JPS61166536U - - Google Patents

Info

Publication number

JPS61166536U

JPS61166536U JP4964185U JP4964185U JPS61166536U JP S61166536 U JPS61166536 U JP S61166536U JP 4964185 U JP4964185 U JP 4964185U JP 4964185 U JP4964185 U JP 4964185U JP S61166536 U JPS61166536 U JP S61166536U

Authority

JP

Japan

Prior art keywords

substrate

lead

semiconductor body

external lead

attachment conductor

Prior art date

1985-04-03

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 6
• 239000000758 substrate Substances 0.000 claims description 3
• 239000004020 conductor Substances 0.000 claims 2
• 238000005219 brazing Methods 0.000 claims 1
• 238000004806 packaging method and process Methods 0.000 claims 1
• 239000002470 thermal conductor Substances 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1

Cited By (1)