JPS61151374U - - Google Patents

Info

Publication number
JPS61151374U
JPS61151374U JP1985033009U JP3300985U JPS61151374U JP S61151374 U JPS61151374 U JP S61151374U JP 1985033009 U JP1985033009 U JP 1985033009U JP 3300985 U JP3300985 U JP 3300985U JP S61151374 U JPS61151374 U JP S61151374U
Authority
JP
Japan
Prior art keywords
insulating film
utility
electrical component
circuit board
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985033009U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985033009U priority Critical patent/JPS61151374U/ja
Priority to US06/838,286 priority patent/US4691188A/en
Publication of JPS61151374U publication Critical patent/JPS61151374U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP1985033009U 1985-03-08 1985-03-08 Pending JPS61151374U (US20110009641A1-20110113-C00160.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985033009U JPS61151374U (US20110009641A1-20110113-C00160.png) 1985-03-08 1985-03-08
US06/838,286 US4691188A (en) 1985-03-08 1986-03-10 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985033009U JPS61151374U (US20110009641A1-20110113-C00160.png) 1985-03-08 1985-03-08

Publications (1)

Publication Number Publication Date
JPS61151374U true JPS61151374U (US20110009641A1-20110113-C00160.png) 1986-09-18

Family

ID=12374823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985033009U Pending JPS61151374U (US20110009641A1-20110113-C00160.png) 1985-03-08 1985-03-08

Country Status (2)

Country Link
US (1) US4691188A (US20110009641A1-20110113-C00160.png)
JP (1) JPS61151374U (US20110009641A1-20110113-C00160.png)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302015A (en) * 1992-03-12 1994-04-12 Microcomputer Accessories, Inc. Adjustable keyboard drawer
JP4301661B2 (ja) * 1999-11-12 2009-07-22 富士通マイクロエレクトロニクス株式会社 ボールグリッドアレイ構造のデバイスに使用されるコンタクトフィルム及びデバイス実装構造体
JP3813418B2 (ja) * 2000-07-21 2006-08-23 アルプス電気株式会社 フレキシブル多層配線基板
US6710303B1 (en) * 2002-11-13 2004-03-23 W.E.T. Automotive Systems Ag Intermediate electrical connecting device for seat-heating systems
US7897888B2 (en) * 2006-03-30 2011-03-01 Strattec Security Corporation Key fob device and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717734U (US20110009641A1-20110113-C00160.png) * 1980-07-03 1982-01-29
JPS5852699U (ja) * 1981-09-30 1983-04-09 日本電気株式会社 磁気バブル・メモリ・モジユ−ル用基板
JPS59200494A (ja) * 1983-04-28 1984-11-13 株式会社東芝 混成回路装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
JPS5656174U (US20110009641A1-20110113-C00160.png) * 1979-10-04 1981-05-15
GB2079225B (en) * 1980-06-27 1985-03-20 Ricoh Kk Thermal head device
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717734U (US20110009641A1-20110113-C00160.png) * 1980-07-03 1982-01-29
JPS5852699U (ja) * 1981-09-30 1983-04-09 日本電気株式会社 磁気バブル・メモリ・モジユ−ル用基板
JPS59200494A (ja) * 1983-04-28 1984-11-13 株式会社東芝 混成回路装置

Also Published As

Publication number Publication date
US4691188A (en) 1987-09-01

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