JPS61166363U - - Google Patents
Info
- Publication number
- JPS61166363U JPS61166363U JP4876385U JP4876385U JPS61166363U JP S61166363 U JPS61166363 U JP S61166363U JP 4876385 U JP4876385 U JP 4876385U JP 4876385 U JP4876385 U JP 4876385U JP S61166363 U JPS61166363 U JP S61166363U
- Authority
- JP
- Japan
- Prior art keywords
- gap
- sealed
- case
- base
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１ａ図は本考案を適用するケースとベースの
斜視図、第１ｂ図はリレー本体を装着したベース
をケース内に収納した状態の断面図、第１ｃ図は
第１ｂ図の平面図、第２図は第２実施例を示し、
第２ａ図はケースとベースのみの斜視図、第２ｂ
図はベースのみをケース内に収納した状態の断面
図である。
１〜ケース、２〜開口部、３〜ベース、５，５
ａ〜凸部、ａ〜隙間。
Fig. 1a is a perspective view of the case and base to which the present invention is applied, Fig. 1b is a cross-sectional view of the base with the relay body attached and housed in the case, Fig. 1c is a plan view of Fig. 1b, and Fig. 1c is a plan view of Fig. 1b. The figure shows a second embodiment,
Figure 2a is a perspective view of only the case and base, Figure 2b
The figure is a sectional view of only the base housed in the case. 1~Case, 2~Opening, 3~Base, 5,5
a~Protrusion, a~Gap.
Claims (1)
装着されるベースとの隙間に、一液性熱硬化樹脂
を充填して密封する密封型リレーにおいて、前記
ケースとベースとの対向面の少なくとも一方に凸
部を設け、この凸部の先端を対向面に当接させ、
前記ケースとベースとの間に所定幅の隙間を設け
、この隙間に固形硬化剤を混入した一液性熱硬化
樹脂を充填して密封したことを特徴とする密封型
リレー。 In a sealed relay in which a one-component thermosetting resin is filled into a gap between a case having an opening on one side and a base attached to the opening, the gap is sealed, at least one of the surfaces facing the case and the base. A convex portion is provided on the surface, and the tip of the convex portion is brought into contact with the opposing surface.
A sealed relay characterized in that a gap of a predetermined width is provided between the case and the base, and the gap is filled with a one-component thermosetting resin mixed with a solid curing agent and sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4876385U JPS61166363U (en) | 1985-04-01 | 1985-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4876385U JPS61166363U (en) | 1985-04-01 | 1985-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61166363U true JPS61166363U (en) | 1986-10-15 |
Family
ID=30565325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4876385U Pending JPS61166363U (en) | 1985-04-01 | 1985-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166363U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4735635B2 (en) * | 2007-10-26 | 2011-07-27 | パナソニック電工株式会社 | Electromagnetic relay |
-
1985
- 1985-04-01 JP JP4876385U patent/JPS61166363U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4735635B2 (en) * | 2007-10-26 | 2011-07-27 | パナソニック電工株式会社 | Electromagnetic relay |