JPS61168439A - Method for removing semiconductor wafer in chuck mechanism - Google Patents

Abstract

PURPOSE:To release a wafer safely and surely by the pressure of ejected water and float it by injecting and ejecting water flow from a water injecting port of a concave area provided on a chuck mechanism body. CONSTITUTION:A concave area 2 forming a mechanism for adsorbing a wafer A to be ground is provided on a chuck mechanism body 1 of a grinding machine plurally according to the scale of the chuck mechanism body 1, and a water injecting port 3 for ejecting water flow is formed in the almost the center of the lower face. And ceramics 4 having porosity in porous condition or in vertical direction are rotatably fixed in the concave 2 by making them exposed on the surface of the concave 2 wholly or a little while holding a clearance 5 toward the bottom. Therefore, water is injected from the water injecting port 3 of the concave 2 drilled on the chuck mechanism body 1 to float the wafer A.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention safely releases particularly ultra-thin semiconductor wafers from a suction type chuck mechanism in a grinding machine.

This invention relates to a method for removing a removable wafer.

Today's continuous technological innovation is remarkable, and the development of cutting-edge technology has produced a large number of excellent product groups.

In particular, the development of electronic equipment equipped with computers, microcomputers, etc. of this type according to the present invention seems to be progressing rapidly, and efforts are being made to develop even more advanced applied technologies.

For this reason, semiconductors are required to have ultra-thin silicon wafers that have even higher quality and can lead to miniaturization or mass integration of circuits.

Conventionally, with this type of suction type chuck mechanism, in the case of a relatively thick wafer after grinding, there was no problem even if the wafer was peeled off by some method, but as mentioned above, Nowadays, ultra-high precision quality is required and there is a growing trend towards ultra-thin silicon wafers, so even wafers with a thickness of about 0.4 m have been removed using vacuum suction. In such cases, wafer breakage accidents frequently occur. This makes the wafer ultra-thin at 0.2m.
Although it is possible to use a grinding technique to finish the wafer to a size of m, a method for removing the wafer from the chuck mechanism without damaging the ground mirror surface has not yet been established.

In view of the above reasons, and as a result of extensive research, the present invention aims to create and provide a method for safely and reliably removing ultra-thin (0.2 mm) wafers from these chuck mechanisms. be.

An embodiment of a method for removing a semiconductor wafer in a chuck mechanism of the present invention that achieves the above object.

This will be explained below with reference to the drawings.

FIG. 1 is a schematic diagram showing a part of the main components of the present invention from the chuck mechanism main body of a grinding machine having chuck mechanisms at multiple locations, and FIG. 2 shows a state where a wafer is floating from the chuck mechanism. FIG.

As shown in FIG. 1 showing the main components of the present invention,
In the chuck mechanism main body 1 of the grinding machine, recesses 2 forming a mechanism for adsorbing the wafer A to be ground are bored at a plurality of locations according to the scale of the chuck mechanism main body 1, and at approximately the center of the lower surface. Forming a water inlet 3 for spouting a water flow into the recess 2, exposing it to the same level as the surface of the recess 2 or slightly, and providing a gap 5 between it and the bottom,
Ceramic with porous or almost vertical porosity 4
The present invention is constructed by rotatably fixed on a bearing.

By configuring the chuck mechanism in this manner, the chuck mechanism main body 1 By injecting and ejecting a water stream from the water inlet 3 of the recess 2 drilled in the hole, the wafer A is safely and reliably released by the ejected water pressure and floats to the surface. can be transferred to other system devices.

As described above, the present invention is a method for removing a wafer that does not cause any damage to the mirror surface after grinding or imposes an extra burden on the mirror surface after grinding, and is a method for removing ultra-thin semiconductors, which is the original objective. Even in wafers.

Since it becomes a means of removal that can be used in a sufficient manner, its contribution is immeasurable and has extremely significant effects.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a part of the main components of the present invention from the main body of a grinding machine chuck mechanism having chuck mechanisms at multiple locations as an embodiment of the present invention, and FIG. FIG. A
-Wafer. 1-chuck mechanism body, 2-recess, 3-water inlet. 4-porous ceramic, 5-interstitial area.

Claims (1)

[Scope of Claims] In a chuck mechanism body of a grinding machine that has a liquid surface tension or air adsorption mechanism and chucks and grinds a plurality of semiconductor wafers, the chuck mechanism is made of porous or vertically porous ceramic. At the same time, a water inlet is provided on the lower surface of the chuck mechanism main body where the suction mechanism is located, for jetting a water stream from the bottom surface of the porous ceramic toward the surface. 1. A method for removing a semiconductor wafer in a chuck mechanism, characterized in that the chuck mechanism for the wafer is configured such that the wafer can be levitated and released by the water pressure generated by the jet.