JPS61168656U - - Google Patents
Info
- Publication number
- JPS61168656U JPS61168656U JP1986041045U JP4104586U JPS61168656U JP S61168656 U JPS61168656 U JP S61168656U JP 1986041045 U JP1986041045 U JP 1986041045U JP 4104586 U JP4104586 U JP 4104586U JP S61168656 U JPS61168656 U JP S61168656U
- Authority
- JP
- Japan
- Prior art keywords
- solar cell
- electrically insulating
- insulating resin
- cell substrate
- substrate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000010407 anodic oxide Substances 0.000 claims 1
- 238000007743 anodising Methods 0.000 claims 1
- 229920003055 poly(ester-imide) Polymers 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Description
第１図は本考案の基板に集光型太陽電池素子を
取付けて集光する模式図、第２図は本考案におけ
る集光型太陽電池の斜視図、第３図は本考案の基
板の断面図、第４図は本考案における集光型太陽
電池を太陽集光器に組込んだ正面図を示す。
図中使用する番号は共通して使用するもので、
１は集光用光学系、２は太陽電池素子、３は基板
、Ａは入射光、Ｂは収束光、４は絶縁層、５は金
属板、６，７は電力取出用リード、８は太陽電池
電極、９はボンデイングワイヤー、１０は有機絶
縁層、１１は陽極酸化層、１２は接着剤、１３は
導水管、１４は冷却水、を示す。
Figure 1 is a schematic diagram of a concentrating solar cell element attached to the substrate of the present invention to collect light, Figure 2 is a perspective view of the concentrating solar cell of the present invention, and Figure 3 is a cross section of the substrate of the present invention. FIG. 4 shows a front view of the concentrating solar cell according to the present invention incorporated into a solar concentrator. The numbers used in the diagram are commonly used.
1 is a condensing optical system, 2 is a solar cell element, 3 is a substrate, A is incident light, B is convergent light, 4 is an insulating layer, 5 is a metal plate, 6 and 7 are leads for power extraction, 8 is the sun A battery electrode, 9 a bonding wire, 10 an organic insulating layer, 11 an anodized layer, 12 an adhesive, 13 a water conduit, and 14 cooling water.
Claims (1)
極酸化した後、電気絶縁性樹脂を焼付けたことを
特徴とする太陽電池用基板。 (2) 陽極酸化皮膜と電気絶縁性樹脂の合計厚さ
が１ミクロン―１０ミクロンである実用新案登録
請求の範囲第(1)項記載の太陽電池用基板。 (3) 電気絶縁性樹脂がポリイミド、ポリアミド
イミド、ポリエステルイミド、フツ素樹脂のいず
れかである実用新案登録請求の範囲第(1)項又は
第(2)項記載の太陽電池用基板。[Claims for Utility Model Registration] (1) A solar cell substrate characterized by anodizing aluminum or an aluminum alloy and then baking an electrically insulating resin onto the substrate. (2) The solar cell substrate according to claim 1, wherein the total thickness of the anodic oxide film and the electrically insulating resin is 1 to 10 microns. (3) The solar cell substrate according to claim 1 or 2, wherein the electrically insulating resin is polyimide, polyamideimide, polyesterimide, or fluororesin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041045U JPS61168656U (en) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041045U JPS61168656U (en) | 1986-03-20 | 1986-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168656U true JPS61168656U (en) | 1986-10-20 |
Family
ID=30550499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986041045U Pending JPS61168656U (en) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168656U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091440A (en) * | 2006-09-29 | 2008-04-17 | Sharp Corp | Solar cell and concentrated solar power generation unit |
| JP2009188410A (en) * | 2008-02-11 | 2009-08-20 | Emcore Corp | Solar cell receiver for concentrated photovoltaic system for iii-v semiconductor solar cell |
| US9923112B2 (en) | 2008-02-11 | 2018-03-20 | Suncore Photovoltaics, Inc. | Concentrated photovoltaic system modules using III-V semiconductor solar cells |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4124824Y1 (en) * | 1964-08-19 | 1966-12-19 | ||
| JPS5423489A (en) * | 1977-07-25 | 1979-02-22 | Japan Solar Energy | Solar optical generator |
-
1986
- 1986-03-20 JP JP1986041045U patent/JPS61168656U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4124824Y1 (en) * | 1964-08-19 | 1966-12-19 | ||
| JPS5423489A (en) * | 1977-07-25 | 1979-02-22 | Japan Solar Energy | Solar optical generator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091440A (en) * | 2006-09-29 | 2008-04-17 | Sharp Corp | Solar cell and concentrated solar power generation unit |
| JP2009188410A (en) * | 2008-02-11 | 2009-08-20 | Emcore Corp | Solar cell receiver for concentrated photovoltaic system for iii-v semiconductor solar cell |
| US9923112B2 (en) | 2008-02-11 | 2018-03-20 | Suncore Photovoltaics, Inc. | Concentrated photovoltaic system modules using III-V semiconductor solar cells |
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