JPS61173153U - - Google Patents
Info
- Publication number
- JPS61173153U JPS61173153U JP1985055666U JP5566685U JPS61173153U JP S61173153 U JPS61173153 U JP S61173153U JP 1985055666 U JP1985055666 U JP 1985055666U JP 5566685 U JP5566685 U JP 5566685U JP S61173153 U JPS61173153 U JP S61173153U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- amorphous silicon
- silicon layer
- type amorphous
- collecting electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985055666U JPS61173153U (enExample) | 1985-04-15 | 1985-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985055666U JPS61173153U (enExample) | 1985-04-15 | 1985-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61173153U true JPS61173153U (enExample) | 1986-10-28 |
Family
ID=30578551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985055666U Pending JPS61173153U (enExample) | 1985-04-15 | 1985-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173153U (enExample) |
-
1985
- 1985-04-15 JP JP1985055666U patent/JPS61173153U/ja active Pending