JPS61156239U - - Google Patents
Info
- Publication number
- JPS61156239U JPS61156239U JP3818885U JP3818885U JPS61156239U JP S61156239 U JPS61156239 U JP S61156239U JP 3818885 U JP3818885 U JP 3818885U JP 3818885 U JP3818885 U JP 3818885U JP S61156239 U JPS61156239 U JP S61156239U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- integrated circuit
- circuit chip
- light shielding
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3818885U JPS61156239U (US06368395-20020409-C00050.png) | 1985-03-19 | 1985-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3818885U JPS61156239U (US06368395-20020409-C00050.png) | 1985-03-19 | 1985-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61156239U true JPS61156239U (US06368395-20020409-C00050.png) | 1986-09-27 |
Family
ID=30544958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3818885U Pending JPS61156239U (US06368395-20020409-C00050.png) | 1985-03-19 | 1985-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156239U (US06368395-20020409-C00050.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000002244A1 (fr) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
| JP2003023035A (ja) * | 2001-07-05 | 2003-01-24 | Sharp Corp | 半導体装置 |
| KR100498848B1 (ko) * | 1998-12-21 | 2005-07-04 | 세이코 엡슨 가부시키가이샤 | 회로 기판 및 회로 기판을 사용한 표시 장치 및 전자 기기 |
-
1985
- 1985-03-19 JP JP3818885U patent/JPS61156239U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000002244A1 (fr) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
| KR100498848B1 (ko) * | 1998-12-21 | 2005-07-04 | 세이코 엡슨 가부시키가이샤 | 회로 기판 및 회로 기판을 사용한 표시 장치 및 전자 기기 |
| JP2003023035A (ja) * | 2001-07-05 | 2003-01-24 | Sharp Corp | 半導体装置 |
