JPS61161640A - Method of connecting lead terminal for fluorescent character display tube and external circuit - Google Patents
Method of connecting lead terminal for fluorescent character display tube and external circuitInfo
- Publication number
- JPS61161640A JPS61161640A JP166485A JP166485A JPS61161640A JP S61161640 A JPS61161640 A JP S61161640A JP 166485 A JP166485 A JP 166485A JP 166485 A JP166485 A JP 166485A JP S61161640 A JPS61161640 A JP S61161640A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- lead terminals
- external circuit
- display tube
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、蛍光表示管と外部回路との接続方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for connecting a fluorescent display tube to an external circuit.
従来、この種の接続は、ノ・ンダを使用して、内部端子
と外部端子とを接続する方法であった。Conventionally, this type of connection has been a method of connecting an internal terminal and an external terminal using a solder.
上述した従来の接続方法は、内部リード端子と外部リー
ド端子の基体金属をハンダを溶融して接続するため、隣
シ合ったリード端子の間隔が狭い場合には、電気的に絶
縁されていなければならないリード端子間もハンダによ
り接続されるという欠点がある。又、ハンダ付けはフラ
ックスを使用するために、ハンダ付は後の洗浄が良好で
なければ、リード端子の腐蝕等でリード端子間の導通不
良を起こす欠点がある。The conventional connection method described above connects the base metal of the internal lead terminal and external lead terminal by melting solder, so if the distance between adjacent lead terminals is narrow, it is necessary to electrically insulate them. There is a drawback that lead terminals that are not connected to each other are also connected by solder. Furthermore, since flux is used in soldering, soldering has the drawback of causing corrosion of the lead terminals and poor conductivity between the lead terminals unless cleaning is done properly afterwards.
本発明は、接続しようとするリード端子の表面に加熱加
圧により接続可能な金属層を形成し、熱圧着するもので
ある。In the present invention, a connectable metal layer is formed on the surface of a lead terminal to be connected by heating and pressurizing, and the metal layer is bonded by thermocompression.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は、本発明の実施例の全体図である。■は本体真
空容器、２は本体真空容器を構成するガラス素板、３は
内部リード端子、４は外部リード端子、５は外部回路構
成品でアシ、熱圧着後の図である。FIG. 1 is an overall view of an embodiment of the present invention. 2 is a main vacuum container, 2 is a glass plate constituting the main vacuum container, 3 is an internal lead terminal, 4 is an external lead terminal, and 5 is an external circuit component after thermocompression bonding.
第２図はリード端子部熱圧着前の拡大図であり、３は内
部リード端子、６は内部リード端子表面に熱圧着可能な
金属層を形成した部分、７は各内部リード端子を連結し
ているタイバ一部、８はガラス素板２に設けられた外部
リード端子の表面に熱圧着可能な金属を形成した部分で
おる。Fig. 2 is an enlarged view of the lead terminal before thermocompression bonding, where 3 is an internal lead terminal, 6 is a portion where a metal layer that can be thermocompression bonded is formed on the surface of the internal lead terminal, and 7 is a portion where each internal lead terminal is connected. A part of the tie bar 8 is a part formed with a metal that can be thermocompression bonded to the surface of an external lead terminal provided on the glass base plate 2.
第２図で接続方法を説明する。まず内部リード端子と外
部リード端子の各々のリード端子間隔は同一のものとす
る。この場合内部リード端子は。The connection method will be explained with reference to FIG. First, it is assumed that the lead terminal spacing between the internal lead terminals and the external lead terminals is the same. In this case the internal lead terminal is.
タイバーによシ全て連結、固定されているのでリード端
子の乱れは起こらない。従って少なくとも、ある１ケ所
のリード端子で対応する外部リード端子と位置合せをす
れば、全体のリード端子の位置合せは完了する。その次
に熱圧着によシ、全リード端子を同時に接続する。その
後、リード端子を連結していたタイバ一部を切断し、各
リードを独立させて作業は完了する。All the wires are connected and fixed by tie bars, so there is no chance of disorder of the lead terminals. Therefore, alignment of the entire lead terminals is completed by aligning at least one lead terminal with the corresponding external lead terminal. Next, all lead terminals are connected at the same time by thermocompression bonding. After that, part of the tie bar connecting the lead terminals is cut off, and the work is completed by making each lead independent.
尚第１図の実施例では、ガラス素板上に外部回路を構成
しているが、エポキシ樹脂等の絶縁基板上に構成された
外部回路と蛍光表示管の内部リードとを接続する場合に
も応用可能であることは言うまでもない。In the embodiment shown in Fig. 1, the external circuit is constructed on a glass base plate, but it can also be used when connecting an external circuit constructed on an insulating substrate such as epoxy resin to the internal leads of a fluorescent display tube. Needless to say, it is applicable.
以上、説明した様に本発明は、リード端子を熱圧着によ
り接続するため、従来一本一本接続していたリード端子
を同時に多数本接続可能となるため、作業上の工数を著
しく低減出来る効果がある。As explained above, the present invention connects the lead terminals by thermocompression bonding, so it is possible to connect many lead terminals at the same time, which was conventionally connected one by one, and has the effect of significantly reducing the number of work steps. There is.
第１図は本発朗の実施例の全体を示す斜視図である。第
２図はリード端子部、熱圧着前の拡大斜視図である。
■・・・・・・本体真空容器、２・・・・・・本体真空
容器を構成するガラス素板、３・・・・・・内部リード
端子、４・・・・・・外部リード端子、５・・・・・・
外部回路構成品、６・・・・・・内部リード端子表面に
熱圧着可能な金属層を形成した部分、７・・・・・・各
内部リード端子を連結しているタイバ一部、８・・・・
・・ガラス素板２に設けられた外部リード端子の表面に
熱圧着可能な金属層を形成した部分。
代理人 弁理士 内 原 晋 ＋１’、’ｌ。FIG. 1 is a perspective view showing the entire embodiment of the present invention. FIG. 2 is an enlarged perspective view of the lead terminal portion before thermocompression bonding. ■...Main vacuum container, 2...Glass plate constituting the main vacuum container, 3...Internal lead terminal, 4...External lead terminal, 5...
External circuit components, 6... Part with a thermocompression bondable metal layer formed on the surface of the internal lead terminal, 7... Part of the tie bar connecting each internal lead terminal, 8... ...
...A portion where a thermocompression-bondable metal layer is formed on the surface of the external lead terminal provided on the glass base plate 2. Agent: Susumu Uchihara, patent attorney +1','l.
Claims (1)
ド端子と外部回路に接続されたリード端子とを、前記リ
ード端子の金属融点よりも低い温度で加熱加圧し、接着
することを特徴とする蛍光表示管リード端子と外部回路
との接続方法。In a fluorescent display tube, a lead terminal guided outside the main vacuum container and a lead terminal connected to an external circuit are bonded together by heating and pressurizing the lead terminal at a temperature lower than the metal melting point of the lead terminal. How to connect the display tube lead terminal to an external circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP166485A JPS61161640A (en) | 1985-01-09 | 1985-01-09 | Method of connecting lead terminal for fluorescent character display tube and external circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP166485A JPS61161640A (en) | 1985-01-09 | 1985-01-09 | Method of connecting lead terminal for fluorescent character display tube and external circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61161640A true JPS61161640A (en) | 1986-07-22 |
Family
ID=11507787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP166485A Pending JPS61161640A (en) | 1985-01-09 | 1985-01-09 | Method of connecting lead terminal for fluorescent character display tube and external circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61161640A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009543045A (en) * | 2006-06-30 | 2009-12-03 | ロベルト ボッシュ ゲゼルシャフト ミト ベシュレンクテル ハフツング | Push belt test method and test apparatus for carrying out this type of method |
-
1985
- 1985-01-09 JP JP166485A patent/JPS61161640A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009543045A (en) * | 2006-06-30 | 2009-12-03 | ロベルト ボッシュ ゲゼルシャフト ミト ベシュレンクテル ハフツング | Push belt test method and test apparatus for carrying out this type of method |
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