JPS6116029B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inspection method for inspecting a short-circuited state of a circuit pattern on a board to be inspected.

In general, inspection of short circuits etc. of the circuit pattern of the board is carried out by
A detection method using a stylus is used. However,
Circuit boards often have plating leads, and if these plating leads are present, detection with the stylus is impossible. Therefore, those with a blind lead are visually inspected. For this reason, not only was the inspection time-consuming, but also many inspection errors occurred.

The present invention has been made in view of these points, and provides an inspection method that enables short-circuit inspection even when a wire has a blind lead. It goes without saying that the present invention can also inspect a board that does not have a plating lead.

The present invention will be described below with reference to embodiments shown in the drawings. FIG. 1 is a perspective view of the inspection section. In the figure, 1 is a lower base that holds a detection target substrate 2, and 3 is an upper base that holds a detection substrate 4 having a detection electrode. The lower base 1 is movable in the X or Y direction, and the upper base 3 is movable in the Z direction (vertical direction). The detection target board 2 has a circuit wiring pattern 2-1 as shown in FIG. 2a, for example.
2-2 in the figure is Metsuki lead.

On the other hand, the detection substrate 4 has an electrode 4-1 formed thereon with an opposite pattern to the circuit wiring pattern 2-1 of the detection target substrate 2, as shown in FIG. 2B. This electrode 4-
The negative width of 1 is the wiring pattern 2-
It is formed narrower than the width of the reverse pattern of pattern 1.

In the above configuration, the upper base 3 is lowered, and the detection substrate 4 and the detected substrate 2 on the lower base 1 are brought into contact with each other and overlapped. In this case, the superimposed state is shown in FIG. 2c. In this state shown in FIG. 2c, the conduction state between the wiring pattern 2-1 and the electrode 4-1 is detected. Therefore, if a conductive state is detected, a short circuit 2-3 is established between some negatives of the wiring pattern 2-1, and this short-circuit portion 2-3 and the electrode 4 are connected.
-1 is detected as a conductive state, and a short-circuited state of the wiring pattern 2-1 on the board 2 to be inspected can be easily detected. If the conduction state is not detected, the next board to be detected 2 is held on the lower base 1,
The above-mentioned test may be performed.

Here, the negative width of the electrode 4-1 of the detection board 4 is
Since the width is narrower than the width of the reverse pattern other than the circuit wiring on the board to be inspected 2, the width of the circuit wiring pattern 2-1 of the board to be inspected 2 and the electrode 4-1 of the inspection board 4 is not in contact with each other. The side can be moved in the X or Y direction to make the inspection more reliable. That is, the lower base 1 is shifted by a small pitch, the upper base 3 is superimposed, and the conduction state is detected each time. This operation is repeated by moving the lower base 1 to such an extent that the circuit wiring pattern 2-1 and the electrode 4-1 do not come into contact with each other as described above. If the conduction state is not detected while the lower base 1 is being moved, there is no negative short circuit of the detected substrate 2. In this case, the test can be performed with higher reliability than a one-time test, and not only short circuits between negatives but also short circuits can be detected.

As explained above, according to the short circuit inspection method according to the present invention, it is possible to inspect the wiring patterns on the same plane at the same time for the wiring patterns that are spread two-dimensionally on the board. It is possible to shorten the time and mechanize the inspection work, which is extremely advantageous in improving productivity and reliability.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an example of the inspection method according to the present invention, Fig. 2 a, b, and c show each board according to the present invention, and a shows an example of the circuit wiring pattern of the board to be inspected. A plan view, b is a plan view showing the detection electrode of the detection substrate, and c is a perspective plan view showing a state where a and b are superimposed. 2; Detected board, 2-1; Circuit wiring pattern,
4; Detection substrate, 4-1; Detection electrode.

Claims (1)

[Claims] 1. Overlaying a test board on the board to be tested, which has an opposite pattern to the two-dimensional circuit wiring pattern formed on the board to be tested, and on which electrodes with a negative width narrower than the circuit wiring pattern are formed. A circuit of a board characterized in that a short circuit in the circuit wiring pattern of the board to be tested is tested by bringing the circuit wiring pattern of the board to be tested into surface contact with an electrode of the board to be tested and detecting a short circuit state between the circuit wiring pattern of the board to be tested and an electrode of the board to be tested. Short circuit test method.