JPS61162081U - - Google Patents

Info

Publication number

JPS61162081U

JPS61162081U JP4573185U JP4573185U JPS61162081U JP S61162081 U JPS61162081 U JP S61162081U JP 4573185 U JP4573185 U JP 4573185U JP 4573185 U JP4573185 U JP 4573185U JP S61162081 U JPS61162081 U JP S61162081U

Authority

JP

Japan

Prior art keywords

layer

conductor layer

conductor

wiring

wiring board

Prior art date

1985-03-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000010410 layer Substances 0.000 claims description 14
• 239000004020 conductor Substances 0.000 claims description 7
• 239000000758 substrate Substances 0.000 claims description 4
• 239000011229 interlayer Substances 0.000 claims description 2
• 238000005530 etching Methods 0.000 claims 2
• 239000000463 material Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• 239000010409 thin film Substances 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000010408 film Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1