JPS61162058U - - Google Patents
Info
- Publication number
- JPS61162058U JPS61162058U JP1985045672U JP4567285U JPS61162058U JP S61162058 U JPS61162058 U JP S61162058U JP 1985045672 U JP1985045672 U JP 1985045672U JP 4567285 U JP4567285 U JP 4567285U JP S61162058 U JPS61162058 U JP S61162058U
- Authority
- JP
- Japan
- Prior art keywords
- conductive region
- semiconductor device
- thick film
- film layer
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985045672U JPH0717159Y2 (ja) | 1985-03-27 | 1985-03-27 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985045672U JPH0717159Y2 (ja) | 1985-03-27 | 1985-03-27 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61162058U true JPS61162058U (US20100056889A1-20100304-C00004.png) | 1986-10-07 |
| JPH0717159Y2 JPH0717159Y2 (ja) | 1995-04-19 |
Family
ID=30559381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985045672U Expired - Lifetime JPH0717159Y2 (ja) | 1985-03-27 | 1985-03-27 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717159Y2 (US20100056889A1-20100304-C00004.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918598U (US20100056889A1-20100304-C00004.png) * | 1972-05-18 | 1974-02-16 | ||
| JPS5419375A (en) * | 1977-07-14 | 1979-02-14 | Mitsubishi Electric Corp | Semiconductor device |
| JPS55153385A (en) * | 1979-05-18 | 1980-11-29 | Nippon Telegr & Teleph Corp <Ntt> | Current squeezing type semiconductor device |
-
1985
- 1985-03-27 JP JP1985045672U patent/JPH0717159Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4918598U (US20100056889A1-20100304-C00004.png) * | 1972-05-18 | 1974-02-16 | ||
| JPS5419375A (en) * | 1977-07-14 | 1979-02-14 | Mitsubishi Electric Corp | Semiconductor device |
| JPS55153385A (en) * | 1979-05-18 | 1980-11-29 | Nippon Telegr & Teleph Corp <Ntt> | Current squeezing type semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717159Y2 (ja) | 1995-04-19 |
