JPS61162074U - - Google Patents
Info
- Publication number
- JPS61162074U JPS61162074U JP4610685U JP4610685U JPS61162074U JP S61162074 U JPS61162074 U JP S61162074U JP 4610685 U JP4610685 U JP 4610685U JP 4610685 U JP4610685 U JP 4610685U JP S61162074 U JPS61162074 U JP S61162074U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- printed circuit
- circuit board
- comb
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 2
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4610685U JPS61162074U (de) | 1985-03-29 | 1985-03-29 | |
| US06/844,822 US4795079A (en) | 1985-03-29 | 1986-03-27 | Structure of joining printed circuit boards and process for producing the same |
| US07/282,949 US4950527A (en) | 1985-03-29 | 1988-12-05 | Structure of joining printed circuit boards and process for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4610685U JPS61162074U (de) | 1985-03-29 | 1985-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61162074U true JPS61162074U (de) | 1986-10-07 |
Family
ID=30560197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4610685U Pending JPS61162074U (de) | 1985-03-29 | 1985-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61162074U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017203559A1 (ja) * | 2016-05-23 | 2017-11-30 | 新電元工業株式会社 | プリント基板の接合方法、電子装置およびその製造方法 |
-
1985
- 1985-03-29 JP JP4610685U patent/JPS61162074U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017203559A1 (ja) * | 2016-05-23 | 2017-11-30 | 新電元工業株式会社 | プリント基板の接合方法、電子装置およびその製造方法 |
| JPWO2017203559A1 (ja) * | 2016-05-23 | 2018-06-07 | 新電元工業株式会社 | プリント基板の接合方法、電子装置およびその製造方法 |
| US11032907B2 (en) | 2016-05-23 | 2021-06-08 | Shindengen Electric Manufacturing Co., Ltd. | Manufacturing method for electronic apparatus with case in which printed boards joined to each other are stored |