JPS61159730A - Method of removing particle in emulsion mask - Google Patents

Method of removing particle in emulsion mask

Info

Publication number
JPS61159730A
JPS61159730A JP60000371A JP37185A JPS61159730A JP S61159730 A JPS61159730 A JP S61159730A JP 60000371 A JP60000371 A JP 60000371A JP 37185 A JP37185 A JP 37185A JP S61159730 A JPS61159730 A JP S61159730A
Authority
JP
Japan
Prior art keywords
jig
particles
mask
particle
charged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60000371A
Other languages
Japanese (ja)
Inventor
Shigeyuki Hoshino
星野 重幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP60000371A priority Critical patent/JPS61159730A/en
Publication of JPS61159730A publication Critical patent/JPS61159730A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To remove particles positively by sucking and removing the particles adhering on an emulsion mask by a jig on which static electricity is charged. CONSTITUTION:Static electricity is charged previously to a needle-like jig 3, and the needle tip of the jig 3 is brought near at a distance of 1-3mm to a particle 2 under the state in which an emulsion mask 1 is scaled up and viewed through a microscope. Consequently, the particle 2 is separated from the emulsion mask 1, and sucked to the needle tip of the jig 3 on which static electricity is charged. The jig 3 is brought near a suction port 5 under a vacuum to suck and discharge the particle 2. Accordingly, the particle can be removed without being brought into contact with the mask, and fine particles are also removed while the adhesion of novel particles can also be prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、エマルジョンマスクに付着しfl /<−
ティクル(不純具+!1J)t−除去する方法に関する
ものである。
[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides an emulsion mask with fl/<-
This relates to a method for removing tickles (impurities +!1J).

〔従来の技術〕[Conventional technology]

従来、フォトマスク等に付着したパーティクルを除去す
る方法としては、高圧水洗浄法やブラシ等を用いた洗浄
法が行なわれている。この種の洗浄法は例えばクロムマ
スク等のように硬質材のものでは行なうことができるが
、エマルジョンマスクは文献(5AKURA、PM、N
EWS、  瀧5t−参照)に記載されているように乳
剤(ゼラチン)が用いられているのでパターンが柔らか
く、シたがって上記による洗浄法ではパターンが剥離さ
れたプ傷が付いたシするため不適歯である。このためエ
マルジョンマスクのパーティクル除去B NH7’ a
 −−?綿棒による除去が行なわれていた。
Conventionally, as a method for removing particles attached to a photomask or the like, a high-pressure water cleaning method or a cleaning method using a brush or the like has been used. This type of cleaning method can be performed on hard materials such as chrome masks, but emulsion masks are
As described in EWS, Taki 5t-), since emulsion (gelatin) is used, the pattern is soft, so the above cleaning method is not suitable as the pattern will peel off and leave scratches. It's teeth. For this reason, emulsion mask particle removal B NH7' a
--? Removal was done using a cotton swab.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記のようにエマルジョンマスクのパーティクル除去に
おいては、Nlプローでは風によシ発生したごみがマス
クに付着したり、綿棒ではこれ自体に付着しているパル
ティクルがマスクに付着しゃすい上、綿棒は微小なパー
ティクルが除去しきれない等の間亀点があった。
As mentioned above, when removing particles from emulsion masks, Nl blowers tend to cause dust generated by the wind to adhere to the mask, and cotton swabs tend to cause particles attached to themselves to adhere to the mask. There were some downsides, such as not being able to remove all the particles.

この発8Aは、以上述べた問題点を除去し、マスク上へ
の新次なパーティクルの付着を防止すると共に、微小パ
ーティクルの除去をも行なうことのできるパーティクル
除去方法を提供することを目的とする。
The purpose of this invention 8A is to provide a particle removal method that can eliminate the above-mentioned problems, prevent new particles from adhering to the mask, and also remove minute particles. .

〔問題点を解決するための手段〕[Means for solving problems]

この発明におけるパーティクル除去方法は、エマルジョ
ンマスクに付着したパーティクルを静電気が帯電した治
具に吸着し除去するものである。
The particle removal method according to the present invention is to remove particles attached to an emulsion mask by adsorbing them to a jig charged with static electricity.

〔作 用〕[For production]

この発明では、エマルジョンマスクに静電気が帯電した
治具を近ずけることによシ、パーティクルがマスクから
離れて治具に吸着させることができる。また静電気は治
具の他の部材による摩擦帯電や帯電器により行なえる。
In this invention, by bringing a jig charged with static electricity close to the emulsion mask, particles can be separated from the mask and attracted to the jig. Further, static electricity can be generated by frictional charging using other members of the jig or by a charger.

〔実施例〕〔Example〕

第1図はこの発明の一実施例を示す概!!囚であって、
lはエマルジョンマスク、2はこのマスク1上に付着さ
れたパーティクルを示す。3はガラスまたは金属の針状
治具で、治具3の把持部4は絶縁物からできているo5
はパーティクル2のバキュームによる吸引口である。
FIG. 1 schematically shows an embodiment of this invention. ! Being a prisoner,
1 indicates an emulsion mask, and 2 indicates particles attached to this mask 1. 3 is a needle-like jig made of glass or metal, and the gripping part 4 of the jig 3 is o5 made of an insulator.
is a suction port for vacuuming particles 2.

次にパーティクルの除去方法について説明する。Next, a method for removing particles will be explained.

まず、針状治具3に静電気を帯電させておき、エマルジ
ョンマスクlを顕微鏡を通して拡大視した状態で治具3
の針先をパーティクル2に1〜3簡の距離に接近させる
。これによp、パーティクル2はエマルジョンマスク1
から分離して静電帯電している治具3の針先に吸着する
ことができ、その後、パーティクル2t−吸着し之治具
3をバキュームの吸引口5に近ずけてパーティクル2を
吸引排出する。このように治具3’i用いて一つずつの
パーティクル2をエマルジョンマスク1から除去するも
のである。
First, the needle-like jig 3 is charged with static electricity, and the emulsion mask l is magnified through a microscope.
Bring the tip of the needle close to particle 2 at a distance of 1 to 3 feet. With this, p, particle 2 is emulsion mask 1
The particles 2t can be separated from the particles and adsorbed to the electrostatically charged needle tip of the jig 3, and then the particles 2t are attracted to the suction port 5 of the vacuum and the particles 2 are sucked out. do. In this way, the particles 2 are removed one by one from the emulsion mask 1 using the jig 3'i.

治具3への静電気の帯電は摩擦による方法が適用され、
静電気はガラス、a気、樹脂およびセルロイドの順に負
に帯電しやすいので、例えばガラス製の治具3はセルロ
イド板に摩擦して帯電させればよく、また金属製の治具
3の場合はガラス板に摩擦して帯電させれはよい。
The jig 3 is charged with static electricity by a friction method.
Static electricity tends to charge negatively in the order of glass, aeration, resin, and celluloid, so for example, a glass jig 3 can be charged by rubbing it against a celluloid plate, and a metal jig 3 can be charged with a glass jig 3. It is good to be charged by rubbing against the plate.

第2図は治具の他の実施例を示すもので、f3はエマル
ジョンマスクlと略同じ大きさの金属平板治具で、エマ
ルジョンマスクlと1〜3閤の間隔を隔てて配置させで
ある。7は治具6へ高電圧を帯電させるための帯電器で
、帯電圧は治具7が放電をおこさない範囲で最大にする
とよい。上記のような除去方法では除去可能なパーティ
クルは凡そ10〜50μ程度のものまで除去できる。
Fig. 2 shows another example of the jig, where f3 is a flat metal jig of approximately the same size as the emulsion mask l, and is placed at an interval of 1 to 3 tassels from the emulsion mask l. . Reference numeral 7 denotes a charger for charging the jig 6 with a high voltage, and the charging voltage is preferably maximized within a range where the jig 7 does not cause discharge. The above-mentioned removal method can remove particles with a size of about 10 to 50 microns.

〔発明の効果〕〔Effect of the invention〕

以上、説明したようにこの発明によれば、エマルジョン
マスクに付着したパーティクルを帯電した治具に吸着し
除去できるようにしたので、パーティクルの除去がマス
クに無接触で行なえ、柔らかい材質のパターンに傷を付
けることなく微小なパーティクルの除去も可能であると
共に、新たなパーティクルの付着も防止できる。これに
よシ無欠陥なマスクを安価に、しかも簡単に製作できる
As explained above, according to the present invention, particles attached to an emulsion mask can be removed by adsorption to a charged jig, so particles can be removed without contacting the mask, and patterns made of soft material can be scratched. It is possible to remove minute particles without attaching them, and it is also possible to prevent new particles from adhering. This allows defect-free masks to be produced easily and inexpensively.

【図面の簡単な説明】[Brief explanation of the drawing]

第11iVはこの発明のパーティクル除去方法を実施す
るための概l!図、第2図は他の例の概l!崗であるO 1…エマルジヨンマスク、21・eパーティクル、3・
・・針状治具、5・・・吸引口、6・・・金属平板治具
、7・・・帯電器。
The 11th iV is a general procedure for carrying out the particle removal method of the present invention! Figure 2 shows another example. O 1...emulsion mask, 21・e particles, 3・
... Needle jig, 5... Suction port, 6... Metal plate jig, 7... Charger.

Claims (3)

【特許請求の範囲】[Claims] (1)エマルジョンマスク上に付着したパーティクルを
除去する方法において、エマルジヨンマスクに帯電した
治具を近ずけ、この治具にパーティクルを吸着すること
を特徴とするエマルジョンマスクのパーティクル除去方
法。
(1) A method for removing particles from an emulsion mask, which comprises bringing a charged jig close to the emulsion mask and adsorbing the particles to the jig.
(2)治具がガラスまたは金属の針状治具であることを
特徴とする特許請求の範囲第1項記載のパーティクル除
去方法。
(2) The particle removal method according to claim 1, wherein the jig is a needle-like jig made of glass or metal.
(3)治具がマスクと略同じ大きさの金属平板治具であ
ることを特徴とする特許請求の範囲第1項記載のパーテ
ィクル除去方法。
(3) The particle removal method according to claim 1, wherein the jig is a flat metal jig having approximately the same size as the mask.
JP60000371A 1985-01-08 1985-01-08 Method of removing particle in emulsion mask Pending JPS61159730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60000371A JPS61159730A (en) 1985-01-08 1985-01-08 Method of removing particle in emulsion mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60000371A JPS61159730A (en) 1985-01-08 1985-01-08 Method of removing particle in emulsion mask

Publications (1)

Publication Number Publication Date
JPS61159730A true JPS61159730A (en) 1986-07-19

Family

ID=11471931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60000371A Pending JPS61159730A (en) 1985-01-08 1985-01-08 Method of removing particle in emulsion mask

Country Status (1)

Country Link
JP (1) JPS61159730A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08254817A (en) * 1994-12-27 1996-10-01 Siemens Ag Method and apparatus for cleaning of photomask
US7306680B2 (en) 2002-09-12 2007-12-11 Asml Netherlands B.V. Method of cleaning by removing particles from surfaces, a cleaning apparatus and a lithographic projection apparatus
US7522263B2 (en) 2005-12-27 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and method
WO2009091642A3 (en) * 2008-01-17 2009-09-24 Applied Materials, Inc. Electrostatic surface cleaning

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08254817A (en) * 1994-12-27 1996-10-01 Siemens Ag Method and apparatus for cleaning of photomask
US7306680B2 (en) 2002-09-12 2007-12-11 Asml Netherlands B.V. Method of cleaning by removing particles from surfaces, a cleaning apparatus and a lithographic projection apparatus
US7522263B2 (en) 2005-12-27 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and method
US8064038B2 (en) 2005-12-27 2011-11-22 Asml Netherlands B.V. Inspection apparatus, lithographic system provided with the inspection apparatus and a method for inspecting a sample
WO2009091642A3 (en) * 2008-01-17 2009-09-24 Applied Materials, Inc. Electrostatic surface cleaning

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