JPS61149335U - - Google Patents
Info
- Publication number
- JPS61149335U JPS61149335U JP1985032545U JP3254585U JPS61149335U JP S61149335 U JPS61149335 U JP S61149335U JP 1985032545 U JP1985032545 U JP 1985032545U JP 3254585 U JP3254585 U JP 3254585U JP S61149335 U JPS61149335 U JP S61149335U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- solder
- semiconductor pellet
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985032545U JPS61149335U (enExample) | 1985-03-06 | 1985-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985032545U JPS61149335U (enExample) | 1985-03-06 | 1985-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61149335U true JPS61149335U (enExample) | 1986-09-16 |
Family
ID=30534157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985032545U Pending JPS61149335U (enExample) | 1985-03-06 | 1985-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61149335U (enExample) |
-
1985
- 1985-03-06 JP JP1985032545U patent/JPS61149335U/ja active Pending