JPS61164032U - - Google Patents
Info
- Publication number
- JPS61164032U JPS61164032U JP4693785U JP4693785U JPS61164032U JP S61164032 U JPS61164032 U JP S61164032U JP 4693785 U JP4693785 U JP 4693785U JP 4693785 U JP4693785 U JP 4693785U JP S61164032 U JPS61164032 U JP S61164032U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- integrated circuit
- cavity
- injection molding
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001746 injection moulding Methods 0.000 claims 3
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案の一実施例の正面断
面図、第３図はキヤビテイ部の斜視図である。
１……可動型、１ａ……突き合わせ面、２……
固定型、２ａ……突き合わせ面、３……キヤビテ
イ、１１……ランナストリツパ、１８……突き出
しピン、Ｓ……集積回路素子。
1 and 2 are front sectional views of an embodiment of the present invention, and FIG. 3 is a perspective view of the cavity portion. 1...movable type, 1a...butting surface, 2...
Fixed type, 2a... Butt surface, 3... Cavity, 11... Runner stripper, 18... Ejection pin, S... Integrated circuit element.
Claims (1)
成された可動型１及び固定型２と、ランナストリ
ツパ１１とを備えた三枚型構造を有し、上記キヤ
ビテイ３に集積回路素子Ｓを内装して射出成形を
行い、上記集積回路素子Ｓのケーシングを成形す
る集積回路素子の射出成形用金型において、上記
固定型２には、型開き時に上記可動型１と連動し
て上記キヤビテイ３内に突出する突き出しピン１
８が設けられていることを特徴とする集積回路素
子の射出成形用金型。 It has a three-piece structure comprising a movable mold 1 and a fixed mold 2 in which a cavity 3 is formed between abutting surfaces 1a and 2a, and a runner stripper 11, and an integrated circuit element S is placed inside the cavity 3 and injection molded. In the mold for injection molding of an integrated circuit element for molding the casing of the integrated circuit element S, the fixed mold 2 has a protrusion that projects into the cavity 3 in conjunction with the movable mold 1 when the mold is opened. pin 1
8. A mold for injection molding an integrated circuit device, characterized in that a mold for injection molding of an integrated circuit device is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985046937U JPH0353502Y2 (en) | 1985-03-30 | 1985-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985046937U JPH0353502Y2 (en) | 1985-03-30 | 1985-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61164032U true JPS61164032U (en) | 1986-10-11 |
| JPH0353502Y2 JPH0353502Y2 (en) | 1991-11-22 |
Family
ID=30561799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985046937U Expired JPH0353502Y2 (en) | 1985-03-30 | 1985-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353502Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5714437U (en) * | 1980-06-27 | 1982-01-25 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
-
1985
- 1985-03-30 JP JP1985046937U patent/JPH0353502Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5714437U (en) * | 1980-06-27 | 1982-01-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353502Y2 (en) | 1991-11-22 |