JPS61167356A - Manufacture of high power source - Google Patents

Abstract

PURPOSE:To prevent the coating material of leads from damaging and to eliminate the leakage of resin by inserting a lead holder to a mold holder of the leads when mounting a high voltage transformer in a mold to mold an insulating sheath with the resin. CONSTITUTION:After a rectifier unit 6 is connected with a high voltage transformer 5, it is mounted in molds 8a, 8b, resin is filled to integrally mold an insulating sheath. At that time, leads 7 are engaged with a lead holder 9. Resin is filled in the state that the holder 9 is interposed between the molds 8a and 8b. Thus, since the leads 7 are not directly held by the molds, no damage such as no scratch occurs on the coating material of the leads, and no leakage of the resin occurs from the lead holder, and an insulating sheath of high quality can be formed.

Description

DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a method of manufacturing a high-voltage power supply device used for a high-voltage power supply for a copying machine or the like.

BACKGROUND OF THE INVENTION A conventional method for manufacturing a high-voltage power supply device will be described with reference to FIG. In Figure 4, 1 is a high voltage transformer, 2
is a rectifier circuit unit, 3 is an external connection lead wire, 4a,
4b is a mold for molding. The manufacturing method will be explained below. First, the rectifier circuit unit 2 is connected to the high voltage transformer 1, and the voltage transformer 1 and the rectifier circuit unit 2 are installed in the lower die 4a of a molding die. Next, the external connection lead wire 3 pulled out from the rectifier circuit unit 2 is held between the abutting surfaces of the lower mold 4a and the upper mold 4b, and the upper mold 4b and the lower mold 4a are brought together and the molten resin is placed inside the mold. Casting.

It had hardened to form an insulating sheath.

Problems to be Solved by the Invention In such a conventional manufacturing method, since the external connection lead wire 3 is directly held between the abutting surfaces of the lower mold 4a and the upper mold 4b of the molding die, the external connection lead wire 3 Scratches occur on the coating material, and the coating material becomes deformed due to the high temperature of the mold. Due to the above reasons, a gap is created between the molding die and the external connection lead wire 3, which causes resin to leak during molding, and the molding pressure inside the die decreases. Furthermore, there was a drawback that voids were generated in the resin, causing defects and deteriorating the quality.

The present invention is intended to solve this problem, and aims to prevent resin leakage from the gaps mentioned above during molding.

Means for Solving the Problems In order to solve the above problems, the present invention incorporates a lead holder into the external connection lead wires drawn out from the rectifier circuit unit, so that the external connection lead wires do not come into direct contact with the molding die. It is designed so that it can be assembled and molded.

Function By using the lead holder as described above, the external connection lead wire is not directly clamped by the mold, so the sheathing material of the external connection lead wire will not be scratched, and the sheathing material will not be deformed due to heat. Since this can be prevented, there will be no gap between the molding die and the external connection lead wire, and a high-voltage power supply device of good quality that is completely filled without resin leakage during molding can be manufactured.

Embodiment An embodiment of the present invention will be described with reference to FIG. 1. In FIG. 1, reference numeral 6 denotes a high-voltage transformer constructed by incorporating a magnetic core into a coil portion having a primary winding and a secondary winding; 7 is a rectifier circuit unit made of a printed wiring board incorporating various electronic components, 7 is an external connection lead wire drawn out from the rectifier circuit unit 6, aa and ab are molding molds, and 9 is a feature of the present invention. It is attached to the external connection lead wire 7 with a lead holder. The method for manufacturing the high-voltage power supply device will be described below. First, the rectifier circuit unit 6 is assembled into the high voltage transformer 6 and installed in the lower mold 8a. Next, a rectangular lead holder 9 consisting of two pieces with a hole for passing the external connection lead wire 7 is assembled into the external connection lead wire 7, and the lead holder 9 is held between the abutting surfaces of the lower die 8a and the upper die 8b. Then, the lower mold 8a and the upper mold 8b are butted together, and molten resin is injected into the mold and hardened to form an insulating exterior. In this embodiment, a rectangular lead holder 9 made of two pieces with a hole for passing the external connection lead wire 7 was used, but a round lead holder 9 made of two pieces as shown in FIG. 3 was used. Good too.

Effects of the Invention As described above, by using the present invention, it is possible to prevent the conventional resin leakage, and therefore, it is possible to provide the market with completely filled high-voltage power supply devices of high quality.

[Brief explanation of drawings]

FIG. 1 is a block diagram of one step showing an embodiment of the method for manufacturing a high-voltage power supply device of the present invention, FIGS. 2 and 3 are perspective views of main parts of the embodiment of the present invention, and FIG. 4 is a conventional FIG. 2 is a configuration diagram showing a method of manufacturing an example high-voltage power supply device. 5... High voltage transformer, 6... Rectifier circuit unit, 7... External connection lead wire, 8a...
...Lower die, sb...Upper die, 9...Lead holder. Name of agent: Patent attorney Toshio Nakao and 1 other person5-
High voltage transformer 6-1 rectifier circuit unit 7-1 external! ! Line IJ-do 8a--lower mold Fig. 1 8m

Claims (1)

[Claims] A rectifier circuit unit consisting of a printed wiring board incorporating various electronic components is connected to a high voltage transformer with a magnetic core incorporated in the coil part having a primary winding and a secondary winding, and the high voltage transformer and rectifier circuit unit are molded. A lead holder installed in the lower mold of the mold and assembled into the external connection lead wire pulled out from the rectifying unit is held between the mating surfaces of the lower mold and the upper mold, and the upper mold and the lower mold are butted. A method of manufacturing a high-voltage power supply device in which molten resin is poured into a mold and cured to form an insulating exterior.