JPS61161573U - - Google Patents
Info
- Publication number
- JPS61161573U JPS61161573U JP4105885U JP4105885U JPS61161573U JP S61161573 U JPS61161573 U JP S61161573U JP 4105885 U JP4105885 U JP 4105885U JP 4105885 U JP4105885 U JP 4105885U JP S61161573 U JPS61161573 U JP S61161573U
- Authority
- JP
- Japan
- Prior art keywords
- base
- heating element
- mounting part
- element mounting
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4105885U JPS61161573U (fi) | 1985-03-22 | 1985-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4105885U JPS61161573U (fi) | 1985-03-22 | 1985-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61161573U true JPS61161573U (fi) | 1986-10-06 |
Family
ID=30550525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4105885U Pending JPS61161573U (fi) | 1985-03-22 | 1985-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61161573U (fi) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010177680A (ja) * | 1997-02-24 | 2010-08-12 | Fujitsu Ltd | ヒートシンクおよびそれを搭載した情報処理装置 |
| JP2013077606A (ja) * | 2011-09-29 | 2013-04-25 | Icom Inc | 放熱体 |
-
1985
- 1985-03-22 JP JP4105885U patent/JPS61161573U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010177680A (ja) * | 1997-02-24 | 2010-08-12 | Fujitsu Ltd | ヒートシンクおよびそれを搭載した情報処理装置 |
| JP2013077606A (ja) * | 2011-09-29 | 2013-04-25 | Icom Inc | 放熱体 |