JPS61158423U - - Google Patents
Info
- Publication number
- JPS61158423U JPS61158423U JP4109985U JP4109985U JPS61158423U JP S61158423 U JPS61158423 U JP S61158423U JP 4109985 U JP4109985 U JP 4109985U JP 4109985 U JP4109985 U JP 4109985U JP S61158423 U JPS61158423 U JP S61158423U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- thermal expansion
- coefficient
- ceramic substrate
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4109985U JPS61158423U (enrdf_load_stackoverflow) | 1985-03-22 | 1985-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4109985U JPS61158423U (enrdf_load_stackoverflow) | 1985-03-22 | 1985-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61158423U true JPS61158423U (enrdf_load_stackoverflow) | 1986-10-01 |
Family
ID=30550606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4109985U Pending JPS61158423U (enrdf_load_stackoverflow) | 1985-03-22 | 1985-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61158423U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0480038B1 (en) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5279265A (en) * | 1975-12-25 | 1977-07-04 | Nippon Electric Co | Hybrid integrated circuit substrate |
| JPS5563900A (en) * | 1978-11-08 | 1980-05-14 | Fujitsu Ltd | Multilyaer ceramic circuit board |
| JPS59107596A (ja) * | 1982-12-13 | 1984-06-21 | 株式会社日立製作所 | セラミツク多層配線回路板 |
-
1985
- 1985-03-22 JP JP4109985U patent/JPS61158423U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5279265A (en) * | 1975-12-25 | 1977-07-04 | Nippon Electric Co | Hybrid integrated circuit substrate |
| JPS5563900A (en) * | 1978-11-08 | 1980-05-14 | Fujitsu Ltd | Multilyaer ceramic circuit board |
| JPS59107596A (ja) * | 1982-12-13 | 1984-06-21 | 株式会社日立製作所 | セラミツク多層配線回路板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0480038B1 (en) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |