JPS61166544U - - Google Patents
Info
- Publication number
- JPS61166544U JPS61166544U JP4924885U JP4924885U JPS61166544U JP S61166544 U JPS61166544 U JP S61166544U JP 4924885 U JP4924885 U JP 4924885U JP 4924885 U JP4924885 U JP 4924885U JP S61166544 U JPS61166544 U JP S61166544U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- lead
- printed wiring
- circuit device
- connection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係るＩＣ装置の斜視図、第２
図は従来のＩＣ装置の斜視図である。
３……リードタイプＩＣ、３―１……ＩＣ本体
部、３―２……リード、３―３……リードの接続
部、３―４……下方に突設された垂下状のリード
、４……印刷配線板、４―１……印刷配線、４―
２……印刷配線の接続部、４―３……スルーホー
ル、４―４……スルーホール付接続部。
Figure 1 is a perspective view of an IC device according to the present invention, Figure 2 is a perspective view of an IC device according to the present invention;
The figure is a perspective view of a conventional IC device. 3... Lead type IC, 3-1... IC main body, 3-2... Lead, 3-3... Lead connection part, 3-4... Drooping lead protruding downward, 4 ...Printed wiring board, 4-1...Printed wiring, 4-
2...Printed wiring connection part, 4-3...Through hole, 4-4...Connection part with through hole.
Claims (1)
配線板の印刷配線の接続部に重ね合わせて接続す
る集積回路装置であつて、前記集積回路の複数の
リードのうち一部のリードを下方へ突設する垂下
状のリードとなし、該リードを前記印刷配線の接
続部に形成されるスルーホールへ挿入して前記集
積回路の位置決めと電気的接続とを兼ねさせて成
ることを特徴とする集積回路装置。 An integrated circuit device in which a connection part of a lead of a lead type integrated circuit is connected by overlapping a connection part of a printed wiring of a printed wiring board, and some of the leads of the plurality of leads of the integrated circuit are provided to protrude downward. An integrated circuit device, characterized in that the integrated circuit device comprises a lead having a hanging shape, and the lead is inserted into a through hole formed in a connecting portion of the printed wiring to serve both for positioning and electrical connection of the integrated circuit. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4924885U JPS61166544U (en) | 1985-04-04 | 1985-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4924885U JPS61166544U (en) | 1985-04-04 | 1985-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61166544U true JPS61166544U (en) | 1986-10-16 |
Family
ID=30566268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4924885U Pending JPS61166544U (en) | 1985-04-04 | 1985-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166544U (en) |
-
1985
- 1985-04-04 JP JP4924885U patent/JPS61166544U/ja active Pending