JPS61158423U - - Google Patents

Info

Publication number
JPS61158423U
JPS61158423U JP4109985U JP4109985U JPS61158423U JP S61158423 U JPS61158423 U JP S61158423U JP 4109985 U JP4109985 U JP 4109985U JP 4109985 U JP4109985 U JP 4109985U JP S61158423 U JPS61158423 U JP S61158423U
Authority
JP
Japan
Prior art keywords
metal foil
thermal expansion
coefficient
ceramic substrate
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4109985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4109985U priority Critical patent/JPS61158423U/ja
Publication of JPS61158423U publication Critical patent/JPS61158423U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Waveguides (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案に係る金属箔付セラミツク基
板を示す斜視図、第２図は金属箔のセラミムツク
基板に対する密着力の測定方法を示す説明図であ
る。 １……セラミツク基板、２……ガラス層、３…
…金属箔、４……円柱棒、５……エポキシセメダ
イン、１０……金属箔付セラミツク基板。 FIG. 1 is a perspective view showing a ceramic substrate with metal foil according to the present invention, and FIG. 2 is an explanatory view showing a method for measuring the adhesion of a metal foil to a ceramic substrate. 1... Ceramic substrate, 2... Glass layer, 3...
...Metal foil, 4... Cylindrical rod, 5... Epoxy Cemedine, 10... Ceramic substrate with metal foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミツク基板上に熱膨張率が前記セラミツク
基板の熱膨張率と金属箔の熱膨張率の中間の値で
あるガラス層を介して該金属箔を貼着せしめたこ
とを特徴とする金属箔付セラミツク基板。 A ceramic with metal foil, characterized in that the metal foil is adhered to a ceramic substrate via a glass layer whose coefficient of thermal expansion is an intermediate value between the coefficient of thermal expansion of the ceramic substrate and the coefficient of thermal expansion of the metal foil. substrate.
JP4109985U 1985-03-22 1985-03-22 Pending JPS61158423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4109985U JPS61158423U (en) 1985-03-22 1985-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4109985U JPS61158423U (en) 1985-03-22 1985-03-22

Publications (1)

Publication Number Publication Date
JPS61158423U true JPS61158423U (en) 1986-10-01

Family

ID=30550606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4109985U Pending JPS61158423U (en) 1985-03-22 1985-03-22

Country Status (1)

Country Link
JP (1) JPS61158423U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0480038A1 (en) * 1990-04-16 1992-04-15 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279265A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Hybrid integrated circuit substrate
JPS5563900A (en) * 1978-11-08 1980-05-14 Fujitsu Ltd Multilyaer ceramic circuit board
JPS59107596A (en) * 1982-12-13 1984-06-21 株式会社日立製作所 Ceramic multilayer wiring circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279265A (en) * 1975-12-25 1977-07-04 Nippon Electric Co Hybrid integrated circuit substrate
JPS5563900A (en) * 1978-11-08 1980-05-14 Fujitsu Ltd Multilyaer ceramic circuit board
JPS59107596A (en) * 1982-12-13 1984-06-21 株式会社日立製作所 Ceramic multilayer wiring circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0480038A1 (en) * 1990-04-16 1992-04-15 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
EP0480038B1 (en) * 1990-04-16 1997-07-09 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board

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