生ずる
が、突起45が左右方向に弾性変形することにより熱膨
張を吸収することが可能である。
FIG. 4 shows another embodiment of the invention. The basic structure is the 6th
This is similar to the case shown in the figure, and the member 4 is provided with a protrusion 45. Although a difference in thermal expansion occurs between the members 3° and 41C due to changes in temperature, it is possible to absorb the thermal expansion by elastically deforming the protrusion 45 in the left-right direction.

〔発明の効果〕〔Effect of the invention〕

以上の如く、本発明によれば、光軸方向と直角方向にも
熱j影Z4による位眞ずれを防止できるため、安定した
光源が得られる。
As described above, according to the present invention, it is possible to prevent misalignment due to the thermal shadow Z4 also in the direction perpendicular to the optical axis direction, so that a stable light source can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

処1図は半導体レーザとカップリングレンズの関連図、
第2図は熱膨張係数の異なる部材を組合わせて出力光の
平行度k14保している光源装置の例、第3図、第4図
は本発明の実施例を示す図である。 1・・・半導体レーザ    2・・・カップリングレ
ンズ 5.4・・・固定枠を形成する部材 5・・・3.4の締結面 6.7・・・3.4を結合するねじ。
Figure 1 is a diagram of the relationship between the semiconductor laser and the coupling lens.
FIG. 2 shows an example of a light source device in which parallelism k14 of output light is maintained by combining members with different coefficients of thermal expansion, and FIGS. 3 and 4 show examples of the present invention. 1... Semiconductor laser 2... Coupling lens 5.4... Screw that connects the fastening surfaces 6.7...3.4 of the members 5...3.4 forming the fixed frame.

Claims (1)

【特許請求の範囲】[Claims] 光源としての半導体レーザと、半導体レーザ光を平行に
変換するカップリングレンズと、該半導体レーザ及びカ
ップリングを固定する為の熱膨張係数の異なる複数の部
材を組合わせた固定枠から成る光源装置において、固定
枠を形成する部材の一つ以上にカップリングレンズの光
軸と直角方向に弾性変形する部分を設けたことを特徴と
する光源装置。
In a light source device comprising a semiconductor laser as a light source, a coupling lens for converting the semiconductor laser light into parallel light, and a fixing frame combining a plurality of members with different coefficients of thermal expansion for fixing the semiconductor laser and the coupling. A light source device, characterized in that one or more of the members forming the fixed frame is provided with a portion that elastically deforms in a direction perpendicular to the optical axis of the coupling lens.
JP59201675A 1984-09-28 1984-09-28 Light source device Pending JPS61179587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59201675A JPS61179587A (en) 1984-09-28 1984-09-28 Light source device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59201675A JPS61179587A (en) 1984-09-28 1984-09-28 Light source device

Publications (1)

Publication Number Publication Date
JPS61179587A true JPS61179587A (en) 1986-08-12

Family

ID=16445032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59201675A Pending JPS61179587A (en) 1984-09-28 1984-09-28 Light source device

Country Status (1)

Country Link
JP (1) JPS61179587A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281433A (en) * 1989-04-20 1990-11-19 Omron Corp Optical head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281433A (en) * 1989-04-20 1990-11-19 Omron Corp Optical head

Similar Documents

Publication Publication Date Title
EP0484167B1 (en) Laser diode module with pigtail fiber
EP0604335B1 (en) Athermalized beam source and collimator lens assembly
JPH0675150A (en) Temperature compensating optical assembly
US4972429A (en) Achromatic prism beam expander for high magnification and tunable laser using same
JP2002014269A (en) Optical device
US6175674B1 (en) Adjustable compensation device for fiber bragg gratings
JPS61179587A (en) Light source device
JPWO2019155602A1 (en) Optical module
JP2861862B2 (en) Collimating device having a plastic collimating lens
JP2002131669A (en) Light source unit
JP3836401B2 (en) Optical device
WO1999039405A3 (en) Semiconductor laser chip
JP2002169115A (en) Structure for fixing light source unit
JPH01297610A (en) Collimating device
JPH0535845B2 (en)
CN216750637U (en) Laser structure with automatic temperature compensation
JPH04249208A (en) Semiconductor light source device
EP1265324A2 (en) Laser resonator with direction sensitive decoupling
JPS63170612A (en) Scanning lens
JPS6318532A (en) Optical signal reader
JPH07318776A (en) Lens supporting structure for scanning optical system
JP5182602B2 (en) Variable dispersion compensator
WO2020157853A1 (en) Optical transmission module
WO1998037604A3 (en) Optoelectronic device with a semiconductor diode laser amplifier
JPH073879B2 (en) Solar cell