JPS61150296A - Method and apparatus for manufacturing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a novel printed circuit board manufacturing method and printed circuit board manufacturing apparatus. Specifically, the present invention aims to provide a novel printed circuit board manufacturing method and a printed circuit board manufacturing apparatus that can obtain a printed circuit board that has excellent bending strength and has a bendable conductor. .

BACKGROUND ART AND PROBLEMS Conductive metal foil, such as copper foil, has extremely excellent properties as a conductor for flexible printed circuit boards (hereinafter referred to as rFPCJ). Recently, FPCs have been widely used in various fields, and among them, FPCs are sometimes used in areas where bending loads are repeatedly applied.

For example, in the FPC that connects the print head of various printers and its control unit, the print head is a movable part and the control part is a fixed part, so the FPC that connects the two cannot be bent. It is used in situations where extremely severe bending loads are applied, such as when it is being rolled uphill or the bending points are moved one after another.

Therefore, the FPC conductor used in such a location must be one that does not break due to bending.

Therefore, we have tried to find a suitable copper foil as a conductor for such an FPC, but at present there is no suitable copper foil.

For example, plated copper foil has the advantage of being inexpensive, but has the disadvantage of being weak against bending movements. This is because when using the plating method, as shown in Figure 12, copper particles a, a,... are deposited in a columnar manner to produce copper foil, and the density of the deposition is coarse, resulting in less bending. This is because they are extremely susceptible to repetition. In addition, the coarse deposition density of copper particles increases the electrical resistance, and the FP
It is not very desirable as a C conductor.

For this reason, plated copper foil can be used as an FPC conductor in places where it is placed in a bent state, but if it is repeatedly bent or the bending position moves, It could not be used as a conductor for the FPC used in some locations.

Rolled annealed copper foil is strong against bending and has low electrical resistance, and in this respect it is suitable as a conductor for FPCs used in areas that are repeatedly bent.

However, there is a limit to the thinness of rolled annealed copper foil, and it can only be made as thin as 18 microns (final), and this is an obstacle to reducing the width of the copper foil part (conductor). There is a problem that.

That is, in order to manufacture an FPC using rolled annealed copper foil as a conductor, first, the copper foil C is pasted all over the base plate and the film b, and then unnecessary portions are removed by etching. When etching is performed, as shown in FIG.

There is a problem that portions d, φ, . . . of the copper foil C on the side of the base film b are removed. Moreover, the removed portions d, d, . . . become larger as the thickness of the copper foil C becomes thicker, so there is a limit to how thin the copper foil C can be made in rolled annealed copper foil.

A considerable portion is determined by etching, and therefore the conductor width e is determined by the determined portions d, d, .
The width must be made larger to account for ..., which impedes higher circuit density.

In addition, since it is necessary to bond a plate-shaped copper foil to a base film, it is necessary to increase the adhesive strength, so post-processing after forming the copper foil, such as surface treatment to make the bonded side of the copper foil uneven, is necessary. In addition to the high cost of the rolling process itself, there is a problem in that the cost becomes even more expensive.

OBJECTS OF THE INVENTION The present invention provides a novel printed circuit board with a patterned conductor that has excellent bending strength and is suitable for use in areas where bending stress is frequently applied. An object of the present invention is to provide a method for manufacturing a board and an apparatus for manufacturing a printed circuit board.

SUMMARY OF THE INVENTION In order to achieve the above object, the method for manufacturing a printed circuit board of the present invention provides a method of manufacturing a printed circuit board of the present invention, in which a conductive metal strip is made into a cathode by contacting a cathode, and a conductive metal strip is coated with a plating resist on the side facing the anode, excluding a conductive pattern. A plating current is applied between the conductive metal strip and the anode, a pulsed plating current is supplied between the cathode and the anode, and a reverse plating current is applied at appropriate times between the cathode and the anode. supplying a current, thereby depositing a patterned conductor on the conductive metal strip, transferring the patterned conductor to a base film, and adhering an overlay film to the surface of the base film to which the patterned conductor has been transferred; The apparatus for manufacturing a printed circuit board of the present invention includes a plating liquid tank containing a plating liquid, a can located above the plating liquid tank and having a flat surface extending in the horizontal direction; A conductive metal strip is made into a cathode by contacting the flat surface of the cathode, and has a plating resist material applied to the surface facing the anode except for the conductive pattern, and is opposed to the flat surface of the cathode at an appropriate distance. means for supplying a plating solution between the anode and a conductive metal strip in contact with the cathode; and a means for supplying a pulsed plating current between the cathode and the anode and controlling the direction of the current in a timely manner. means for supplying a pulsed current that can be reversed; and means for supplying a base film having an adhesive applied to one side;
A method for overlapping a base film and a conductive metal strip to transfer a patterned conductor formed on the conductive metal strip to the base film, and pasting an overlay film on the surface of the base film onto which the patterned conductor has been transferred. It is characterized in that it consists of a means to do so.

According to the printed circuit board manufacturing method and printed circuit board manufacturing apparatus according to the present invention, the strength against bending is excellent, and it is suitable for use in parts where bending stress is frequently applied. A printed circuit board having a patterned conductor can be obtained.

Example The details of the present invention will be explained below according to examples.

First, a printed circuit board manufacturing apparatus will be explained.

First, an overview of the printed circuit board manufacturing apparatus of the present invention will be explained with reference to FIGS. 1 and 2.

1 is a plating liquid tank, and above this plating liquid tank 1, a metal band 2 made of stainless steel, steel, etc.
are arranged horizontally. Reference numeral 3 denotes a cathode substantially fixedly disposed above the plating liquid tank l, which is made of, for example, graphite, and the metal band 2 is in sliding contact with the lower surface of the cathode 3 in the direction of the arrow in FIGS. 1 and 2. It is now being moved to .

The metal strip 2 wound around the supply reel 4 is unwound from there and is supplied to the upper part of the plating liquid tank 1 via the guide roll 5. While the metal strip 2 is being moved above the plating solution bath l in sliding contact with the cathode 3 and thus in a carded state, the metal strip 2 is removed in the manner described below. The desired metal, for example copper, is electrolytically deposited on the lower surface.

Note that a plating resist material 6 is applied in advance to the patterned conductor forming surface of the metal strip 2, that is, the surface facing the anode. That is, the plating resist material 6 is attached to the patterned conductor 7.7 -- except for the portions 7', 7', 1. where the fist is to be formed (see FIG. 9). This plating resist material 6 is, for example, of a type that is cured by irradiation with ultraviolet rays, and is applied to the patterned conductor forming surface of the metal strip 2 by means such as screen printing, and is then irradiated with ultraviolet rays to be cured. . In this way, the metal band 2 to which the plating resist material 6 has been applied is plated by the method described later, so that the parts 7', 7', and the metal band 2 to which the plating resist material 6 is not applied are plated.
A plated metal, for example copper, is deposited on the patterned conductor 7.7. ...is formed.

Reference numeral 8 denotes a base film supply reel, and the base film 9 wound on this reel is brought into close contact with the surface of the metal strip 2 on which the patterned conductors 7, 7, . . . I am forced to do it. And this base film 9
passes through the pressure roll 11, guide rolls 12, 12, heat roll 13, and guide roll 12, and is wound onto the take-up reel 14.

A heat-activated adhesive (not shown) is applied to the side of the base film 9 that is brought into contact with the metal strip 2, and a heat roll 15 is applied with the base film 9 and the metal strip 2 overlapped. The adhesive applied to the base film 9 is activated and the patterned conductors 7, 7, . . . formed on the metal strip 2 are bonded to the base film 9. I am forced to do it. Therefore, the metal strip 2 and the base film 9 are separated from each other after passing through the area where the heat roll 15 and the pressure roll 11 are pressed together, so that the patterned conductor 7.7, φ * is torn off from the metal band 2.

Incidentally, at this time, the plating resist material 6 is left on the metal band 2. As shown in FIG.
．． The both side edges 16, 16, O... of 7, . −
The plating resist material 6 is sufficiently compressed by the adhesive layer of the base film 9 compared to the plating resist material 6, and the adhesion strength to the metal strip 2 is higher than that of the patterned conductor 7.7. This is because it is stronger.

Incidentally, after the metal band 2 is entirely wound up on the take-up reel 17, the plating resist material 6 attached to it is then removed.
is removed, a new plating resist material 6 is applied again, the supply reel 4 is wound, and the supply reel 4 is used again.

Reference numeral 18 denotes an overlay film, which is sent out from a supply reel 19 and wound onto a take-up reel 14, and in this process, when passing between heat rolls 13 and 13, the base film 9 is The patterned conductors 7, 7, . . . are brought into close contact with the surface on the pasted side.

Then, the base film 9 of the overlay film 18
A heat-activated adhesive is applied to the side that will be in close contact with the overlay film 18 and the base film 9, so that the overlay film 18 and the base film 9 are heated and pressed between the heat rolls 13 and 13 to form an overlay. The adhesive on film 18 is activated, thereby causing overlay film 1
8 is a patterned conductor 7.7 of the base film 9,...
is adhered to the adhesive side, a continuous flexible printed circuit board 20 is formed here, and this is wound onto the take-up reel 14.

In the manner described above, the flexible printed circuit board 20 is continuously formed.

Reference numeral 21 denotes a pump for circulating the plating solution in the plating solution tank l. This pump 21 is driven by a motor 22 and has a delivery conduit 23 and a return conduit 24. These two conduits 23 and 24 are communicated with each other through the plating liquid tank l.

As can be clearly seen from FIGS. 2 to 4, the cathode 3 is
It has a flat bottom surface 25 positioned horizontally so as to be able to come into sliding contact with the metal strip 2 that is moved underneath. Circular recesses 26, 26, 26 and grooves 27, 27, 27 are suitably arranged in the bottom surface 25 of the cathode 3, and each groove 27, 27, 27 communicates with at least one of the four parts 26. 0 Three circular recesses shown 26.26
．． 26 are directly connected to separate passages 28, 28, 28 formed vertically through the cathode 3. These channels 28,28,28 are connected via conduits 29,29,29 to a vacuum pump 30, which is driven by a motor 31.

Therefore, if the vacuum pump 30 is driven while the metal strip 2 is being supplied to the lower side of the cathode 3, the bottom surface 2 of the cathode 3
26.26 and the groove 27.5.
A partial vacuum state is created at 27.27, and the resulting suction force brings the metal strip 2 into sliding contact with the bottom surface of the cathode 3, resulting in complete electrical continuity between them.

A plurality of insoluble anodes 32, 33, 34 and 35 are held in the plating solution bath 1 in parallel with the cathode 3, and the metal band 2 and each anode 32. 33, 34, and 35, a relatively small interval S is provided between them. These anodes 32.33 and 34.35 are arranged at a predetermined interval in the moving direction of the metal strip 2. and,
The cathode 3 and anode 32,33 are connected by the circuit described below.
．． 35 and 36 are each connected to a power supply.

A block 36 made of an electrically insulating material such as polyvinylidene chloride is interposed between the insoluble anodes 33 and 34, and the upper surface 37 of this insulating block 36 is the same as the upper surface of the anodes 32, 33, 34, 35. It is located on a flat surface. A groove 38 is formed in the upper surface 37 of the insulating block 36 so as to cross the feeding direction of the metal band 2.
This groove 38 is located between the anode 32, 33, 34 or 35 and the metal strip 2 running along the bottom surface of the cathode 3 (
This distance is also equal to the distance between the upper surface 37 of the insulating block 36 and the metal strip 2. ) has a width W that is sufficiently larger than that of the

A hole 39 is formed vertically downward from the center of the groove 38, and is connected to the delivery conduit 23 of the pump 21 via an L-shaped conduit 40. The return conduit 24 of the pump 21 opens into the interior of the plating bath 1 at a portion 41 .

On the downstream side of the anodes 32 and 35 (the side remote from the insulating block 36) there are a number of blocks 42. of an electrically insulating material, for example polyvinylidene chloride, arranged in parallel and at approximately equal distances from the anodes 32 or 35. 42, . is formed.

Furthermore, an upward step 4 is provided in the groove 38 of the insulating block 36.
4.44 is formed, and a plate material 45 made of synthetic resin is fixed to this stepped portion 44.44 at a portion 46 so as to block the middle part of the groove 3B, and this plate material 45 is plated. A large number of small holes 47, 47, which allow liquid to pass through.
・are formed in an array. In addition to forming the shielding plate 45 in this manner, it may be replaced with a mesh-like plate.

48. 48 is an insulating plate, which is interposed between the anodes 32 and 33 and between 34 and 35, whereby each insoluble anode 32, 33, 34, 35 is electrically insulated from each other. .

49 is a sealing band formed from a material such as Teflon (trade name), which projects from the upper end surfaces of both sides of the plating liquid tank 1, and its upper end surface slides into contact with the lower surface of both side edges of the metal band 2. . The lower end of the seal band 49 is slidably received in a groove 50 formed on the upper end surface of both sides of the plating liquid tank l, and the lower end surface of the seal band 49 and the groove 50 are slidably received in the groove 50. A tube 51 made of an elastic material such as polyvinylidene chloride or synthetic rubber is inserted between the bottom and the bottom. Air or other suitable fluid can be taken in and out of this tube 51, thereby elastically moving the sealing band 49 lying on the tube 51 up and down.
Complete watertightness is maintained between the upper end surface and the metal band 2.

In the illustrated embodiment, the anodes 32, 33, 34 .
35 and the insulating block 36 are in close contact with the inner surfaces of both sides of the plating liquid tank 1, the sealing bands 49 are arranged at the upper ends of both sides of the plating liquid tank 1, but the anodes 32, 33.
34, 35 and the upper surfaces of both side edges of the insulating block 36 may be formed with grooves for receiving the seal band 49, and the structure may be similar to that described above. In this case, and when both sides of the insulating block 36 and the inner surface of the tank 1 are not in close contact, the groove 38 of the insulating block 36 needs to be formed inside the part where the groove for receiving the seal band 49 is formed.

52 and 53 are forward power supplies, the power supply 52 is connected to the anodes 32 and 33, and the power supply 53 is connected to the anode 34.
and 35 for supplying plating current, respectively. The positive terminal of one power source 52 is connected to the anode 32 via a changeover switch 54 and to the anode 33 via a changeover switch 55. Further, a ground level terminal of the power source 52 is connected to the cathode 3. The positive terminal of the other power supply 53 is also
It is connected to the anode 34 via a changeover switch 56 and to the anode 35 via a changeover switch 57. In addition, the ground level terminal of the power supply 53 is connected to the cathode 3.
It is connected to the.

58 is a power supply for reverse, and each switch has a separate switch,
Anode 32.33.3 via 9.60.61.62
4.35 is connected.

Therefore, there are anodes 32, 33, 3 in the plating liquid tank 1.
4.35, insulation block 36, 42.42, etc.
- Filled with plating solution to a lower level, for example, to the level indicated by level line 63.

The plating solution pumped by the pump 21 is transferred to the L-shaped conduit 4.
0 and through a passage delimited by an insulating block 36, and is turned at right angles upon hitting the metal strip 2 moving along the bottom surface 25 of the cathode 3. The plating solution exits the relatively wide groove 38 and enters the narrow space between the insulating block 36 and the metal strip 2, and thereby the anode 32, 33, 34, 35 and the metal strip 2 below the cathode 3. It flows turbulently through the space between them.

In the printed circuit board manufacturing apparatus of the present invention, it is preferable that the degree of turbulence of the plating solution flowing over the anode 32, 33, 34, 35 is averaged in a direction transverse to the flow direction of the plating solution. . For this purpose, a distance 11iD from the end of the groove 38 to the joining end with the anode 33.34, measured in the direction of flow of the plating solution, The length is at least five times the distance S between the two. Preferably, the spacing S is in the range of 0.2 to 30 mm, and the degree of turbulence of the plating solution flowing along the anode 32, 33, 34, 35 is preferably a Reynolds number of 2300 or more. .

Next, the operation of the printed circuit board manufacturing apparatus of the present invention will be explained.

For example, when manufacturing a patterned conductor made of copper foil using the above-mentioned printed circuit board manufacturing apparatus, the metal strip 2 made of stainless steel or other metal is moved at a constant speed from the supply reel 4 to the take-up reel 14 and plated. It is fed horizontally over the liquid tank l. The metal strip 2 is conveyed under the cathode 3 while slidingly contacting the flat bottom surface 25 of the cathode 3 by driving the vacuum pump 30 to apply a suction force to the metal strip 2 .

Furthermore, when the pump 21 is driven, a plating solution containing copper sulfate is sent out and raised into the groove 38 of the insulating block 36, and then between the insulating block 36 and the metal band 2 conveyed under the cathode 3. It flows turbulently between the anode 32, 33, 34, 35 and the metal strip 2 below the cathode 3, and then passes there. As described above, the degree of turbulence in the plating solution flowing over each anode 32, 33, 34, 35 is approximately equal across the flow direction. Also, each anode 32.33.34.35
Preferably, the velocity of the turbulent flow flowing thereover is at least about 2 meters/second.

Anodes 32, 33. at a current density suitable for depositing copper on the underside of metal strip 2 which is carried in sliding contact with cathode 3.
A pulsed plating current is supplied through 34 and 35. Note that the details of supplying this plating current will be described later. The plating solution flows in a turbulent manner at a speed of about 2 meters per second or more through a gap of about 0.2 to 30 mm between each anode 32, 33, 34, 35 and the cathodized metal strip 2. This prevents the growth of a copper ion concentration polarized layer in the vicinity of the metal band 2, and as a result, the copper deposition rate can be effectively accelerated.

As described above, the metal strip 2 is fed under the cathode 3, and at the same time a pattern of copper foil is formed on the parts 7', 7', . . . to which the plating resist material 6 is not attached on the surface. Conductor 7.7. ...e are formed continuously. Patterned conductor 7.7, φ... deposited on metal strip 2
is transferred to the base film 9, an overlay film 18 is pasted thereon, and a patterned conductor 7.7, .phi.
・Flexible printed circuit board (FPC) that holds
20 is formed and is wound onto the winding reel 14. In addition, the FPC 20 wound on the take-up reel 14
The material is then rewound from the take-up reel 14, subjected to punching and other necessary processing, and then divided into individual products.

As described above, according to the above-mentioned apparatus, it is possible to manufacture the FPC 20 extremely effectively and continuously, but in order to provide higher quality patterned conductors 7, 7,... , the cathode 3 and the anode 32.33.34.
It is necessary to supply a reverse current in a timely manner between 35 and 35. This will be explained in detail according to FIG.

7(A) shows the anode 32, FIG. 7(B) shows the anode 33, FIG. 7(C) shows the anode 34, and FIG. 7(D) shows the anode 32.
) shows the states of a pulsed plating current and a reverse current applied to the anode 35, respectively, and these figures are arranged so that the time axes can be compared. and,
These currents are controlled by the aforementioned changeover switches 54 and 55.
．． This is done by turning on and off 56, 57, 59, 60, 61 and 62 at the appropriate times.

More specifically, the plating current is supplied to the anodes 32 and 33 by one forward power source 52, and the changeover switches 54 and 55 are alternately turned on, that is, when the changeover switch 54 is on, the plating current is turned off, and when the changeover switch 54 is on, the plating current is turned off. When 55 is off, 55 is on, so that a pulsed plating current is supplied by turning on and off. Anodes 34 and 3
5, a pulsed plating current is similarly supplied from one forward power source 53 via changeover switches 56 and 57 which are alternately turned on and off.

When the plating current is supplied in a pulsed manner using this method, the rise time of the current is shortened, and the plating efficiency and plating quality are improved. That is, considering when the changeover switch 54 is on and the changeover switch 55 is off, the circuit between the anode 33 and the can 13 becomes an equiaxed resistance load between the anode 32 and the cathode 3, and current flows there. The rise time of the current flowing between the anode 33 and the cathode 3 when switched off and 55 on is short. Conversely, the selector switch 54 is turned off,
When the switch 55 is on, the circuit between the anode 32 and the cathode 3 becomes an equiaxed resistance load between the anode 33 and the cathode 3, and current flows there, so when the switch 54 is turned on and the switch 55 is turned off, Anode 32-
The rise time of the current flowing between the can and the can 13 can be shortened. This makes it possible to obtain a rectangular wave current with steep rises and falls.

In addition, as shown in FIG. 8, for each anode A,
A forward power supply B is prepared, and switches s and s' are turned on and off alternately to supply a pulse current. Switch S at the same time as turning on S
A method of shortening the rise time of the t-flow supplied to the anode during off-time may be considered, but this method has the following drawbacks compared to the method shown in the above embodiment.
・ First of all, there is a problem that electric power is wasted while transmitting radio waves to the equiaxed resistance load R, and secondly, the resistance value between the anode and cathode depends on the metal ion concentration of the plating plate. There is a problem in keeping the resistance value of the equiaxial resistance load R fixed because it changes depending on factors such as
It is impossible to make this variable and always keep it at the same value as the anode-cathode resistance value.

On the other hand, according to the method shown in the above embodiment, current is always supplied to one of the anodes of the - group, so there is no waste of power, and furthermore, each anode of the - group Since the conditions between the cathode and the cathode are always the same, the electrical resistance is also the same, and by using this as an equivalent resistance load, extremely appropriate control can be performed.

In the above embodiment, two anodes are set as a set and a pulsed plating current is supplied to them by one forward power supply, but three or more anodes are set as a set. Also good.

Note that the peak value of the pulse current is approximately 10×IO3 amperes or more, and the pulse width is approximately 0.5 to 9.9 milliseconds, but the present invention is not limited thereto.

Therefore, a reverse current is supplied from the reverse power supply 58 via the changeover switch 59, 60, 61, 62 at an appropriate time between the supply of pulsed current to each anode 32, 33, 34, and 35. . The peak value of this reverse current is suitably about 27XIO3 amperes, but of course it is not limited to this.

According to the above-described printed circuit board manufacturing method and printed circuit board manufacturing apparatus, it is possible to obtain a printed circuit board that has excellent bending strength and is suitable for use in areas where bending stress is frequently applied. I can do it.

That is, since the plating current is supplied in a pulsed manner, the metal particles deposited on the conductive metal strip 2 are small, so the deposition density is high, and the FPC is strong against bending and has low electrical resistance. A patterned conductor suitable for use as a conductor can be obtained. Also, since it is a pulse current,
When the plating current is turned off, gases such as H2 and 02 generated on the metal band 12 side and between the deposited metal particles are removed, and the bond strength between each metal particle is strengthened. Removal of these gases is also accomplished by turbulent flow of the plating solution between the anode and cathode, which strengthens the bonds between the deposited metal particles. Furthermore, the flow of the plating solution and the supply of a pulsed plating current suppress the generation of a single polarization layer, and the plating solution at a suitable concentration is always supplied in contact with the metal strip, increasing the plating speed. In addition, a patterned conductor of high quality can be obtained. Furthermore, in order to timely apply a reverse electric field between the anode and the cathode, the patterned conductor 7.7 generated on the metal strip 2... the surface of the metal oxide (for example, Cub) attached thereto is removed. Since the metal ions are activated and metal ions are generated near the metal band 2, it contributes to suppressing the generation of a polarized layer, and this also contributes to increasing the plating speed and plating quality. In addition, since the plating solution is passed between the seven electrodes and a pulse current is supplied, the metal particles 64, 64, φ, etc. deposited on the metal strip 2 are as shown in FIG. As a result, the patterned conductor becomes horizontally elongated or horizontally inclined, and in this point, a patterned conductor that is resistant to bending can be obtained.

Incidentally, although the above-mentioned apparatus allows a continuous patterned conductor to be obtained extremely effectively, in such an apparatus, the plating solution is not disturbed between the anode 32, 33, 34, 35 and the metal strip 2. It is necessary that the metal band 2 flows in a flowing state and that the degree of turbulence thereof is uniform in the direction transverse to the feeding direction of the metal band 2.

Otherwise, there will be parts where the metal is deposited well and parts where the metal is not deposited well in the width direction of the metal strip, degrading the quality of the deposited metal foil. Therefore, in the above embodiment, the plate-like member 45 is placed approximately in the vertical middle position of the groove 38 formed in the insulating block 36, and a large number of small holes 47, 47, fists, etc. are arranged in this plate-like member 45.
By doing this, the plating solution pumped up to the groove 38 temporarily fills the portion of the groove 38 below the shielding plate 45, and is then forcibly sent out from all the small holes 47, 47, . Ru. Therefore, each anode 32.33.
This has the effect that the degree of turbulence of the plating solution flowing between the metal strip 2 and the metal strip 2 becomes more uniform in the direction transverse to the feeding direction of the metal strip 2.

Effects of the Invention As is clear from the above description, the method for manufacturing the printed circuit board of the present invention includes removing a conductive pattern on the side facing the anode of the conductive metal strip that is made into a cathode by contacting the cathode. A plating resist material is applied to the conductive metal strip, a plating solution is flowed between the conductive metal strip and the anode, a pulsed plating current is supplied between the cathode and the anode, and a plating resist material is applied between the cathode and the anode. Supplying a reverse current at a timely manner, thereby depositing and forming a patterned conductor on the conductive metal strip, transferring the patterned conductor to the base film, and pasting an overlay film on the surface of the base film to which the patterned conductor has been transferred. Further, the printed circuit board manufacturing apparatus of the present invention includes: a plating solution tank containing a plating solution; a cathode disposed above the plating solution tank and having a flat surface extending in the horizontal direction;
A conductive metal strip that is made into a cathode by contacting the flat surface of the cathode and has a plating resist material applied to the surface facing the anode except for the conductive pattern, and faces the flat surface of the cathode at an appropriate distance. anode,
means for supplying a plating solution between the conductive metal strip in contact with the cathode and the anode; and means for supplying a pulsed plating current between the cathode and the anode and reversing the direction of the current at a timely manner. A means for supplying a pulsed current that can be used as a base, a means for supplying a base film with an adhesive applied to one surface, and a patterned conductor formed on the conductive metal strip by overlapping the base film and the conductive metal strip. It is characterized by comprising means for transferring onto a film, and means for attaching an overlay film to the surface of the base film onto which the patterned conductor has been transferred.

According to the printed circuit board manufacturing method and printed circuit board manufacturing apparatus according to the present invention, the pattern has excellent bending strength and is suitable for use in areas where bending stress is frequently applied. A printed circuit board with shaped conductors can be obtained.

[Brief explanation of the drawing]

Figures 1 to 6 show an example of the implementation of the printed circuit board manufacturing apparatus of the present invention. Figure 1 is an overall side view with some parts omitted, and Figure 2 is an enlarged view of the plating solution tank. 3 is a sectional view taken along the line 3-3 in FIG. 2, FIG. 4 is a bottom view of the cathode, and FIG. FIG. 6 is an enlarged perspective view showing details of the insulating block, FIG. 7 is a time chart showing the state of the current supplied to the anode in the method of manufacturing a printed circuit board of the present invention, and FIG. 9 is a conceptual diagram showing another example of a current supply means, FIG. 9 is a diagram showing an example of a pattern formed on a conductive metal strip, FIG. 10 is an enlarged sectional view of a state in which a patterned conductor is formed, and FIG. ti diagram is a model diagram showing the state of metal particles deposited on a conductive metal strip, FIG. 12 is a model diagram showing the state of metal deposition by a normal plating method,
FIG. 13 is an enlarged sectional view of the main part to show the problems caused by the etching method. Explanation of symbols 1... Plating liquid tank, 2... Conductive metal strip, 3... Cathode, 6... Plating resist material, 9... Base film, 18... Overlay film, 22. 23.39.40...Means for supplying plating solution. 32.33.34.3511...Anode. 52.53.54.55.56.57.58.59, e
o, st, 62...Pulse current supply means Applicant: Koito Seisakusho Co., Ltd. Representative Patent Attorney Yuji Komatsu

Claims (2)

[Claims] (1) A plating resist material is applied to the side facing the anode of the conductive metal strip that contacts the cathode and becomes a cathode, excluding the conductor pattern, and a plating resist material is applied between the conductive metal strip and the anode. and supplying a pulsed plating current between the cathode and the anode, and supplying a reverse current between the cathode and the anode at appropriate times, thereby depositing a patterned conductor on the conductive metal strip. A method for manufacturing a printed circuit board, comprising: forming a patterned conductor on a base film, transferring the patterned conductor onto a base film, and pasting an overlay film on the surface of the base film to which the patterned conductor has been transferred. (2) a plating solution tank containing a plating solution; a cathode arranged above the plating solution tank and having a flat surface extending in the horizontal direction; A conductive metal strip having a plating resist material applied to opposing surfaces excluding the conductor pattern, an anode facing the plane of the cathode with an appropriate distance therebetween, and a conductive metal strip and anode in contact with the cathode. a means for supplying a plating solution between the cathode and the anode; a pulsed current supplying means capable of supplying a pulsed plating current between the cathode and the anode and reversing the direction of the current in a timely manner; a means for supplying a base film to which an adhesive has been applied; a means for overlapping the base film and a conductive metal strip to transfer a patterned conductor formed on the conductive metal strip to the base film; and a pattern on the base film. and means for attaching an overlay film to the surface onto which the shaped conductor has been transferred.