JPS61172358A - Integrated circuit utilizing peltier cooling method - Google Patents

Abstract

PURPOSE:To enable the fellow individual IC substrates to house in the case body at intervals one-severalth narrower than the conventional ones, and at the same time, to prevent heat from affecting the operation of the IC even though the integration degree of the IC itself is enhanced by a method wherein a cooling method according to the Peltier effect is utilized. CONSTITUTION:This integrated circuit is formed in such a constitution that a Peltier cooling is generated at a place, where is near individual circuit main bodies 2 and is such a place as to come into contact to the interior of an element 1 or the IC element; the heat radiating part is made to locate on the upper side of the partition plates, which are about 1cm away from the main body substrate and are formed in such a way that the heat generating parts only of the individual IC circuits protrude thereto; and the heat of the heat generating parts is made to radiate at the heat radiating part. As the cooling is one to cool locally the necessary parts in the IC, the inferiority of efficiency of the thermoelectric cooling method does not exert effect so much to the cooling effect. Moreover, when the parts other than the IC circuits are made in a heat-resisting manner, the partition plates, the fans and the heat pipes can be omitted and even when the temperature in the interior of the element rises higher than the normal one, the IC can be made to operate without being subjected to the effect functionally.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is to solve the so-called IC heat generation problem using Peltier effect cooling. Heat dissipation by the conventional 7 Mudar tower was not possible due to the large size of the tower itself, and it was not possible to closely stack the substrates.In the present invention, the heat removal effect is large, so the substrates are spaced within the box at a fraction of the distance of the conventional method. In addition to being able to be stored in the IC, increasing the degree of integration of the IC itself also eliminates heat problems.

Specifically, Peltier cooling occurs very close to the 1.10 circuit, that is, close to the individual IC circuit body 2, inside the element 1 or in contact with the IC element, and the heat generating part is approximately 1 inch away from the main body board.
c- An integrated circuit using the Peltier cooling method characterized in that it is placed above a separate plate formed so that only the heat generating parts of the individual ICs protrude, and the heat is radiated there.2.
The IC element 1 has a heat absorbing part 3 integrally formed inside the element parallel to the integrated circuit surface 2, and power thereto is supplied from a power supply circuit attached to the substrate 4 in the same way as the signal input terminal. A configuration in which the main substrate 1 is covered with a partition plate 8 having a hole provided by the pin 5 and having holes such that only the Peltier heat generating part 6 protrudes can also be used to utilize the Peltier cooling method described in claim 1. An integrated circuit 3, a substrate 11 on which a large number of ICs are arranged, and a Peltier heat absorption section 13 having the same arrangement as the IC arrangement are arranged so that the bottom surface of the optional board 12 and the heat generating section 14 are placed on the top surface, and the cooling power is distributed as desired. The integrated circuit 4 using the Peltier cooling method according to claim 1, which is taken from the printed wiring on the board 12, and whose heat absorbing parts are in physical contact with the upper surface of an ordinary IC, is an IC circuit. This is an integrated circuit using the Peltier cooling method according to claim 1, in which the optional plate is omitted in the case of an integrated circuit having a cooling element inside, and heat is naturally dissipated in the upper part of the IC.

FIG. 1 is a perspective view of an IC according to claim 2, FIG. 2 is a side sectional view, FIG. 3 is a sectional view of the IC in combination with a perforated plate 8, and FIG. 4. Perforated cutting board 8
FIG. 4 shows a perspective view of a substrate 4 having a large number of ICs of the present invention. Third
The figure shows a method of forcing air from a fan to cool the heat dissipation part, but it is also possible to connect this part with a heat pipe and use a static method to radiate heat outside the body. The N-type conductor in Figure 2 is Bi2Te3
゜P-type conductors such as Bi and PbTe include B13Te3.
Bi2Te3, Sb2Te3, etc. are mentioned, and the heat absorption part 3
is Cu, etc. The current is ■, 9 is a heat radiation fin, and 10 is a heat insulating material.

Since the supply voltage may be low, an appropriate voltage can be obtained by connecting ICs in series.

What is shown in claim 3 is a method of cooling by using an ordinary IC and bringing a heat absorbing part into contact with the IC. FIG. 5 shows a cross-sectional view of a printed wiring board 12 with a heat dissipating section 14 and a heat absorbing section 13 on the upper and lower surfaces, respectively, and FIG. 6 shows a perspective view of the IC board 11 and this switching board 12. , in order to make good contact between the two, the IC
It is advisable to attach a flexible rubber or plastic thin plate with good thermal conductivity to the upper surface or the lower surface of the heat absorbing plate.

Generally, the current to the cooling element of the present invention is controlled by hardware using a temperature sensor mounted at an appropriate location, but it may also be managed by software by reading information from the sensor. It is possible.

The cooling according to the present invention locally cools the necessary areas, and the inefficiency of the electronic freezing method is not a big problem. In addition, as stated in claim 4, if parts other than the IC are made heat-resistant, partition plates, fans, heat pipes, etc. can be omitted, and even if the internal temperature rises above normal, it will not function. There is a good chance that it will not be a problem.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an IC element of the present invention; Fig. 2 is a cross-sectional view thereof; Fig. 3 is a cross-sectional view when assembled with a partition plate t1'& 4.
The figure is a perspective view of the partition plate and an IC board. Figure 5 is a cross-sectional view of a partition plate with a cooling element. Integrated circuit main body portion 3, heat absorption plate portion 4. Substrate 5. Cooling power pin 6, heat radiation part 7, hole 8. Partition plate 9. Heat radiation fin 1
0° insulation material 11. Ordinary IC board 12° Partition plate with cooling element 13. Heat absorption part 14, heat radiation part patent registration applicant Hideo Masubuchi] Figure g

Claims (1)

[Claims] 1. Peltier cooling occurs very close to the IC circuit, that is, close to each IC circuit main body 2, inside the element 1 or in contact with the IC element, and the heat generating part is approximately 1 inch from the main body board.
An integrated circuit 2 using the Peltier cooling method, which is located above an arbitrary board formed so that only the heat-generating parts of each IC protrude, and radiates heat there; It has a heat absorption part 3 integrally formed inside the element parallel to the integrated circuit surface 2, and power to it is supplied from a power supply circuit attached to the substrate 4 through pin 5 in the same way as the signal input terminal. , Peltier heating section 6
The integrated circuit 3 for Peltier cooling according to claim 1 is configured such that the main substrate 1 is covered with a partition plate 8 having holes 7 arranged such that only the holes 7 protrude from the partition plate 8, in which a large number of ICs are arranged. The Peltier heat absorbing section 13, which has the same arrangement as the board 11 and its IC arrangement, is arranged so that the bottom surface of the optional board 12 and the heat generating section 14 are placed on the top surface, and the cooling power is taken from the printed wiring on the selective board 12. The Peltier cooling method integrated circuit 4 according to claim 1, in which the heat absorbing part is in a form that physically contacts the top surface of a normal IC, and the optional plate is omitted in the IC circuit having a cooling element inside the IC circuit. An integrated circuit using the Peltier cooling method according to claim 1, which naturally dissipates heat in the upper part of the IC.