JPS61177452U - - Google Patents

Info

Publication number
JPS61177452U
JPS61177452U JP1985061636U JP6163685U JPS61177452U JP S61177452 U JPS61177452 U JP S61177452U JP 1985061636 U JP1985061636 U JP 1985061636U JP 6163685 U JP6163685 U JP 6163685U JP S61177452 U JPS61177452 U JP S61177452U
Authority
JP
Japan
Prior art keywords
stem
stems
hybrid integrated
integrated circuit
membrane circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985061636U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985061636U priority Critical patent/JPS61177452U/ja
Publication of JPS61177452U publication Critical patent/JPS61177452U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/547Dispositions of multiple bond wires
    • H10W72/5473Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
JP1985061636U 1985-04-24 1985-04-24 Pending JPS61177452U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985061636U JPS61177452U (enExample) 1985-04-24 1985-04-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985061636U JPS61177452U (enExample) 1985-04-24 1985-04-24

Publications (1)

Publication Number Publication Date
JPS61177452U true JPS61177452U (enExample) 1986-11-05

Family

ID=30590092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985061636U Pending JPS61177452U (enExample) 1985-04-24 1985-04-24

Country Status (1)

Country Link
JP (1) JPS61177452U (enExample)

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